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SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

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RT BGA130 01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA130-01 V1.1

1pcs x Frame 

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000347
€76.00

RT-BGA130-01 POS NAND MCP Adapter For RT809H Programmer

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N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

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N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

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LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

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EMMC BGA153BGA169 EMMC BGA162BGA186BGA221 series socket 3in1 data recovery programming and test Chips

EMMC153 169 EMMC162 186 EMMC221 series socket 3 Functions in 1 USB interface PCB board data recovery programming and test Chips

(At the same time compatible with EMMC, EMCP.BGA221 test block bias)

General test seat introduction

Login to Download: Download software Data Recovery Tutorial

Feature:

* Apply to eMCP and eMMC of Sumsung, Sandis k, Toshiba, Hynix, Micron, MTK and Intel.

* Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the corresponding socket)

* Easy operation by just inserting the USB into PC.

* It provides a compact test solution for eMMC eMCP used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC eMCP device

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

We provide a simple software which can chekc the capacity , read , write and verify , please send us an email if you need it.

Specification:

* Type : BGA153/169 BGA162/186 BGA221 test socket ( USB interface )

* Pin Count :

BGA153/169 test socket:30 pins

BGA162/186 test socket : 17 pins

BGA221 test socket : 36 pins

* Pin Pitch : 0.5mm

* Applicable IC Size : 11.5x13mm , 12x16mm , 12x18mm , 14x18mm

* Life Span : 25,000 times

Package Including:

1 * BGA153/169 socket

1 * BGA162/186 socket

1 * BGA221 socket

1 * PCB test board with USB

4 * border limiters ( 11.5x13mm , 12x16mm , 12x18mm , 14x18mm )

CH000368
€196.43

EMMC BGA153/BGA169 EMMC BGA162/BGA186/BGA221 series socket 3in1 data recovery programming and test Chips

SR2Z9 J3455

SR2Z9 J3455

Part Number SR2Z9 J3455 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000285
€57.44

SR2Z9 J3455

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RT BGA130 01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA130-01 V1.1

1pcs x Frame 

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000347
€76.00

RT-BGA130-01 POS NAND MCP Adapter For RT809H Programmer

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N10PGV1 GT120M

N10P-GV1 GT120M

Part Number N10P-GV1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000296
€25.93

N10P-GV1 GT120M

wishlist
Compare

N10MNSSB1

N10M-NS-S-B1

Part Number N10M-NS-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000298
€15.59

N10M-NS-S-B1

wishlist
Compare

LE82GM965 SLA5T

LE82GM965 SLA5T

Part Number LE82GM965 SLA5T Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 0846

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000300
€11.49

LE82GM965 SLA5T

wishlist
Compare

EMMC BGA153BGA169 EMMC BGA162BGA186BGA221 series socket 3in1 data recovery programming and test Chips

EMMC153 169 EMMC162 186 EMMC221 series socket 3 Functions in 1 USB interface PCB board data recovery programming and test Chips

(At the same time compatible with EMMC, EMCP.BGA221 test block bias)

General test seat introduction

Login to Download: Download software Data Recovery Tutorial

Feature:

* Apply to eMCP and eMMC of Sumsung, Sandis k, Toshiba, Hynix, Micron, MTK and Intel.

* Apply to BGA153 BGA169 BGA162 BGA186 BGA221.(just need to change the corresponding socket)

* Easy operation by just inserting the USB into PC.

* It provides a compact test solution for eMMC eMCP used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC eMCP device

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

We provide a simple software which can chekc the capacity , read , write and verify , please send us an email if you need it.

Specification:

* Type : BGA153/169 BGA162/186 BGA221 test socket ( USB interface )

* Pin Count :

BGA153/169 test socket:30 pins

BGA162/186 test socket : 17 pins

BGA221 test socket : 36 pins

* Pin Pitch : 0.5mm

* Applicable IC Size : 11.5x13mm , 12x16mm , 12x18mm , 14x18mm

* Life Span : 25,000 times

Package Including:

1 * BGA153/169 socket

1 * BGA162/186 socket

1 * BGA221 socket

1 * PCB test board with USB

4 * border limiters ( 11.5x13mm , 12x16mm , 12x18mm , 14x18mm )

CH000368
€196.43

EMMC BGA153/BGA169 EMMC BGA162/BGA186/BGA221 series socket 3in1 data recovery programming and test Chips

wishlist
Compare
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