In package included:

1 pcs x GZUT EZP XPRO Programmer

1 pcs x EFI Riboon Cable

2 pcs x small PCB

1 pcs x USB cable

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 With this Professional SET you can make adjustments for Bios manually and fix EFI.

This flashing set (GZUT v2 PRO + EFI RIBBON CABLE) used for Mcbook, McBook Air and new McBook Pro models from 2010 to 2017 

It has three connectors for the years 2010 – 2011, 2012 – 2014 and 2015 – 2017

You can read bios chip without desoldering process. 

Programmer EZP GZUT v2 PRO set supported  :

MBA11 2015 A1465 820-00164
MBA11 2013 A1465 820-3435
MBA13 2011 A1369 820-3023
MBA11 2011 A1370 820-3024
MBA 13 2013 A1466 820-3437
MBA 13 2012 A1466 820-3209
MBA13 2015 A1466 820-00165
MBA13 2017 A1466 820-00165
MBP13 2016 A1708 820-00875
MBP13 2016 A1706 820-00239
MBP15 2017 A1707 820-00928
MBP15 2016 A1707 820-00281
MBP13 2017 A1706 820-00923
MBP13 2017 A1708 820-00840
MBP13 2015 A1502 820-4924
MBP13 2014 A1502 820-3476
MBP13 2014 A1502 820-3536 
MBP13 2013 A1502 820-3476
MBP13 2014 A1502 820-3476
MBP15 2012 A1398 820-3332
MBP15 2013 A1398 820-3332
MBP15 2013 A1398 820-3662
MBP15 2013 A1398 820-3787
MBP15 2014 A1398 820-3662
MBP15 2015 A1398 820-00138 
MBP15 2015 A1398 820-00163
MBP12 2015 A1534 820-00045
MBP12 2016 A1534 820-00244
MacMini 2011 A1347 820-2993

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B - EFI ribbon cable not compatible, support GOLDEN pin silicone cable. 

You can used GOLD PIN SILICONE CABLE and read this bios chip (visit our shop and check)

Apple A1278 K6 MCP89MZ-A2 SST25VF032B -  EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Imac 27 A1312 820-2828-A_MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1297 820-2914-B-MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E  - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

In our store also you can find and Chips Cards: 

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect  - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product desxcription: Elevate your device capabilities with our Extension bord featuring an array of ports, including 32 pin x 0.5mm, 32 pin x 0.8mm, and 32 pin x 1mm for seamless keyboard connector integration. The kit includes 12 flexible cables, each measuring 200mm, with variations in pin sizes (32 pin x 0.5mm/0.8mm, 30 pin x 0.5mm/0.8mm, 26 pin x 0.5mm/0.8mm) to cater to diverse connectivity needs.

Designed with flexibility in mind, our kit also accommodates individual port installations, offering 34 pin x 0.5mm, 34 pin x 0.8mm, and 34 pin x 1mm options. The extended board ensures optimal performance, making it the ideal solution for expanding your device's capabilities. Upgrade effortlessly and unlock a world of possibilities with our Extension board.

Compatible

Compatible with SVOD3, SVOD4 programmers

In package included

1 pcs   x  Extended board of ports for keyboard module

12 pcs x Flex cables: 34pin, 32pin, 30pin, 26pin

(12 pcs - all cables what you see in picture): 

26pin x 0,5mm, 30pin x 0,5mm, 32pin x 0,5mm

26pin x 0,8mm, 30pin x 0,8mm, 32pin x 0,8mm

24pin x 1,0mm, 25pin x 1,0mm, 26pin x 1,0mm

 28pin x 1,0mm, 30pin x 1,0mm, 32pin x 1,0mm

Shipping time

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited: 5-10 working days  (Europe and Worldwide)

Warranty

This product will have a 90-day warranty.

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax !!!

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock