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  • Categories: CPU and Graphic Chips
  • Categories: Pin Holder
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GFGO7600NA2

GF-GO7600-N-A2

Part Number GF-GO7600-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002692
€24.62

GF-GO7600-N-A2

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2160811000 HD6770

216-0811000 HD6770

Part Number 216-0811000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 18+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002696
€101.00

216-0811000 HD6770

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BD82B75 SLJ85

BD82B75 SLJ85

Part Number BD82B75 SLJ85 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002702
€32.82

BD82B75 SLJ85

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216MGAKC13FG X2500

216MGAKC13FG X2500

Part Number 216MGAKC13FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 06+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002705
€18.81

216MGAKC13FG X2500

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Newest Serial Suite Piasini Engineering V43 Master Version With USB Dongle

Newest Serial Suite Piasini Engineering V4.3 Master Version With USB Dongle

Top 3 reasons to get Serial suite Piasini Engineering V4.3 Master Version:

1. Latest Firmware version: V4.3

2. With usb dongle, software no need active, directly use.

3. It is Master version, support full dump file read and write, support more vehicle list than V4.1.

Notice:

1. Software language: English

2. Windows XP System

Serial suite Piasini Engineering V4.3 Master Version Features:

* JTAG - BDM - K-line - L-line - RS232 - CAN-Bus

* Read/Write Programmer

* Checksum Correction Incorporated for Mitsubishi/Denso/Hitachi

* Server On-line Updates and Security Survey

* New ECU Implementation Free of Charge

Serial suite Piasini Engineering V4.3 Master Version Supported Car List:

Denso-Mitsubishi

Denso-Nissan

Denso-Suzuki

Denso-Jaguar

Hitachi-Nissan

Keihi-Honda

EFI-Lotus

EFI-Lamborghini

Serial suite Piasini Engineering V4.3 Master Version Supported Motorcycles List:

Denso-Suzuki

Denso-kawasaki

Mitsubishi-Yamaha

Keihi-Honda

Simens-Renault

Denso-Subaru

Mitsubishi

Mitsubishi-Mazda

Denso-Volvo

Denso-Mazda

Denso-Reanault

Transtron

Denso-Opel

Mitsubishi-Opel

Toolbox Serial

Toolbox C16x

Serial suite Piasini Engineering V4.3 Master Version Screen Display:

Packing List:

1pc * Software Piasiniengineering Suite

1pc * USB Cable

1pc * Power Supply 110-220V/13.5V

1pc * Dongle protection

1pc * OBD Cable Standard

8pc * General Purposes Cable

CH004055
€84.54

Newest Serial Suite Piasini Engineering V4.3 Master Version With USB Dongle

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G86920A2

G86-920-A2

Part Number G86-920-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002712
€15.59

G86-920-A2

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N13MGE2AIOA1

N13M-GE2-AIO-A1

Part Number N13M-GE2-AIO-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002714
€31.15

N13M-GE2-AIO-A1

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G96635C1 9600MGT

G96-635-C1 9600MGT

Part Number G96-635-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002725
€30.03

G96-635-C1 9600MGT

GFGO7600NA2

GF-GO7600-N-A2

Part Number GF-GO7600-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002692
€24.62

GF-GO7600-N-A2

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2160811000 HD6770

216-0811000 HD6770

Part Number 216-0811000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 18+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002696
€101.00

216-0811000 HD6770

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BD82B75 SLJ85

BD82B75 SLJ85

Part Number BD82B75 SLJ85 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002702
€32.82

BD82B75 SLJ85

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216MGAKC13FG X2500

216MGAKC13FG X2500

Part Number 216MGAKC13FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 06+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002705
€18.81

216MGAKC13FG X2500

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Newest Serial Suite Piasini Engineering V43 Master Version With USB Dongle

Newest Serial Suite Piasini Engineering V4.3 Master Version With USB Dongle

Top 3 reasons to get Serial suite Piasini Engineering V4.3 Master Version:

1. Latest Firmware version: V4.3

2. With usb dongle, software no need active, directly use.

3. It is Master version, support full dump file read and write, support more vehicle list than V4.1.

Notice:

1. Software language: English

2. Windows XP System

Serial suite Piasini Engineering V4.3 Master Version Features:

* JTAG - BDM - K-line - L-line - RS232 - CAN-Bus

* Read/Write Programmer

* Checksum Correction Incorporated for Mitsubishi/Denso/Hitachi

* Server On-line Updates and Security Survey

* New ECU Implementation Free of Charge

Serial suite Piasini Engineering V4.3 Master Version Supported Car List:

Denso-Mitsubishi

Denso-Nissan

Denso-Suzuki

Denso-Jaguar

Hitachi-Nissan

Keihi-Honda

EFI-Lotus

EFI-Lamborghini

Serial suite Piasini Engineering V4.3 Master Version Supported Motorcycles List:

Denso-Suzuki

Denso-kawasaki

Mitsubishi-Yamaha

Keihi-Honda

Simens-Renault

Denso-Subaru

Mitsubishi

Mitsubishi-Mazda

Denso-Volvo

Denso-Mazda

Denso-Reanault

Transtron

Denso-Opel

Mitsubishi-Opel

Toolbox Serial

Toolbox C16x

Serial suite Piasini Engineering V4.3 Master Version Screen Display:

Packing List:

1pc * Software Piasiniengineering Suite

1pc * USB Cable

1pc * Power Supply 110-220V/13.5V

1pc * Dongle protection

1pc * OBD Cable Standard

8pc * General Purposes Cable

CH004055
€84.54

Newest Serial Suite Piasini Engineering V4.3 Master Version With USB Dongle

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Compare

G86920A2

G86-920-A2

Part Number G86-920-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002712
€15.59

G86-920-A2

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N13MGE2AIOA1

N13M-GE2-AIO-A1

Part Number N13M-GE2-AIO-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002714
€31.15

N13M-GE2-AIO-A1

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G96635C1 9600MGT

G96-635-C1 9600MGT

Part Number G96-635-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002725
€30.03

G96-635-C1 9600MGT

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