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  • Categories: Adapter, DC cable
  • Categories: CPU and Graphic Chips
  • Categories: Other BGA Chips & ICs
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AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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Lenovo Yoga 3 Pro Yoga 3 Pro1370 Only for Core i3 i5 40W Charger AC Adapter

Tech Specs:

Product Description: AC Adapter - power adapter - 40 Watt

Device Type: Power adapter

Input voltage:100V-240V 50-60Hz

Output voltage: 20V/5.2V

Output current: 2A

Power Capacity: 40W

Package Included:1 X AC Adapter, 1 X Power Cord

Compatibility:

- Delta: ADL40WDA 36200561, ADL40WDJ 36200562, ADL40WDB 36200563, ADL40WDD 36200564, ADL40WDG 36200565, ADL40WDE 36200566, ADL40WDC 36200567, ADL40WDH 36200616

- Chicony: ADL40WCA 36200579, ADL40WCB 36200580, ADL40WCC 36200581, ADL40WCD 36200582, ADL40WCE 36200583, ADL40WCF 36200584, ADL40WCG 36200585, ADL40WCH 36200618

- Liteon: ADL40WLA 36200572, ADL40WLB 36200573, ADL40WLC 36200574, ADL40WLD 36200575, ADL40WLE 36200576, ADL40WLF 36200577, ADL40WLG 36200578, ADL40WLH 36200617

- Model: GX20H34904, 80HE0049US

- Yoga 3 Pro, Yoga 3 Pro-1370 (Only for Core i3, i5)

- Yoga 3 11, Yoga 3-1170 (For Core i3, i5, i7)

- Yoga 3 14, Yoga 3-1470 (Only for Core i3)

CH001320
€23.37

Lenovo Yoga 3 Pro Yoga 3 Pro-1370 (Only for Core i3 i5) 40W Charger AC Adapter

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SR23L M5Y51

SR23L M-5Y51

Part Number SR23L M-5Y51 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000311
€57.44

SR23L M-5Y51

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TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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Power supply IBMLENOVO 20V 325A 65W 55x25

Power supply IBM-LENOVO 20V 3.25A [65W] 5,5x2,5

Input Voltage Range AC 100V - 240V Output 20V 3.25A

Connector Size 5.5mm*2.5mm Power 65W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001321
€11.81

Power supply IBM-LENOVO 20V 3.25A [65W] 5,5x2,5

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N14PGSA2 GT740M

N14P-GS-A2 GT740M

Part Number N14P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1233

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000323
€54.15

N14P-GS-A2 GT740M

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N16SGTRSA2

N16S-GTR-S-A2

Part Number N16S-GTR-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000327
€24.62

N16S-GTR-S-A2

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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

AM3420DDX43GX A63420M

AM3420DDX43GX A6-3420M

Part Number AM3420DDX43GX Manufacturer AMD

socket FS1 772-pin Date Code 12+

Package/Case 1 PCS Description Brand new

AM3420DDX43GX A6-3420M for Notebooks AMD 1.5 GHz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000301
€11.32

AM3420DDX43GX A6-3420M

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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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Lenovo Yoga 3 Pro Yoga 3 Pro1370 Only for Core i3 i5 40W Charger AC Adapter

Tech Specs:

Product Description: AC Adapter - power adapter - 40 Watt

Device Type: Power adapter

Input voltage:100V-240V 50-60Hz

Output voltage: 20V/5.2V

Output current: 2A

Power Capacity: 40W

Package Included:1 X AC Adapter, 1 X Power Cord

Compatibility:

- Delta: ADL40WDA 36200561, ADL40WDJ 36200562, ADL40WDB 36200563, ADL40WDD 36200564, ADL40WDG 36200565, ADL40WDE 36200566, ADL40WDC 36200567, ADL40WDH 36200616

- Chicony: ADL40WCA 36200579, ADL40WCB 36200580, ADL40WCC 36200581, ADL40WCD 36200582, ADL40WCE 36200583, ADL40WCF 36200584, ADL40WCG 36200585, ADL40WCH 36200618

- Liteon: ADL40WLA 36200572, ADL40WLB 36200573, ADL40WLC 36200574, ADL40WLD 36200575, ADL40WLE 36200576, ADL40WLF 36200577, ADL40WLG 36200578, ADL40WLH 36200617

- Model: GX20H34904, 80HE0049US

- Yoga 3 Pro, Yoga 3 Pro-1370 (Only for Core i3, i5)

- Yoga 3 11, Yoga 3-1170 (For Core i3, i5, i7)

- Yoga 3 14, Yoga 3-1470 (Only for Core i3)

CH001320
€23.37

Lenovo Yoga 3 Pro Yoga 3 Pro-1370 (Only for Core i3 i5) 40W Charger AC Adapter

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SR23L M5Y51

SR23L M-5Y51

Part Number SR23L M-5Y51 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000311
€57.44

SR23L M-5Y51

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TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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Power supply IBMLENOVO 20V 325A 65W 55x25

Power supply IBM-LENOVO 20V 3.25A [65W] 5,5x2,5

Input Voltage Range AC 100V - 240V Output 20V 3.25A

Connector Size 5.5mm*2.5mm Power 65W

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001321
€11.81

Power supply IBM-LENOVO 20V 3.25A [65W] 5,5x2,5

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N14PGSA2 GT740M

N14P-GS-A2 GT740M

Part Number N14P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1233

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000323
€54.15

N14P-GS-A2 GT740M

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N16SGTRSA2

N16S-GTR-S-A2

Part Number N16S-GTR-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000327
€24.62

N16S-GTR-S-A2

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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

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