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  • Categories: Other BGA Chips & ICs
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N15EGXA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000205
€7.46

N15E-GX-A2 Stencil Template

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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
€5.40

i5-2520M SR04A Stencil Template

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TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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216MSA4ALA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000212
€5.40

216MSA4ALA12FG Stencil Template

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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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HAYEAR 21 Mega Pixel 60FPS HDMI USB Industrial Digital Video Microscope56 LED Adjustable

Feature:

Module:FHD216

Sensor Panasoni'c:21 MegaPixel, 21 million pixels CMOS

Optical format:1/2.3 inch

pixel size:1.335m x1.335m

Interface:HDMI(Type A).USB(Type B).TF Card

Image resolution:21MegaPixel

Video record resolution:2K@30FPS 1080p@60FPS

HDMI resoltion:1920*1080p 60FPS

Can output with USB at the same time

HDMI scale:Support 4:3,16:9,16:10 screen

USB2.0(Drive free):1920*1080@30FPS 1280*720@30FPS 640*480@30FPS

Can output with HDMI at the same time

TF card:MAX 64GB

AWB:WB color correction/Auto/Manual

R.G.B value setting independent

Exposure:Auto/Manual.AE value can set

Cross lines:8lines.Can set color& width& position

Scale mark lines:2lines.

Dotted lines:2lines.Can set color& width& position

Sharpness Contrast Color gain:Support

Mono Negative:Support

Mirror:Horizontal vertical mirror

Language:English/simplified Chinese

Digital Zoom:Support

IR remoter:Support

Voltage in:DC 12V 55-21mm size

Power consumption:MAX 0.15W 12V,0.12A

Lens interface:C/CS

Net weight:180g

Gross weight:400g

Camera size:74*74*35mm

Packaging size:160*100*80mm

Questions Solutions:

LCD no video or flicker

1.Check power supply. Check green LED be onlight. Press PowerKey to Up it.

2.Check lens cover. Increase the lighting.

LCD have black bar Image warp

1.change resolution of LCD

2.change resolution of camera

Have dirty spot

1.Check camera and lens, find the dust, then clean using absolute ethyl alcohol or cleanser

C-mount Lens

Magnification Power by 0.12 - 2X (about 8X - 130X on the display)

Work distance: 100mm

Visual field :2.4mm-32mm

Size: 115mm(L) * 40mm(DIA)

Weight: 210g

56 LED Adjustable Compact Microscope Ring Light

Provides intense and focused shadow-free illumination

56 bright white LED bulbs

Lighting direction changeable

Variable intensity control

Intense and focused shadow-free illumination

100,000 hours of life

Power input: 100-240V, 50-60HZ, auto switching

Inside diameter of the ring light: 1.0" (27mm)

Overall outside diameter: 1.77" (45mm)

Working Distance: 27mm-45mm

Packing including:

1 x HDMI Video Camera

1 x HDMI Cable

1 x USB Cable

1 x IR Remote control

1 x Power Supply Adapter (EU/AU)

1 x Adjustable 56 LED lights

1 x 130X Zoom C-mount Lens

1 x Camera Stand

CH000262
€169.08

HAYEAR 21 Mega Pixel 60FPS HDMI USB Industrial Digital Video Microscope+56 LED Adjustable

N15EGXA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000205
€7.46

N15E-GX-A2 Stencil Template

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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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Compare

i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
€5.40

i5-2520M SR04A Stencil Template

wishlist
Compare

TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

wishlist
Compare

216MSA4ALA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000212
€5.40

216MSA4ALA12FG Stencil Template

wishlist
Compare

IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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HAYEAR 21 Mega Pixel 60FPS HDMI USB Industrial Digital Video Microscope56 LED Adjustable

Feature:

Module:FHD216

Sensor Panasoni'c:21 MegaPixel, 21 million pixels CMOS

Optical format:1/2.3 inch

pixel size:1.335m x1.335m

Interface:HDMI(Type A).USB(Type B).TF Card

Image resolution:21MegaPixel

Video record resolution:2K@30FPS 1080p@60FPS

HDMI resoltion:1920*1080p 60FPS

Can output with USB at the same time

HDMI scale:Support 4:3,16:9,16:10 screen

USB2.0(Drive free):1920*1080@30FPS 1280*720@30FPS 640*480@30FPS

Can output with HDMI at the same time

TF card:MAX 64GB

AWB:WB color correction/Auto/Manual

R.G.B value setting independent

Exposure:Auto/Manual.AE value can set

Cross lines:8lines.Can set color& width& position

Scale mark lines:2lines.

Dotted lines:2lines.Can set color& width& position

Sharpness Contrast Color gain:Support

Mono Negative:Support

Mirror:Horizontal vertical mirror

Language:English/simplified Chinese

Digital Zoom:Support

IR remoter:Support

Voltage in:DC 12V 55-21mm size

Power consumption:MAX 0.15W 12V,0.12A

Lens interface:C/CS

Net weight:180g

Gross weight:400g

Camera size:74*74*35mm

Packaging size:160*100*80mm

Questions Solutions:

LCD no video or flicker

1.Check power supply. Check green LED be onlight. Press PowerKey to Up it.

2.Check lens cover. Increase the lighting.

LCD have black bar Image warp

1.change resolution of LCD

2.change resolution of camera

Have dirty spot

1.Check camera and lens, find the dust, then clean using absolute ethyl alcohol or cleanser

C-mount Lens

Magnification Power by 0.12 - 2X (about 8X - 130X on the display)

Work distance: 100mm

Visual field :2.4mm-32mm

Size: 115mm(L) * 40mm(DIA)

Weight: 210g

56 LED Adjustable Compact Microscope Ring Light

Provides intense and focused shadow-free illumination

56 bright white LED bulbs

Lighting direction changeable

Variable intensity control

Intense and focused shadow-free illumination

100,000 hours of life

Power input: 100-240V, 50-60HZ, auto switching

Inside diameter of the ring light: 1.0" (27mm)

Overall outside diameter: 1.77" (45mm)

Working Distance: 27mm-45mm

Packing including:

1 x HDMI Video Camera

1 x HDMI Cable

1 x USB Cable

1 x IR Remote control

1 x Power Supply Adapter (EU/AU)

1 x Adjustable 56 LED lights

1 x 130X Zoom C-mount Lens

1 x Camera Stand

CH000262
€169.08

HAYEAR 21 Mega Pixel 60FPS HDMI USB Industrial Digital Video Microscope+56 LED Adjustable

wishlist
Compare
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