N11P-GV2H-A3 GT320M

Part Number N11P-GV2H-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1148

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

XELTEK SuperPro 6100N (so not 6100)Universal Programmer 100,000+ devices supported

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SuperPro 6100N is a cost-effective, reliable, and high-speed universal chip programmer. It is designed to communicate using USB 2.0 port for development requirement and can also work in standalone mode (without connecting to a PC) for production requirement. It has the largest device support count in the programming industry with 144 pin drivers to support high pin count chips.

Application and target customers: Programming houses, electronic repair, car repair shops, forensic and data recovery companies, medical devices, requirement for larger device support.

Advantages of SuperPro 6100N

Ultra Fast Programming Speed SuperPro 6100 is designed with high programming speed in mind. Our semiconductor manufacturer approved algorithms, precision and clean signals guarantee high programming yield. Special design was made to eliminate overshoot and ground bounce. Algorithms are performed with state machine architecture constructed with FPGA to achieve a ultra-high programming speed.

Largest Device Support Located in Silicon Valley, we keep good relationships with many major IC companies that are important for us to continuously support new devices. SuperPro 6100 currently supports more than 100,000 devices, which is the largest device library in the programming industry. Requested device algorithms can be added within a week - average lead time from other manufacturers is over two months.

Built-in 144 Pin Driver Most universal IC programmers are designed with 48 pin driver or less. Programmers with a 48 pin driver design need special adapters (pin mapping) to accommodate devices with more than 48 pins. Bottom boards needed for pin mapping can quickly increase production costs just to support one package type. SuperPro 6100N is equipped with a built-in universal 144 pin driver to accommodate large pin count devices. One universal adapter accommodates all devices with the same package type.

Stand-Alone Mode Unlike many other universal programmers in the industry, SuperPro 6100N is capable of operating in stand-alone mode. Under stand-alone mode, SuperPro 6100 can be operated by an inexperienced operator with minimal training. Once the project file is selected, the operator only has to insert a blank chip and remove the programmed chip upon beeping. This ensures a minimal chance that an operator will make a mistake. Users can also use clusters of stand-alone programmers to achieve high volume production. Last but not the least, stand-alone mode saves both the cost of PC and labor of the trained and qualified operator.

Tester for Logic Devices and SRAMs In addition to having a large device library, SuperPro 6100 programmer is also designed for IC testing of varioudevices such as TTL, CMOS Logic (74/4000 series), and SRAM memory devices.

Hardware and Electrical Specifications

Devices supported

EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU

Package types supported

DIP, SDIP, PLCC, JLCC, PGA, LGA, SOIC, SOJ, SOT, QFP, TQFP, PQFP, VQFP, MQFP, LQFP, TSOP, SOP, TSOPII, PSOP, SSOP, TSSOP, SON, EBGA, FBGA, FTBGA, VFBGA, BGA, CSP, SCSP, QFN, HVQFN etc.

PC interface

USB 2.0

Stand-alone memory

Compact FLASH Card

Power supply

AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

Dimensions

Main unit: 148(L) x 216(W) x 94(H) mm

Package: 301(L) x 252(W) x 145(H) mm

Weight

Main unit: Weight 3.5 lbs (1.6 Kg)

Package: Weight 6.2 lbs (2.8Kg)

Expanded Features

Operate multiple units to construct a concurrent multi-programming system. Cluster 1-15 units for flexible volume production.

Support devices with Vcc from 1.2V - 5V.

Support files up to 256 GB.

Over-current and over-voltage protection for safety of the chip and programmer hardware.

Only IC manufacturer approved programming algorithms used for high reliability.

Vcc verification (at +5% ~ -5% and +10% ~ -10%) enhances programming reliability.

Ac Acessories:

Main unit with a DIP48 adaptor, AC adaptor, USB2.0 cable, user manual, software CD, register card

Optional accessories: adaptor in varies packages, CF card for stand-alone operation.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * DX0001 Adapter

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * PLCC44-DIP44 2.54mm (1060mil) Adaptador

1 * PLCC32-DIP32 2.54mm Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 (150mil) Adaptador

1 * SOP16-DIP16 (150mil) Adaptador

1 * Double SOP8-DIP16 (208mil) Adaptador

1 * SOP20-DIP20 (200mil) Adaptador

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adaptador

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

MCP79U-B3

Part Number MCP79U-B3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 08+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SA638 Adapter PSOP44/D44 for XELTEK SuperPro 610P 611S

N15V-GM-B-A2

Part Number N15V-GM-B-A2 (GF117-760-A2) Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1416

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LATTICE USB ISP Download Software

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Product specification:

1. Lattice original design solution quality guarantee, ensure compatibility stability.

2. There is no need to install the driver separately, directly support Diamond/ispLever6.x/7.x/classic version, ispVM various versions.

3. Support lattice full range of FPGAs, such as SC/SCM/XP/XP2/EC/ECP2/ECP2M/MachXO/MachXO2 series.

4. Support lattice full range of CPLD, such as 1000/2000/4000 series.

5. USB standard interface, using a standard USB cable to connect to a PC.

6. USB power supply, no external power supply support.

7, interface part of the power from the target board to ensure strong compatibility!

8. Support JTAG, internal FLASH, SPI FLASH and other programming modes.

9. Support WIN 2K, WIN XP, WIN7 32, WIN7 64 and other operating systems.

10, support for LSC ISPVM, LATTICE DEMIOND, LATTICE ISPEVER, and LATTICE PROGRAMMER, all these LATTICE development environments, and have actually been tested!

Pin link description:

(1) SCLK/TCK is connected to the chip's SCLK/TCK pin.

(2) GND The public ground of the downloader and the target board is connected to the internal 2 and 4 pins. When it is used, one of the feet 2 and 4 needs to be connected to the ground of the target board.

(3) MODE/TMS is connected to the MODE/TMS pin of the chip.

(4) The GND downloader is also a common ground of the target board, and its internal 2 and 4 pins are connected. In use, it is necessary to connect one of the feet 2 and 4 to the ground of the target board.

(5) SDI/TDI is connected to the chip's SDI/TDI pin.

(6). VCC is used to detect whether the target board connected to the downloader is powered on. It is not used to power the target board. The official downloader does not have the ability to supply power to the target board. This needs attention.

(7) SDO/TDO is connected to the SDO/TDO pin of the chip.

(8), INTI Need to connect this pin when downloading and debugging some chips, not every chip needs to be connected.

(9) TRST It is necessary to connect this pin when downloading and debugging certain chips. Not every chip needs to be connected.

(10) PROG/ispEN needs to connect this pin when downloading and debugging certain chips. Not every chip needs to be connected.

Shipping list:

1. LATTICE USB download line body.

2. USB 2.0 high-speed link line.

3. 10pin 2.54MM pitch JTAG connection.

4. 10 with a single share of DuPont.

BD82HM67 SLJ4N

Part Number BD82HM67 SLJ4N Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1136

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

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Product Description

The ELM327 Bluetooth OBDII scanner is an engine performance and diagnostics tool for both automotive enthusiasts and professionals. Paired with your Android smartphone or tablet, the ELM327 Bluetooth allows you to easily scan and clear engine codes, view and save real-time engine and performance data and much more.

Features:

Read and erase diagnostic trouble codes (DTCs) and turn off the check engine light

Connect to an Android Smartphone using one of the many free compatible apps or a Bluetooth enabled computer using the supplied software

View real-time vehicle data, graphs and performance parameters while you're driving

Find and fix problems before they happen

Pays for itself with one use

Connects wireless via Bluetooth up to 3 meters (no annoying cables)

NOT Compatible with all OBDII compliant vehicles (Check list of compatible vehicles)

Genuine ELM327 processor

Bluetooth Pairing Password: 1234

Multi-Protocol Support:

ISO 9141-2 (5 baud init, 10.4 kbaud)

ISO 14230-4 KWP (5 baud init, 10.4 kbaud)

ISO 14230-4 KWP (fast init, 10.4 kbaud)

ISO 15765-4 CAN (11 bit ID, 500 kbaud)

ISO 15765-4 CAN (29 bit ID, 500 kbaud)

ISO 15765-4 CAN (11 bit ID, 250 kbaud)

ISO 15765-4 CAN (29 bit ID, 250 kbaud)

SAE J1939

NOTE: Not compatible with older GM and Ford vehicles that use the SAE J1850 VPW and SAE J1850PWM protocols

216-0833018

Part Number 216-0833018 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

TSOP-VSOP-SSOP Adapter Board V1

216-0774207 HD6370

Part Number 216-0774207 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 400 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GX3109 Adapter for XELTEK SuperPro 7500