• Show Sidebar

There are 5080 products.

Active filters

  • Availability: In stock
  • Availability: Not available
  • Brand: Chipsetpro.com
wishlist
Compare
Quickview

N10MLP2SA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005242
€5.40

N10M-LP2-S-A2 Stencil Template

wishlist
Compare
Quickview

RICHTEK RT8207L EF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005244
€3.45

RICHTEK RT8207L (EF=)

wishlist
Compare
Quickview

Maxim MAX1587A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005245
€3.45

Maxim MAX1587A

wishlist
Compare
Quickview

GM204600KABA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005246
€6.22

GM204-600-KAB-A1 Stencil Template

wishlist
Compare
Quickview

218S2EBNA46 IXP150

218S2EBNA46 IXP150

Part Number 218S2EBNA46 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 04+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005247
€8.71

218S2EBNA46 IXP150

wishlist
Compare
Quickview

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005248
€9.96

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template 90*90

wishlist
Compare
Quickview

Realtek RTS5159

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005249
€3.45

Realtek RTS5159

wishlist
Compare
Quickview

XELTEK SuperPro 610P Universal Programmer with 28 adapters plus EDID

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adapter

1 * SOP16-DIP16 (300mil) Adapter

1 * SOP20-DIP20 (300mil) Adapter

1 * SOP28-DIP28 (300mil) Adapter

1 * TSSOP16-DIP16 (170mil) Adapter

1 * TSSOP20-DIP20 (170mil) Adapter

1 * TSSOP24-DIP24 (170mil) Adapter

1 * TSSOP28-DIP28 (170mil) Adapter

1 * SSOP20-DIP20 (220mil) Adapter

1 * SSOP28-DIP28 (220mil) Adapter

1 * SSOP34-DIP34 (220mil) Adapter

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adapter

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adapter

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adapter

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adapter

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adapter

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adapter

1 * QFN8 WSON8 Simple Adapter

1 * SOP16/8-DIP8 REV4 Simple Adapter

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adapter

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adapter

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH005250
€520.00

XELTEK SuperPro 610P Universal Programmer with 28 Adapter EDID code

wishlist
Compare
Quickview

LE82P31 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005251
€5.40

LE82P31 Stencil Template

wishlist
Compare
Quickview

SOP16 DIP8 REV3 Board

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
€2.70

SOP16/8-DIP8 REV3 Board

N10MLP2SA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005242
€5.40

N10M-LP2-S-A2 Stencil Template

wishlist
Compare

RICHTEK RT8207L EF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005244
€3.45

RICHTEK RT8207L (EF=)

wishlist
Compare

Maxim MAX1587A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005245
€3.45

Maxim MAX1587A

wishlist
Compare

GM204600KABA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005246
€6.22

GM204-600-KAB-A1 Stencil Template

wishlist
Compare

218S2EBNA46 IXP150

218S2EBNA46 IXP150

Part Number 218S2EBNA46 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 04+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005247
€8.71

218S2EBNA46 IXP150

wishlist
Compare

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005248
€9.96

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template 90*90

wishlist
Compare

Realtek RTS5159

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005249
€3.45

Realtek RTS5159

wishlist
Compare

XELTEK SuperPro 610P Universal Programmer with 28 adapters plus EDID

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adapter

1 * SOP16-DIP16 (300mil) Adapter

1 * SOP20-DIP20 (300mil) Adapter

1 * SOP28-DIP28 (300mil) Adapter

1 * TSSOP16-DIP16 (170mil) Adapter

1 * TSSOP20-DIP20 (170mil) Adapter

1 * TSSOP24-DIP24 (170mil) Adapter

1 * TSSOP28-DIP28 (170mil) Adapter

1 * SSOP20-DIP20 (220mil) Adapter

1 * SSOP28-DIP28 (220mil) Adapter

1 * SSOP34-DIP34 (220mil) Adapter

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adapter

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adapter

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adapter

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adapter

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adapter

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adapter

1 * QFN8 WSON8 Simple Adapter

1 * SOP16/8-DIP8 REV4 Simple Adapter

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adapter

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adapter

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH005250
€520.00

XELTEK SuperPro 610P Universal Programmer with 28 Adapter EDID code

wishlist
Compare

LE82P31 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005251
€5.40

LE82P31 Stencil Template

wishlist
Compare

SOP16 DIP8 REV3 Board

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
€2.70

SOP16/8-DIP8 REV3 Board

wishlist
Compare
Back to top