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  • Categories: CPU and Graphic Chips
  • Categories: Programmer & Sockets
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N11MOP2SA3 G210M

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000380
€16.66

N11M-OP2-S-A3 G210M

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FH82B360 SR408

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000383
€63.27

FH82B360 SR408

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OBDII BreaK Out Box Protocol Detector Diagnostic Tool

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

CH000491
€60.92

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

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SR3S1 N4000

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000384
€57.44

SR3S1 N4000

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G73GTNA2

G73-GT-N-A2

Part Number G73-GT-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000397
€24.62

G73-GT-N-A2

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2160674026 RS780

216-0674026 RS780

Part Number 216-0674026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1608

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000424
€39.27

216-0674026 RS780

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SR1EN i34030U

SR1EN i3-4030U

Part Number SR1EN i3-4030U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1504

Package/Case 440 PCS Description Original new

SR1EN i3-4030U CL8064701552900 Intel Core i3 Mobile CPU BGA1168 1.9 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000449
€172.31

SR1EN i3-4030U

N11MOP2SA3 G210M

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000380
€16.66

N11M-OP2-S-A3 G210M

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FH82B360 SR408

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000383
€63.27

FH82B360 SR408

wishlist
Compare

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

CH000491
€60.92

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

wishlist
Compare

SR3S1 N4000

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000384
€57.44

SR3S1 N4000

wishlist
Compare

G73GTNA2

G73-GT-N-A2

Part Number G73-GT-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000397
€24.62

G73-GT-N-A2

wishlist
Compare

2160674026 RS780

216-0674026 RS780

Part Number 216-0674026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1608

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000424
€39.27

216-0674026 RS780

wishlist
Compare

SR1EN i34030U

SR1EN i3-4030U

Part Number SR1EN i3-4030U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1504

Package/Case 440 PCS Description Original new

SR1EN i3-4030U CL8064701552900 Intel Core i3 Mobile CPU BGA1168 1.9 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000449
€172.31

SR1EN i3-4030U

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Compare
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