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  • Categories: DC Jacks, Connector
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N11MOP2SA3 G210M

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000380
€16.66

N11M-OP2-S-A3 G210M

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FH82B360 SR408

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000383
€63.27

FH82B360 SR408

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SR3S1 N4000

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000384
€57.44

SR3S1 N4000

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DC Power Jack Part PJ063

Acer Aspire 4410 Series DC Power Jack Connector: 4410 AS4410-xxxx AS4410

Acer Aspire Timeline 4810 (MS2271) Series DC Power Jack Connector: MS2271, 4810-4439 AS4810-4439, 4810T-351G16Mn AS4810T-351G16Mn, 4810T-351G25Mn AS4810T-351G25Mn, 4810T-352G16Mn AS4810T-352G16Mn, 4810T-352G25Mn AS4810T-352G25Mn, 4810T-352G32Mn AS4810T-352G32Mn, 4810T-353G25Mn AS4810T-353G25Mn, 4810T-353G32Mn AS4810T-353G32Mn, 4810T-354G32Mi AS4810T-354G32Mi, 4810T-354G32Mn AS4810T-354G32Mn, 4810T-354G50Mi AS4810T-354G50Mi, 4810T-354G50Mn AS4810T-354G50Mn, 4810T-942G32Mn AS4810T-942G32Mn, 4810T-942G50Mn AS4810T-942G50Mn, 4810T-944G32Mn AS4810T-944G32Mn, 4810T-944G50Mi AS4810T-944G50Mi, 4810T-944G50Mn AS4810T-944G50Mn, 4810T-8194 AS4810T-8194, 4810T-8480 AS4810T-8480, 4810T-8702 AS4810T-8702, 4810TG-352G25Mn AS4810TG-352G25Mn, 4810TG-352G32Mn AS4810TG-352G32Mn, 4810TG-354G50Mi AS4810TG-354G50Mi, 4810TG-354G50Mn AS4810TG-354G50Mn, 4810TG-942G32Mn AS4810TG-942G32Mn, 4810TG-944G32Mn AS4810TG-944G32Mn, 4810TZ-271G16Mn AS4810TZ-271G16Mn, 4810TZ-272G16Mn AS4810TZ-272G16Mn, 4810TZ-272G25Mn AS4810TZ-272G25Mn, 4810TZ-272G32Mn AS4810TZ-272G32Mn, 4810TZ-273G32Mn AS4810TZ-273G32Mn, 4810TZ-274G25Mi AS4810TZ-274G25Mi, 4810TZ-274G25Mn AS4810TZ-274G25Mn, 4810TZ-4011 AS4810TZ-4011, 4810TZ-4120 AS4810TZ-4120, 4810TZ-4183 AS4810TZ-4183, 4810TZ-4439 AS4810TZ-4439, 4810TZ-4473 AS4810TZ-4473, 4810TZ-4508 AS4810TZ-4508, 4810TZG-274G32Mn AS4810TZG-274G32Mn

Acer Aspire 5810 Series DC Power Jack Connector: MS2272, 5810 AS5810, 5810T AS5810T, 5810TG-354G32Mn AS5810TG-354G32Mn, 5810TZ AS5810TZ, 5810TZ-4112 AS5810TZ-4112, 5810TZ-4274 AS5810TZ-4274, 5810TZ-4657 AS5810TZ-4657, 5810TZ-4761 AS5810TZ-4761, 5810TZ-4784 AS5810TZ-4784, 5810Z AS5810Z

Gateway EC54 Series DC Power Jack Connector: EC54

Gateway EC58 Series DC Power Jack Connector: EC58

CH001060
€3.61

DC Power Jack, Part #PJ063

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G73GTNA2

G73-GT-N-A2

Part Number G73-GT-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000397
€24.62

G73-GT-N-A2

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2160674026 RS780

216-0674026 RS780

Part Number 216-0674026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1608

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000424
€39.27

216-0674026 RS780

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SR1EN i34030U

SR1EN i3-4030U

Part Number SR1EN i3-4030U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1504

Package/Case 440 PCS Description Original new

SR1EN i3-4030U CL8064701552900 Intel Core i3 Mobile CPU BGA1168 1.9 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000449
€172.31

SR1EN i3-4030U

N11MOP2SA3 G210M

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000380
€16.66

N11M-OP2-S-A3 G210M

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FH82B360 SR408

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000383
€63.27

FH82B360 SR408

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SR3S1 N4000

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000384
€57.44

SR3S1 N4000

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DC Power Jack Part PJ063

Acer Aspire 4410 Series DC Power Jack Connector: 4410 AS4410-xxxx AS4410

Acer Aspire Timeline 4810 (MS2271) Series DC Power Jack Connector: MS2271, 4810-4439 AS4810-4439, 4810T-351G16Mn AS4810T-351G16Mn, 4810T-351G25Mn AS4810T-351G25Mn, 4810T-352G16Mn AS4810T-352G16Mn, 4810T-352G25Mn AS4810T-352G25Mn, 4810T-352G32Mn AS4810T-352G32Mn, 4810T-353G25Mn AS4810T-353G25Mn, 4810T-353G32Mn AS4810T-353G32Mn, 4810T-354G32Mi AS4810T-354G32Mi, 4810T-354G32Mn AS4810T-354G32Mn, 4810T-354G50Mi AS4810T-354G50Mi, 4810T-354G50Mn AS4810T-354G50Mn, 4810T-942G32Mn AS4810T-942G32Mn, 4810T-942G50Mn AS4810T-942G50Mn, 4810T-944G32Mn AS4810T-944G32Mn, 4810T-944G50Mi AS4810T-944G50Mi, 4810T-944G50Mn AS4810T-944G50Mn, 4810T-8194 AS4810T-8194, 4810T-8480 AS4810T-8480, 4810T-8702 AS4810T-8702, 4810TG-352G25Mn AS4810TG-352G25Mn, 4810TG-352G32Mn AS4810TG-352G32Mn, 4810TG-354G50Mi AS4810TG-354G50Mi, 4810TG-354G50Mn AS4810TG-354G50Mn, 4810TG-942G32Mn AS4810TG-942G32Mn, 4810TG-944G32Mn AS4810TG-944G32Mn, 4810TZ-271G16Mn AS4810TZ-271G16Mn, 4810TZ-272G16Mn AS4810TZ-272G16Mn, 4810TZ-272G25Mn AS4810TZ-272G25Mn, 4810TZ-272G32Mn AS4810TZ-272G32Mn, 4810TZ-273G32Mn AS4810TZ-273G32Mn, 4810TZ-274G25Mi AS4810TZ-274G25Mi, 4810TZ-274G25Mn AS4810TZ-274G25Mn, 4810TZ-4011 AS4810TZ-4011, 4810TZ-4120 AS4810TZ-4120, 4810TZ-4183 AS4810TZ-4183, 4810TZ-4439 AS4810TZ-4439, 4810TZ-4473 AS4810TZ-4473, 4810TZ-4508 AS4810TZ-4508, 4810TZG-274G32Mn AS4810TZG-274G32Mn

Acer Aspire 5810 Series DC Power Jack Connector: MS2272, 5810 AS5810, 5810T AS5810T, 5810TG-354G32Mn AS5810TG-354G32Mn, 5810TZ AS5810TZ, 5810TZ-4112 AS5810TZ-4112, 5810TZ-4274 AS5810TZ-4274, 5810TZ-4657 AS5810TZ-4657, 5810TZ-4761 AS5810TZ-4761, 5810TZ-4784 AS5810TZ-4784, 5810Z AS5810Z

Gateway EC54 Series DC Power Jack Connector: EC54

Gateway EC58 Series DC Power Jack Connector: EC58

CH001060
€3.61

DC Power Jack, Part #PJ063

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G73GTNA2

G73-GT-N-A2

Part Number G73-GT-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000397
€24.62

G73-GT-N-A2

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2160674026 RS780

216-0674026 RS780

Part Number 216-0674026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1608

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000424
€39.27

216-0674026 RS780

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SR1EN i34030U

SR1EN i3-4030U

Part Number SR1EN i3-4030U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1504

Package/Case 440 PCS Description Original new

SR1EN i3-4030U CL8064701552900 Intel Core i3 Mobile CPU BGA1168 1.9 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000449
€172.31

SR1EN i3-4030U

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