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GD900 Containing Silver Heat Sink Compound Thermal Grease Past

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

Color Gray Thermal Conductivity >4.8W/M-K

Speciflc Gravity >2.3g/cc Operating Temperature -58~464?

Weight 1g Description Brand New

GD900 thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.

Product features: Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.

Working principle: Filling the gap between heating element and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.

Method of use: It's normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc).

Warm notice: Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth,please flush with clean water or send to hospital when necessary.

Storage: Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity.

CH005203
€6.09

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

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N3050 SR2A9 Stencil Template

N3050 SR2A9 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005204
€6.22

N3050 SR2A9 Stencil Template

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SR2ZV i77500U

SR2ZV i7-7500U

Part Number SR2ZV i7-7500U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005205
€275.69

SR2ZV i7-7500U

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BD82QS57 SLGZV Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005206
€5.72

BD82QS57 SLGZV Stencil Template

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CMT1025 Stainless Steel Welding Soldering Solder Iron Tip Cleaner Wire

Specification :

Material : Stainless steel

Size : 82mm x 30mm

Weight : 90g

Features :

Made of low abrasive brass shavings.

No water necessary.

No temperature drop as in conventional sponges.

Cleans better than conventional sponses.

Benifits :

Won't damage your soldering tips.

No messy wet sponges to dispose of.

Faster working cycle.

Cleaner tip has better heat transfer.

Doesn't rust or slip around the workbench.

Prevents slippage.

Package includes :

1 x CMT-1025 Solder Tip Cleaner

CH005208
€2.70

CMT-1025 Stainless Steel Welding Soldering Solder Iron Tip Cleaner Wire

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HAYEAR 16MP HDMI Industrial Digital Camera USB Microscope Electronic Eyepiece Build in Cross Line TF Card 4K Video Recording

This is mainly a hdmi camera, if you need it get higher image quality for usb output pls choose the professional usb camera or contact us before place the order so we will give you some suggestion.

For USB output, the white balance, exposure and color adjustment are automatic, they can't be adjusted.

Specification:

Image sensor: SONY CMOS 1/2.9

Pexil size: 2.85 2.85m

Video output: full hd 1080p ( via HDMI), 720P( via USB)

Image resolution: 4608*3456( via HDMI)

Video recording: 1080p ( via HDMI )

Image format: jpeg

Lens: C/CS

Resolution:1920*1080@30fos, 720p 160@fps

TF card interface: max 64G

Pc support: windows XP/7/8/10 system, HAYEAR measure software ( gift )

Digital zoom: 4 times digital zoom

Language: English, Chinese, Japanese, French, Germany, Italy, Korean, Turkey, Russia

Camera dimension: 50mm*50mm*43mm

Package dimension:16cm*10cm*8cm / 0.3kg

Package included:

1 x camera with power supply

1 x usb cable

1 x remote control

1 x software CD

CH005209
€93.24

HAYEAR 16MP HDMI Industrial Digital Camera USB Microscope Electronic Eyepiece Build in Cross Line TF Card 4K Video Recording

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Realtek ALC892

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005210
€3.45

Realtek ALC892

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SR2Z5 N4200

SR2Z5 N4200

Part Number SR2Z5 N4200 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005211
€57.44

SR2Z5 N4200

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INTEL PCT25VF032B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005212
€3.45

INTEL PCT25VF032B

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TI TPS51462

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005213
€3.45

TI TPS51462

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

Color Gray Thermal Conductivity >4.8W/M-K

Speciflc Gravity >2.3g/cc Operating Temperature -58~464?

Weight 1g Description Brand New

GD900 thermal paste selects much more tiny particle diameter metal oxide as the main raw materials, used for filling the gap between the heat source and heat sink device. Its outstanding performance on the CPU GPU LED will meet your high standard demand for cooling system.

Product features: Accord with RoHS and REACH environmental protection requirements. High thermal conductivity, high insulation, high temperature resistant, low oil separation, non-corrosive.

Working principle: Filling the gap between heating element and the cooling device; Increasing the contact area so as to achieve the soundest thermal conductivity effect.

Method of use: It's normal phenomena if there is little silicone oil floating above. Please stir well before use. Keep the coated surface clean and apply directly with tools (such as scraper, finger cot, etc).

Warm notice: Keep children away from it. If it is swallowed or inadvertently come into eyes, ear, nose, mouth,please flush with clean water or send to hospital when necessary.

Storage: Preservation at normal temperature. Please cover it after used, avoiding impurities such as dust, that have a bad effect on thermal conductivity.

CH005203
€6.09

GD900 Containing Silver Heat Sink Compound Thermal Grease Past

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Compare

N3050 SR2A9 Stencil Template

N3050 SR2A9 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005204
€6.22

N3050 SR2A9 Stencil Template

wishlist
Compare

SR2ZV i77500U

SR2ZV i7-7500U

Part Number SR2ZV i7-7500U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005205
€275.69

SR2ZV i7-7500U

wishlist
Compare

BD82QS57 SLGZV Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005206
€5.72

BD82QS57 SLGZV Stencil Template

wishlist
Compare

CMT1025 Stainless Steel Welding Soldering Solder Iron Tip Cleaner Wire

Specification :

Material : Stainless steel

Size : 82mm x 30mm

Weight : 90g

Features :

Made of low abrasive brass shavings.

No water necessary.

No temperature drop as in conventional sponges.

Cleans better than conventional sponses.

Benifits :

Won't damage your soldering tips.

No messy wet sponges to dispose of.

Faster working cycle.

Cleaner tip has better heat transfer.

Doesn't rust or slip around the workbench.

Prevents slippage.

Package includes :

1 x CMT-1025 Solder Tip Cleaner

CH005208
€2.70

CMT-1025 Stainless Steel Welding Soldering Solder Iron Tip Cleaner Wire

wishlist
Compare

HAYEAR 16MP HDMI Industrial Digital Camera USB Microscope Electronic Eyepiece Build in Cross Line TF Card 4K Video Recording

This is mainly a hdmi camera, if you need it get higher image quality for usb output pls choose the professional usb camera or contact us before place the order so we will give you some suggestion.

For USB output, the white balance, exposure and color adjustment are automatic, they can't be adjusted.

Specification:

Image sensor: SONY CMOS 1/2.9

Pexil size: 2.85 2.85m

Video output: full hd 1080p ( via HDMI), 720P( via USB)

Image resolution: 4608*3456( via HDMI)

Video recording: 1080p ( via HDMI )

Image format: jpeg

Lens: C/CS

Resolution:1920*1080@30fos, 720p 160@fps

TF card interface: max 64G

Pc support: windows XP/7/8/10 system, HAYEAR measure software ( gift )

Digital zoom: 4 times digital zoom

Language: English, Chinese, Japanese, French, Germany, Italy, Korean, Turkey, Russia

Camera dimension: 50mm*50mm*43mm

Package dimension:16cm*10cm*8cm / 0.3kg

Package included:

1 x camera with power supply

1 x usb cable

1 x remote control

1 x software CD

CH005209
€93.24

HAYEAR 16MP HDMI Industrial Digital Camera USB Microscope Electronic Eyepiece Build in Cross Line TF Card 4K Video Recording

wishlist
Compare

Realtek ALC892

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005210
€3.45

Realtek ALC892

wishlist
Compare

SR2Z5 N4200

SR2Z5 N4200

Part Number SR2Z5 N4200 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005211
€57.44

SR2Z5 N4200

wishlist
Compare

INTEL PCT25VF032B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005212
€3.45

INTEL PCT25VF032B

wishlist
Compare

TI TPS51462

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005213
€3.45

TI TPS51462

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Compare
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