Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: * Device List

CH2016 Multifunctional 1 Drag 2 High Speed Burner

Offline or online, and TF memory card slot!

A mini portable burner for offline burning and copying!

FN multi-menu keys, can customize the burning operation steps, can set the save burning project, can get files from TF memory card burning, can immediately save the master card data into TF memory card, can set the body language, can set screen brightness, can set buzzer, can set screen saver time, boot time, etc.

Support device updates!

Support for 2425 93 EEPRM

Support SPI FLASH

Supporting AVR MCU

Support DATA FLASH

XELTEK SuperPro 6100N (so not 6100)Universal Programmer 100,000+ devices supported

Login to Download: Download software

SuperPro 6100N is a cost-effective, reliable, and high-speed universal chip programmer. It is designed to communicate using USB 2.0 port for development requirement and can also work in standalone mode (without connecting to a PC) for production requirement. It has the largest device support count in the programming industry with 144 pin drivers to support high pin count chips.

Application and target customers: Programming houses, electronic repair, car repair shops, forensic and data recovery companies, medical devices, requirement for larger device support.

Advantages of SuperPro 6100N

Ultra Fast Programming Speed SuperPro 6100 is designed with high programming speed in mind. Our semiconductor manufacturer approved algorithms, precision and clean signals guarantee high programming yield. Special design was made to eliminate overshoot and ground bounce. Algorithms are performed with state machine architecture constructed with FPGA to achieve a ultra-high programming speed.

Largest Device Support Located in Silicon Valley, we keep good relationships with many major IC companies that are important for us to continuously support new devices. SuperPro 6100 currently supports more than 100,000 devices, which is the largest device library in the programming industry. Requested device algorithms can be added within a week - average lead time from other manufacturers is over two months.

Built-in 144 Pin Driver Most universal IC programmers are designed with 48 pin driver or less. Programmers with a 48 pin driver design need special adapters (pin mapping) to accommodate devices with more than 48 pins. Bottom boards needed for pin mapping can quickly increase production costs just to support one package type. SuperPro 6100N is equipped with a built-in universal 144 pin driver to accommodate large pin count devices. One universal adapter accommodates all devices with the same package type.

Stand-Alone Mode Unlike many other universal programmers in the industry, SuperPro 6100N is capable of operating in stand-alone mode. Under stand-alone mode, SuperPro 6100 can be operated by an inexperienced operator with minimal training. Once the project file is selected, the operator only has to insert a blank chip and remove the programmed chip upon beeping. This ensures a minimal chance that an operator will make a mistake. Users can also use clusters of stand-alone programmers to achieve high volume production. Last but not the least, stand-alone mode saves both the cost of PC and labor of the trained and qualified operator.

Tester for Logic Devices and SRAMs In addition to having a large device library, SuperPro 6100 programmer is also designed for IC testing of varioudevices such as TTL, CMOS Logic (74/4000 series), and SRAM memory devices.

Hardware and Electrical Specifications

Devices supported

EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU

Package types supported

DIP, SDIP, PLCC, JLCC, PGA, LGA, SOIC, SOJ, SOT, QFP, TQFP, PQFP, VQFP, MQFP, LQFP, TSOP, SOP, TSOPII, PSOP, SSOP, TSSOP, SON, EBGA, FBGA, FTBGA, VFBGA, BGA, CSP, SCSP, QFN, HVQFN etc.

PC interface

USB 2.0

Stand-alone memory

Compact FLASH Card

Power supply

AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

Dimensions

Main unit: 148(L) x 216(W) x 94(H) mm

Package: 301(L) x 252(W) x 145(H) mm

Weight

Main unit: Weight 3.5 lbs (1.6 Kg)

Package: Weight 6.2 lbs (2.8Kg)

Expanded Features

Operate multiple units to construct a concurrent multi-programming system. Cluster 1-15 units for flexible volume production.

Support devices with Vcc from 1.2V - 5V.

Support files up to 256 GB.

Over-current and over-voltage protection for safety of the chip and programmer hardware.

Only IC manufacturer approved programming algorithms used for high reliability.

Vcc verification (at +5% ~ -5% and +10% ~ -10%) enhances programming reliability.

Ac Acessories:

Main unit with a DIP48 adaptor, AC adaptor, USB2.0 cable, user manual, software CD, register card

Optional accessories: adaptor in varies packages, CF card for stand-alone operation.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * DX0001 Adapter

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * SOP16-DIP16 (300mil) Adaptador

1 * SOP20-DIP20 (300mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP20-DIP20 (170mil) Adaptador

1 * TSSOP24-DIP24 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SSOP20-DIP20 (220mil) Adaptador

1 * SSOP28-DIP28 (220mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adaptador

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adaptador

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adaptador

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adaptador

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adaptador

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adaptador

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SQU OF68 universal car emulator supports IMMO/Seat occupancy sensor/Tacho Programs

SQU OF68 Universal Car Emulator Mini Parts Big Works

The SQU OF68 universal car emulator allows you to do:

Move the original immobiliser signal

Place the original immobiliser signal

Place the ESL, enable the car to start

ECK the EZS on the table

ECK the correctness of the airbag system

Art the tacho on the table

The SQU OF68 emulator comes with 68 programs that are dedicated to hundreds of car models and types of ECU.

You are allowed to choose from any of folllowing program:

1. Immo programs

2. Seat occupancy sensor programs

3. Tacho programs

The vast majority of programs can be used multiple times.

Program selection is effected by soldering jumpers from J1 to J7. To connect the emulator, please refer to specific installation manual.

Immo Programs:

1. VW automatic immo OFF (single use)

2. VW automatic immo ON (single use)

3. VW without CAN

4. VW - Hitachi

5. VW - Valve Code

6. VW EDC15 immo OFF (single use)

7. VW EDC15 immo ON (single use)

8. VW EDC16 K-LINE immo OFF (single use)

9. VW EDC16 K-LINE immo ON (single use)

10. VW EDC16 with CAN 1.9 2.0 TDI immo OFF (single use)

11. VW EDC16 with CAN 1.9 2.0 TDI immo ON (single use)

12. VW EDC16 with CAN 2.7 3.0 TDI immo OFF (single use)

13. VW EDC16 with CAN 2.7 3.0 TDI immo ON (single use)

14. VW ME7 immo OFF (single use)

15. VW ME7 immo ON (single use)

16. BMW EWS II and EWS III 3.2 systems

17. Chrysler

18. Citroen, Peugeot with CAN

19. Daewoo 1

20. Daewoo 2

21. Fiat without CAN

22. Fiat with CAN

23. FSO Polonez

24. Honda

25. Kia Sportage 2.0TD

26. Mercedes CR without CAN Infrared

27. Mercedes CR1 with CAN WSP

28. Mercedes CR1 with CAN EZS

29. Mercedes CR1 with CAN infrared

30. Mercedes CR2 with CAN WSP

31. Mercedes ESL - steering wheel column lock emulator

32. Mercedes ESL2 - steering wheel column lock emulator

33. Nissan NATS 4 and 5 32.

34. Opel immo with HC05

35. Renault with CAN

36. Renault without CAN

37. Renault without CAN old ECUs

38. Suzuki with X24C01 memory

39. Suzuki with OKI memory

40. Suzuki 93C56 memory

41. TMS 374 - Citroen, Peugeot, Renault

42. Yamaha

Seat Occupancy Sensor Programs:

1: BMW Europe from 2007 to 2010 Models: E60, E63, E64, E65, E70, E71, E81, E90, E92, E93 without installed child seat

2: Mercedes: E-class W211 from 2002 to 2004 with Temic airbag controller, S-class W220 from 2003 to 2005 without installed child seat

3: Mercedes: E-class W211 from 2002 to 2004 with Temic airbag controller, S-class W220 from 2003 to 2005 with installed child seat

4: Mercedes: A-class W168 from 1997 to 2001, C-class W202 from 1999 to 2001, Vito W638 up to 2003, ML 1999 with TRW airbag controller, E-class W210 up to 1999, before lifting with airbag OFF indicator without installed child seat

5: Mercedes: A-class W168 from 1997 to 2001-class W168, C-class W202 from 1999 to 2001, Vito W638 up to 2003, ML 1999 with TRW airbag controller, E-class W210 up to 1999, before lifting with airbag OFF indicator with installed child seat

6: Mercedes: E-class W210 from 1999 to 2003 with airbag OFF indicator after lifting, Vito W639 from 2002 to 2005, ML W163 from the year 2000, A-class W168 from 2002 to 2005, S-class W220 from 2000 to 2003, C-class W203 up to 2005, CLK W209, Vaneo without installed child seat

7: Mercedes: E-class W210 from 1999 to 2003 with airbag OFF indicator after lifting, Vito W639 from 2002 to 2005, ML W163 from the year 2000, A-class W168 from 2002 to 2005, S-class W220 from 2000 to 2003, C-class W203 up to 2005, CLK W209, Vaneo with installed child seat

8: BMW from 1997 to 2007 , Models from 1997 to 2003: E31, E36, E38, E39, E46, E53

Models from 2003 to 2007: E60, E63, E65, E87, E90 . without installed child seat

9: BMW from 1997 to 2007. Models from 1997 to 2003: E31, E36, E38, E39, E46, E53

Models from 2003 to 2007: E60, E63, E65, E87, E90 . with installed child seat

10: Mini Cooper from 2002 to 2005 without installed child seat

11: Mini Cooper from 2002 to 2005 with installed child seat

12: Mazda: Premacy, MX-5, 626, 323, 6 without installed child seat

13: Mazda: Premacy, MX-5, 626, 323, 6 with installed child seat

Tacho Programs:

1. Audi Q7 and A6

2. Citroen C4 Picasso

3. EMF Display

4. Renault Kangoo 3 Display

5. Renault Scenc II, Espace IV Tacho

6. Renault Scenic Full

7. Renault Scenic III + Navi

8. VW Passat B6

Package:

1pc x SQU OF68 Universal Car Emulator

1pc x CD for user manuel

DX3057-8 Adapter for XELTEK SuperPro 6100N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

PIC Microcontroller K150 Automatic USB Programming Programmer ICSP Cable

Support PIC single chip model

10 Series:

PIC10F200* PIC10F202* PIC10F204* PIC10F206*

PIC10F220* PIC10F222*

12C Series:

PIC12C508 PIC12C508A PIC12C509 PIC12C509A

PIC12C671 PIC12C672 PIC12CE518 PIC12CE519

PIC12CE673 PIC12CE674

12F Series:

PIC12F508 PIC12F509 PIC12F629 PIC12F635

PIC12F675 PIC12F683

16C Series:

PIC16C505 PIC16C554 PIC16C558 PIC16C61

PIC16C62 PIC16C62A PIC16C62B PIC16C63

PIC16C63A PIC 16C64 PIC16C64A PIC16C65

PIC16C65A PIC16C65B PIC16C66 PIC16C66A

PIC16C67 PIC16C620 PIC16C620A PIC16C621

PIC16C621A PIC16C622 PIC16C622A PIC16C71

PIC16C71A PIC16C72 PIC16C72A PIC16C73

PIC16C73A PIC16C73B PIC16C74 PIC16C74A

PIC16C74B PIC16C76 PIC16C77 PIC16C710

PIC16C711 PIC16C712 PIC16C716 PIC16C745

PIC16C765 PIC16C773 PIC16C774 PIC16C83

PIC16C84

16F Series:

PIC16F505 PIC16F506 PIC16F54 PIC16F57*

PIC16F59* PIC16F627 PIC16LF627A PIC16F627A

PIC16F628 PIC16LF628A PIC16F628A PIC16F630

PIC16F631 PIC16F631-1 PIC16F636 PIC16F636-1

PIC16F639* PIC16F639-1* PIC16F648A PIC16F676

PIC16F677 PIC16F677-1 PIC16F684 PIC16F685*

PIC16F685-1* PIC16F687* PIC16F687*-1 PIC16F688

PIC16F689* PIC16F689-1* PIC16F690* PIC16F690-1*

PIC16F716 PIC16F72 PIC16F73 PIC16F74

PIC16F76 PIC16F77 PIC16F737 PIC16F747

PIC16F767 PIC16F777 PIC16F83 PIC16F84

PIC16F84A PIC16F87 PIC16F88 PIC16F818

PIC16F819 PIC16F870 PIC16F871 PIC16F872

PIC16F873 PIC16F873A PIC16LF873A PIC16F874

PIC16F874A PIC16F876 PIC16F876A PIC16F877

PIC16F877A

18 Series:

PIC18F242 PIC18F248 PIC18F252 PIC18F258 PIC18F442 PIC18F448

PIC18F452 PIC18F458 PIC18F1220 PIC18F1320 PIC18F2220 PIC18F2320

PIC18F2321 PIC18F4210 PIC18F2331 PIC18F2450 PIC18F2455 PIC18F2480

PIC18F2510 PIC18F2515 PIC18F2520 PIC18F2525 PIC18F2550 PIC18F2580

PIC18F2585 PIC18F2610 PIC18F2620 PIC18F2680 PIC18F4220 PIC18F4320

PIC18F6525 PIC18F6621 PIC18F8525 PIC18F8621 PIC18F2331 PIC18F2431

PIC18F4331 PIC18F4431 PIC18F2455 PIC18F2550 PIC18F4455 PIC18F4550

PIC18F4580 PIC18F2580 PIC18F2420 PIC18F2520 PIC18F2620 PIC18F6520

PIC18F6620 PIC18F6720 PIC18F6585 PIC18F6680 PIC18F8585 PIC18F8680

??

Description

Features:

1.Automatic programming verification.

2.No external power supply, communication and power is only a USB cable to print complete, without any cable.

3.Support the most popular programming PIC chips, read, encryption and other features!

4.PICSTARTPLUS much faster rate than programming.

5.Can easily read the contents of the chip program area.

6.Comprehensive information prompts, allowing users to understand the working state.

7.With 40pin ZIF programming of the seat, can be directly programmed in 8-pin to 40 pin PIC microcontroller chip can be programmed using ICSP online or add conversion blocks.

8.8 pin 40 pin-board outside the chip can be downloaded directly online ICSP output.

9.Programming software provides easy to use instructions.

10.Compatible with Windows98 and Windows2000/NT, Windows XP / Windows 7 and other operating systems.

K150 Automatic USB Programming ICSP Cable

Product Details:

Product Dimensions: 5 x 1 x 4.2 inches

Item Weight: 3.2 ounces

Package include:

1x Programmer

1x USB Cable

1x ICSP Cable

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

TSOP56/48/40/32 Adapter For XGecu T56 Programmer

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock