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  • Categories: BGA Reballing Kits, Stencils
  • Categories: DC Jacks, Connector
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2150876184 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000231
€9.22

215-0876184 Stencil Template 90*90

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NFSPP100NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000241
€5.40

NF-SPP-100-N-A2 Stencil Template

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i56300HQ SR2FP Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000246
€6.84

i5-6300HQ SR2FP Stencil Template

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DC Power Jack Part PJ063

Acer Aspire 4410 Series DC Power Jack Connector: 4410 AS4410-xxxx AS4410

Acer Aspire Timeline 4810 (MS2271) Series DC Power Jack Connector: MS2271, 4810-4439 AS4810-4439, 4810T-351G16Mn AS4810T-351G16Mn, 4810T-351G25Mn AS4810T-351G25Mn, 4810T-352G16Mn AS4810T-352G16Mn, 4810T-352G25Mn AS4810T-352G25Mn, 4810T-352G32Mn AS4810T-352G32Mn, 4810T-353G25Mn AS4810T-353G25Mn, 4810T-353G32Mn AS4810T-353G32Mn, 4810T-354G32Mi AS4810T-354G32Mi, 4810T-354G32Mn AS4810T-354G32Mn, 4810T-354G50Mi AS4810T-354G50Mi, 4810T-354G50Mn AS4810T-354G50Mn, 4810T-942G32Mn AS4810T-942G32Mn, 4810T-942G50Mn AS4810T-942G50Mn, 4810T-944G32Mn AS4810T-944G32Mn, 4810T-944G50Mi AS4810T-944G50Mi, 4810T-944G50Mn AS4810T-944G50Mn, 4810T-8194 AS4810T-8194, 4810T-8480 AS4810T-8480, 4810T-8702 AS4810T-8702, 4810TG-352G25Mn AS4810TG-352G25Mn, 4810TG-352G32Mn AS4810TG-352G32Mn, 4810TG-354G50Mi AS4810TG-354G50Mi, 4810TG-354G50Mn AS4810TG-354G50Mn, 4810TG-942G32Mn AS4810TG-942G32Mn, 4810TG-944G32Mn AS4810TG-944G32Mn, 4810TZ-271G16Mn AS4810TZ-271G16Mn, 4810TZ-272G16Mn AS4810TZ-272G16Mn, 4810TZ-272G25Mn AS4810TZ-272G25Mn, 4810TZ-272G32Mn AS4810TZ-272G32Mn, 4810TZ-273G32Mn AS4810TZ-273G32Mn, 4810TZ-274G25Mi AS4810TZ-274G25Mi, 4810TZ-274G25Mn AS4810TZ-274G25Mn, 4810TZ-4011 AS4810TZ-4011, 4810TZ-4120 AS4810TZ-4120, 4810TZ-4183 AS4810TZ-4183, 4810TZ-4439 AS4810TZ-4439, 4810TZ-4473 AS4810TZ-4473, 4810TZ-4508 AS4810TZ-4508, 4810TZG-274G32Mn AS4810TZG-274G32Mn

Acer Aspire 5810 Series DC Power Jack Connector: MS2272, 5810 AS5810, 5810T AS5810T, 5810TG-354G32Mn AS5810TG-354G32Mn, 5810TZ AS5810TZ, 5810TZ-4112 AS5810TZ-4112, 5810TZ-4274 AS5810TZ-4274, 5810TZ-4657 AS5810TZ-4657, 5810TZ-4761 AS5810TZ-4761, 5810TZ-4784 AS5810TZ-4784, 5810Z AS5810Z

Gateway EC54 Series DC Power Jack Connector: EC54

Gateway EC58 Series DC Power Jack Connector: EC58

CH001060
€7.21

DC Power Jack, Part #PJ063

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ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

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DC Power Jack Part PJ052

Dell Latitude DC Power Jack Connector: E5410, E5510

Dell Studio Series DC Power Jack Connector: 1569

HP Compaq NC Series DC Power Jack Connector: NC8430

HP Compaq NW Series DC Power Jack Connector: NW8440, NW9440

HP Compaq NX Series DC Power Jack Connector: NX7300, NX7400, NX8420, NX9410, NX9420

HP Elitebook DC Power Jack Connector: 6930P

HP Mini 2100 Notebook PC Series DC Power Jack Connector: 2133, 2140

CH001105
€7.21

DC Power Jack, Part #PJ052

2150876184 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000231
€9.22

215-0876184 Stencil Template 90*90

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NFSPP100NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000241
€5.40

NF-SPP-100-N-A2 Stencil Template

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i56300HQ SR2FP Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000246
€6.84

i5-6300HQ SR2FP Stencil Template

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DC Power Jack Part PJ063

Acer Aspire 4410 Series DC Power Jack Connector: 4410 AS4410-xxxx AS4410

Acer Aspire Timeline 4810 (MS2271) Series DC Power Jack Connector: MS2271, 4810-4439 AS4810-4439, 4810T-351G16Mn AS4810T-351G16Mn, 4810T-351G25Mn AS4810T-351G25Mn, 4810T-352G16Mn AS4810T-352G16Mn, 4810T-352G25Mn AS4810T-352G25Mn, 4810T-352G32Mn AS4810T-352G32Mn, 4810T-353G25Mn AS4810T-353G25Mn, 4810T-353G32Mn AS4810T-353G32Mn, 4810T-354G32Mi AS4810T-354G32Mi, 4810T-354G32Mn AS4810T-354G32Mn, 4810T-354G50Mi AS4810T-354G50Mi, 4810T-354G50Mn AS4810T-354G50Mn, 4810T-942G32Mn AS4810T-942G32Mn, 4810T-942G50Mn AS4810T-942G50Mn, 4810T-944G32Mn AS4810T-944G32Mn, 4810T-944G50Mi AS4810T-944G50Mi, 4810T-944G50Mn AS4810T-944G50Mn, 4810T-8194 AS4810T-8194, 4810T-8480 AS4810T-8480, 4810T-8702 AS4810T-8702, 4810TG-352G25Mn AS4810TG-352G25Mn, 4810TG-352G32Mn AS4810TG-352G32Mn, 4810TG-354G50Mi AS4810TG-354G50Mi, 4810TG-354G50Mn AS4810TG-354G50Mn, 4810TG-942G32Mn AS4810TG-942G32Mn, 4810TG-944G32Mn AS4810TG-944G32Mn, 4810TZ-271G16Mn AS4810TZ-271G16Mn, 4810TZ-272G16Mn AS4810TZ-272G16Mn, 4810TZ-272G25Mn AS4810TZ-272G25Mn, 4810TZ-272G32Mn AS4810TZ-272G32Mn, 4810TZ-273G32Mn AS4810TZ-273G32Mn, 4810TZ-274G25Mi AS4810TZ-274G25Mi, 4810TZ-274G25Mn AS4810TZ-274G25Mn, 4810TZ-4011 AS4810TZ-4011, 4810TZ-4120 AS4810TZ-4120, 4810TZ-4183 AS4810TZ-4183, 4810TZ-4439 AS4810TZ-4439, 4810TZ-4473 AS4810TZ-4473, 4810TZ-4508 AS4810TZ-4508, 4810TZG-274G32Mn AS4810TZG-274G32Mn

Acer Aspire 5810 Series DC Power Jack Connector: MS2272, 5810 AS5810, 5810T AS5810T, 5810TG-354G32Mn AS5810TG-354G32Mn, 5810TZ AS5810TZ, 5810TZ-4112 AS5810TZ-4112, 5810TZ-4274 AS5810TZ-4274, 5810TZ-4657 AS5810TZ-4657, 5810TZ-4761 AS5810TZ-4761, 5810TZ-4784 AS5810TZ-4784, 5810Z AS5810Z

Gateway EC54 Series DC Power Jack Connector: EC54

Gateway EC58 Series DC Power Jack Connector: EC58

CH001060
€7.21

DC Power Jack, Part #PJ063

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ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

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DC Power Jack Part PJ052

Dell Latitude DC Power Jack Connector: E5410, E5510

Dell Studio Series DC Power Jack Connector: 1569

HP Compaq NC Series DC Power Jack Connector: NC8430

HP Compaq NW Series DC Power Jack Connector: NW8440, NW9440

HP Compaq NX Series DC Power Jack Connector: NX7300, NX7400, NX8420, NX9410, NX9420

HP Elitebook DC Power Jack Connector: 6930P

HP Mini 2100 Notebook PC Series DC Power Jack Connector: 2133, 2140

CH001105
€7.21

DC Power Jack, Part #PJ052

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