SR3LC i7-8550U

Part Number SR3LC i7-8550U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

MINI DSG Reader(DQ200+DQ250) for VW/AUDI

Top 5 Reasons to Get MINI DSG:

1. Supported Language: English Only

2. MINI DSG reader is used for AUDI and VW new car. Support K-line and CAN BUS car.

3. Operating System Requirement: WIN XP System

4. After you install the software, you need to send us the ID for activation. Otherwise, it will tell " License Expired"

5. No need Activation any more.

MINI DSG Reader Description:

Usually the tool for reading/writing new VW/AUDI gearbox data is few and very expensive, now the low cost tool is coming. You don't need remove ecu from car, only connect some plug to the DSG ECU and then you can read/write and save dump to bin flie.

MINI DSG Reader Newly added car models:

AUDI Q7 BOSCH GS19 11 1MB

AUDI RS6 BOSCH GS19 2MB

AUDI S4 BOSCH GS19 04 1MB

Daewoo Lacetti Denso v2

Lotus Europa S Delco GMPT

Opel Astra G Motorola GMPT E15

Opel Astra J Delco 5[v1]

Opel Astra J Delco 5[v2]

Opel Astra J Delco 5[v4]

Opel Insignia Delco 5[V2]

Opel Insignia Delco 5[V3]

Opel Speadster Motorola GMPT E15

Opel Zafira B Delco TP

Vauxhall Astra G Motorola GMPT E15

Vauxhall Astra J Denso v1

Vauxhall Insignia Denso

Vauxhall Zafira Motorola GMPT E15

GL82CM238 SR30U

Part Number GL82CM238 SR30U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR27G i3-5005U

Part Number i3-5005U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: Download software

Function

Debug the program with the simulation software, and support the simulation of 32bit-M0/8051/8-BIT E/mbedded ICE Series MCU.

(the simulation software must be keil mdk-armv4.53/m2ide v143 or later)

Note

Can be used with Starter kit STK_32FXXX for learning.

The self-developed Target board must pull out the SWD pin to debug with SN-LINK-V3.

Use with Starter kit STK_25EXX/26EXX/27EXX/22EXX/29EXX for learning.

The self-developed Target board must pull out EICK/EIDA pin to debug with SN-LINK-V3.

Use with Starter kit STK_57XX/58XX for learning.

The self-developed Target board must pull out the SWD pin to debug with SN-LINK-V3.

Supporting operating system: Win2000/XP-32bit/Vista-32bit/Win7-32bit/Win8.

G96-650-C1 9650MGT

Part Number G96-650-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

The use of programmer selftest command,to check if there is problem itself.

Selftest way I:

Step 1 : Input the SELFTEST in the Enter chip printing,click

Step 2 : Click ,look at the hint in the display area,selftest 0 means the test pass;

Step 3 : Install the NO.1 test board and the short port of VGA ISP(short circuit the 4pins and 11pins,12pins and 15pins);

Step 4 : Click ,check the hint in the software,it will hint Selftest 1,test pass;

Step 5 : Install the NO.2 Self Test Board;

Step 6 : Click ,check the hint in the software,it will hint Selftest 2, test pass;

Selftest way II :

Step 1 : When there is no chip on the locking seat,input the type of 25XX in Enter Chip Printing;

Step 2 : Click ,it will hint that there is no chip or the locking seat hasnt been impacted well,which is normal;

If it hints that there may be a pin empty solder;

Attention : In the case of that some users have no test board,as long as the selftest 0 and 25 chip test pass,the machine is normal.

If there is other hints when doing selftest 0,the way to deal with it could be as following:

The problem of connection with computer and the programmer,please step-by examine according to the hint of failure process;

Hardware trouble like pin electric leakage,problems inside the pins,VPP open circuit,GND open circuit,VPP short circuit,VCC short circuit,GND short circuit,VPP protection not shut off,which must be returned to factory to repair.

N10P-GS-A3 GT240M

Part Number N10P-GS-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1141

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX2020 Adapter for XELTEK SuperPro 6100N

216-08330000 HD7670M

Part Number 216-0833000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

PRO-250 nForce3

Part Number PRO-250 nForce 3 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 04+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX3031 Adapter for XELTEK SuperPro 6100N