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SAKTC1797 SAKTC1796 MPC5566 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000230
€22.38

SAK-TC1797 SAK-TC1796 MPC5566 Stencil Template 90*90

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Iprog Programmer V85 Support Full Version with Probes Adapters

Iprog+ Programmer V85 Support Full Version with Probes Adapters

Top 3 Reasons to Get Iprog+ Programmer:

1. Functions including airbag, dashboard, car radio, ecu, eeprom, immo, mcu.

and more special functions like dpf off, MIL to KM, PINABS, PINCODE SMATRA3,PINCODE SENSOR SPEED LIMIT,ODO Adjust, Fujutsu, Microchip, Motorola, Motorola912EN, NECV850, BLR, CAN,CRC_Cript, ibutton, sd_unlocker,test etc.

2. Reasonable price: much more cheaper than original iprog+, but work as well as the original

3. IProg+ is designed to work in the operating systems of the Windows family:

Windows xp

Windows vista

Windows 7

Windows 8

IProg+ Programmer Detailed Function List:

Working with odometers on OBDII connector

Working with odometers on the table through adapters

Work with multimedia unlocking the tape recorder

Work with keys (IMMO, Transponders), copying, preparation, unlocking

Work with IMMO-Key Auto dumps

Working with the airbag computer, deleting crash data

Transfer readings from miles to km

Read and write processors and its used in cars

Removing the particulate filter in the dump

Working with keys to the intercom

Realign Pin cod from dump (some brands)

Control board number, + scripts full Base number. Ability to update!

Iprog+ Programmer Software Display:

1. Airbag:

Read and erase crash to some cars

Read and erase DTC

Repair CFG

2. Dashboard:

Read km

Write a new km

3. Car Radio & ECU:

Car Radio:

Read and erase info

Reset count

ECU:

Immo OFF

DPF off

4. Eeprom:

Read/write/erase eeprom

5. Immo:

Program and copy chips for cars and truck

Unlock keys

Cover Toyota smart keys: reset key prepare

Write a key by immo dump

6. Mcu:

Read and write chips

Cover chips Atmel, Fujitsu and microchips Motorola, NEC v850

7. Special functions:

Mile to km

Pincode from dump

Iprog+ Programmer Connection Display:

IProg+ Programmer Package List:

1pc x iprog+ Main Unit

1pc x RFID 125+134 adapter

1pc x Eeprom adapter

1pc x UARTBDM adapter

1pc x OBD Cable

1pc x USB

1pc x CD

1pc x Can Adapter

1pc x K-line Adapter

1pc x Welding Line

1set x Probes Adapters for in-circuit ECU

1pc x IPROG Plus PCF79xx SD-Card Adapter

1pc x Universal RDIF Adapter

CH000446
€174.05

Iprog+ Programmer V85 Support Full Version with Probes Adapters

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2150876184 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000231
€9.22

215-0876184 Stencil Template 90*90

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OBDII BreaK Out Box Protocol Detector Diagnostic Tool

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

CH000491
€60.92

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

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NFSPP100NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000241
€5.40

NF-SPP-100-N-A2 Stencil Template

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i56300HQ SR2FP Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000246
€6.84

i5-6300HQ SR2FP Stencil Template

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ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

SAKTC1797 SAKTC1796 MPC5566 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000230
€22.38

SAK-TC1797 SAK-TC1796 MPC5566 Stencil Template 90*90

wishlist
Compare

Iprog Programmer V85 Support Full Version with Probes Adapters

Iprog+ Programmer V85 Support Full Version with Probes Adapters

Top 3 Reasons to Get Iprog+ Programmer:

1. Functions including airbag, dashboard, car radio, ecu, eeprom, immo, mcu.

and more special functions like dpf off, MIL to KM, PINABS, PINCODE SMATRA3,PINCODE SENSOR SPEED LIMIT,ODO Adjust, Fujutsu, Microchip, Motorola, Motorola912EN, NECV850, BLR, CAN,CRC_Cript, ibutton, sd_unlocker,test etc.

2. Reasonable price: much more cheaper than original iprog+, but work as well as the original

3. IProg+ is designed to work in the operating systems of the Windows family:

Windows xp

Windows vista

Windows 7

Windows 8

IProg+ Programmer Detailed Function List:

Working with odometers on OBDII connector

Working with odometers on the table through adapters

Work with multimedia unlocking the tape recorder

Work with keys (IMMO, Transponders), copying, preparation, unlocking

Work with IMMO-Key Auto dumps

Working with the airbag computer, deleting crash data

Transfer readings from miles to km

Read and write processors and its used in cars

Removing the particulate filter in the dump

Working with keys to the intercom

Realign Pin cod from dump (some brands)

Control board number, + scripts full Base number. Ability to update!

Iprog+ Programmer Software Display:

1. Airbag:

Read and erase crash to some cars

Read and erase DTC

Repair CFG

2. Dashboard:

Read km

Write a new km

3. Car Radio & ECU:

Car Radio:

Read and erase info

Reset count

ECU:

Immo OFF

DPF off

4. Eeprom:

Read/write/erase eeprom

5. Immo:

Program and copy chips for cars and truck

Unlock keys

Cover Toyota smart keys: reset key prepare

Write a key by immo dump

6. Mcu:

Read and write chips

Cover chips Atmel, Fujitsu and microchips Motorola, NEC v850

7. Special functions:

Mile to km

Pincode from dump

Iprog+ Programmer Connection Display:

IProg+ Programmer Package List:

1pc x iprog+ Main Unit

1pc x RFID 125+134 adapter

1pc x Eeprom adapter

1pc x UARTBDM adapter

1pc x OBD Cable

1pc x USB

1pc x CD

1pc x Can Adapter

1pc x K-line Adapter

1pc x Welding Line

1set x Probes Adapters for in-circuit ECU

1pc x IPROG Plus PCF79xx SD-Card Adapter

1pc x Universal RDIF Adapter

CH000446
€174.05

Iprog+ Programmer V85 Support Full Version with Probes Adapters

wishlist
Compare

2150876184 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000231
€9.22

215-0876184 Stencil Template 90*90

wishlist
Compare

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

CH000491
€60.92

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

wishlist
Compare

NFSPP100NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000241
€5.40

NF-SPP-100-N-A2 Stencil Template

wishlist
Compare

i56300HQ SR2FP Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000246
€6.84

i5-6300HQ SR2FP Stencil Template

wishlist
Compare

ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

wishlist
Compare

GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

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Compare
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