Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

T48 (TL866II 3rd Generation) Programmer Support 31000+ ICS for EPROM / MCU / SPI / Nor / NAND Flash / EMMC.

• Programming speed much faster: (30MHZ); for SPI NOR FLASH 25Q128, 30s+5.4s(P+V) (30MHZ); for P_NAND 29F1G08AB, 27s+17s(P+V); for P_NOR FLASH EN29LV320 TSOP48, 24s+1.9s(P+V)......
• Support EMMC/EMCP; P-NAND; SPI NAND FLASH; GAL PLD; MCU: 51/PIC/AVR; 27/28/29/39/49/50; 24/25/45/93/95; 74 Series Logic IC Visual Test
• Production of high-density SMD technology, a unified user interface, easy to use, fully functional, reliable program running of application software, ultra-small (size is almost the same as TL866II), code-runs much faster, support multilanguage menu (English, Chinese, Russian, Polish, German, Spanish, Portuguese, Turkish, Czech, Italian), it can automatically identify the operating system to install and run under Windows XP,2003,2008,Vista Win7 WIN8 WIN10 WIN11.
• T48 hardware Parameters: 32-bit MCU with 120MHZ, 4-layer PCB Design, USB2.0 HS 480MHZ; Volume: 10X6.5X2.8 cm (almost the same as TL866II); 16 channel ISP, total 56-channel dedicated IO, 56-channel high-speed high-voltage isolation; VCC voltage 1.8-6.5V 64 levels adjustable, VPP voltage 9V-25V 64 levels adjustable; Power consumption: 5V <500MA.
• With 40-pin industrial high-quality ZIF Socket (Pluggable/replaceable), newest model T48 (TL866-3G) programmer is the improvement of TL866II Plus programmer. Based on 32-bit MCU with 120MHZ and 4-layer PCB design, this professional T48 programmer support high-capacity NAND EMMC up to 256GB and programming speed is much higher. Suppport high-voltage chips, such as 27Cxxx series, VCC Maximum up to 25V, that is what TL866II cannot achieve.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product desxcription: Elevate your device capabilities with our Extension bord featuring an array of ports, including 32 pin x 0.5mm, 32 pin x 0.8mm, and 32 pin x 1mm for seamless keyboard connector integration. The kit includes 12 flexible cables, each measuring 200mm, with variations in pin sizes (32 pin x 0.5mm/0.8mm, 30 pin x 0.5mm/0.8mm, 26 pin x 0.5mm/0.8mm) to cater to diverse connectivity needs.

Designed with flexibility in mind, our kit also accommodates individual port installations, offering 34 pin x 0.5mm, 34 pin x 0.8mm, and 34 pin x 1mm options. The extended board ensures optimal performance, making it the ideal solution for expanding your device's capabilities. Upgrade effortlessly and unlock a world of possibilities with our Extension board.

Compatible

Compatible with SVOD3, SVOD4 programmers

In package included

1 pcs   x  Extended board of ports for keyboard module

12 pcs x Flex cables: 34pin, 32pin, 30pin, 26pin

(12 pcs - all cables what you see in picture): 

26pin x 0,5mm, 30pin x 0,5mm, 32pin x 0,5mm

26pin x 0,8mm, 30pin x 0,8mm, 32pin x 0,8mm

24pin x 1,0mm, 25pin x 1,0mm, 26pin x 1,0mm

 28pin x 1,0mm, 30pin x 1,0mm, 32pin x 1,0mm

Shipping time

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited: 5-10 working days  (Europe and Worldwide)

Warranty

This product will have a 90-day warranty.

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax !!!

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock