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EMMC BGA153BGA169 EMMC BGA162BGA186BGA221 series socket 3in1 data recovery programming and test Chips

EMMC153 169 EMMC162 186 EMMC221 series socket 3 Functions in 1 USB interface PCB board data recovery programming and test Chips

(At the same time compatible with EMMC, EMCP.BGA221 test block bias)

General test seat introduction

Login to Download: Download software Data Recovery Tutorial

Feature:

* Apply to eMCP and eMMC of Sumsung, Sandis k, Toshiba, Hynix, Micron, MTK and Intel.

* Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the corresponding socket)

* Easy operation by just inserting the USB into PC.

* It provides a compact test solution for eMMC eMCP used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC eMCP device

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

We provide a simple software which can chekc the capacity , read , write and verify , please send us an email if you need it.

Specification:

* Type : BGA153/169 BGA162/186 BGA221 test socket ( USB interface )

* Pin Count :

BGA153/169 test socket:30 pins

BGA162/186 test socket : 17 pins

BGA221 test socket : 36 pins

* Pin Pitch : 0.5mm

* Applicable IC Size : 11.5x13mm , 12x16mm , 12x18mm , 14x18mm

* Life Span : 25,000 times

Package Including:

1 * BGA153/169 socket

1 * BGA162/186 socket

1 * BGA221 socket

1 * PCB test board with USB

4 * border limiters ( 11.5x13mm , 12x16mm , 12x18mm , 14x18mm )

CH000368
€196.43

EMMC BGA153/BGA169 EMMC BGA162/BGA186/BGA221 series socket 3in1 data recovery programming and test Chips

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980 YFC Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000204
€5.40

980 YFC Stencil Template

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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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N15EGXA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000205
€7.46

N15E-GX-A2 Stencil Template

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i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
€5.40

i5-2520M SR04A Stencil Template

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TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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216MSA4ALA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000212
€5.40

216MSA4ALA12FG Stencil Template

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STLINK V2 JTAG USB Programming STM8 STM32 Debug Programmer Downloader Tools

ST-Link/V2 STM8 STM32 Debugging Emulator Download Programming Unit

Basic Properties:

ST-LINK / V2 is ST STMicroelectronics evaluation, development STM8 and STM32 family MCU series designed to set online download for the integration of simulation and development tools.

STM8 family via SWIM interface with the ST-LINK / V2 connection;

STM32 family through the JTAG / SWD interface with the ST-LINK / V2 connections.

ST-LINK / V2 and PC via high speed USB2.0 connection.

Supported Software:

Direct support ST official IDE (Integrated Development Environment software) ST Visual Develop (STVD) and burning software ST Visual Program (STVP).

Support ATOLLIC, IAR and Keil, TASKING integrated development environment such as the STM32.

Supported Devices:

Supports all interfaces with SWIM STM8 MCU

Supports all with JTAG / SWD interface STM32 MCU

Package list:

1 x ST-Link/V2 main unit

1 x USB Data Cable

1 x 20pin cable

2 x SWIM Cable

CH000416
€14.30

ST-LINK V2 JTAG USB Programming STM8 / STM32 Debug Programmer Downloader Tools

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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

EMMC BGA153BGA169 EMMC BGA162BGA186BGA221 series socket 3in1 data recovery programming and test Chips

EMMC153 169 EMMC162 186 EMMC221 series socket 3 Functions in 1 USB interface PCB board data recovery programming and test Chips

(At the same time compatible with EMMC, EMCP.BGA221 test block bias)

General test seat introduction

Login to Download: Download software Data Recovery Tutorial

Feature:

* Apply to eMCP and eMMC of Sumsung, Sandis k, Toshiba, Hynix, Micron, MTK and Intel.

* Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the corresponding socket)

* Easy operation by just inserting the USB into PC.

* It provides a compact test solution for eMMC eMCP used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC eMCP device

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

We provide a simple software which can chekc the capacity , read , write and verify , please send us an email if you need it.

Specification:

* Type : BGA153/169 BGA162/186 BGA221 test socket ( USB interface )

* Pin Count :

BGA153/169 test socket:30 pins

BGA162/186 test socket : 17 pins

BGA221 test socket : 36 pins

* Pin Pitch : 0.5mm

* Applicable IC Size : 11.5x13mm , 12x16mm , 12x18mm , 14x18mm

* Life Span : 25,000 times

Package Including:

1 * BGA153/169 socket

1 * BGA162/186 socket

1 * BGA221 socket

1 * PCB test board with USB

4 * border limiters ( 11.5x13mm , 12x16mm , 12x18mm , 14x18mm )

CH000368
€196.43

EMMC BGA153/BGA169 EMMC BGA162/BGA186/BGA221 series socket 3in1 data recovery programming and test Chips

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980 YFC Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000204
€5.40

980 YFC Stencil Template

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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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N15EGXA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000205
€7.46

N15E-GX-A2 Stencil Template

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Compare

i52520M SR04A Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000209
€5.40

i5-2520M SR04A Stencil Template

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Compare

TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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T2 Rom EFI Socket A1932 A1989 A1990 A2159 A2141 A2179 A2251 A2289

Compatible:

A2251 820-01949

A2289 820-01987

A2141 820-01700

A2159 820-01598

A1990 820-01041

A1989 820-00850

A1932 820-01521

A2179 820-01958

Programmers who supported:  SVOD4, RT809F with adapter 1.8V, RT809H with adapter 1.8V, CH341A v1.7 which have integrated power manipulator 1.8V, 3.3V, 5V. 

CH000404
€52.00

T2 Rom EFI Socket A1932 A1989 A1990 A2159 A2141 A2179 A2251 A2289

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216MSA4ALA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000212
€5.40

216MSA4ALA12FG Stencil Template

wishlist
Compare

STLINK V2 JTAG USB Programming STM8 STM32 Debug Programmer Downloader Tools

ST-Link/V2 STM8 STM32 Debugging Emulator Download Programming Unit

Basic Properties:

ST-LINK / V2 is ST STMicroelectronics evaluation, development STM8 and STM32 family MCU series designed to set online download for the integration of simulation and development tools.

STM8 family via SWIM interface with the ST-LINK / V2 connection;

STM32 family through the JTAG / SWD interface with the ST-LINK / V2 connections.

ST-LINK / V2 and PC via high speed USB2.0 connection.

Supported Software:

Direct support ST official IDE (Integrated Development Environment software) ST Visual Develop (STVD) and burning software ST Visual Program (STVP).

Support ATOLLIC, IAR and Keil, TASKING integrated development environment such as the STM32.

Supported Devices:

Supports all interfaces with SWIM STM8 MCU

Supports all with JTAG / SWD interface STM32 MCU

Package list:

1 x ST-Link/V2 main unit

1 x USB Data Cable

1 x 20pin cable

2 x SWIM Cable

CH000416
€14.30

ST-LINK V2 JTAG USB Programming STM8 / STM32 Debug Programmer Downloader Tools

wishlist
Compare

IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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Compare
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