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Foxconn H3 Socket LGA1155 CPU Base 1155 PC Connector BGA Base

Foxconn H3 Socket LGA1155 CPU Base 1155 PC Connector BGA Base

Part Number LGA1155 Socket Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1155

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004021
€4.97

Foxconn H3 Socket LGA1155 CPU Base 1155 PC Connector BGA Base

Foxconn H3 Socket LGA1155 CPU Base 1155 PC Connector BGA Base

Foxconn H3 Socket LGA1155 CPU Base 1155 PC Connector BGA Base

Part Number LGA1155 Socket Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1155

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004021
€4.97

Foxconn H3 Socket LGA1155 CPU Base 1155 PC Connector BGA Base

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Halnziye HY91050ml Thermal Glue

Halnziye HY910-50ml Thermal Glue

Color White Thermal Conductivity >0.975 W/m-K

Speciflc Gravity >2.3g/Cc Operating Temperature -76~482?

Setting Time 5~15min Hardness 785 (Shore A)

CH004056
€10.44

Halnziye HY910-50ml Thermal Glue

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