ST-Link/V2 STM8 STM32 Debugging Emulator Download Programming Unit

Basic Properties:

ST-LINK / V2 is ST STMicroelectronics evaluation, development STM8 and STM32 family MCU series designed to set online download for the integration of simulation and development tools.

STM8 family via SWIM interface with the ST-LINK / V2 connection;

STM32 family through the JTAG / SWD interface with the ST-LINK / V2 connections.

ST-LINK / V2 and PC via high speed USB2.0 connection.

Supported Software:

Direct support ST official IDE (Integrated Development Environment software) ST Visual Develop (STVD) and burning software ST Visual Program (STVP).

Support ATOLLIC, IAR and Keil, TASKING integrated development environment such as the STM32.

Supported Devices:

Supports all interfaces with SWIM STM8 MCU

Supports all with JTAG / SWD interface STM32 MCU

Package list:

1 x ST-Link/V2 main unit

1 x USB Data Cable

1 x 20pin cable

2 x SWIM Cable

215-0804119

Part Number 215-0804119 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1442

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Buy SOCKET PLCC44/D44(NO PCB): * IC120-0444-306

i7-5600U SR23V

Part Number SR23V i7-5600U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N11E-GE-A1 GTX460M

Part Number N11E-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1045

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

TNM-SOP44 to DIP44 Adapter Socket for TNM5000 Programmer Special Socket

DH82HM87 SR17D

Part Number DH82HM87 SR17D Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Iprog+ Programmer V85 Support Full Version with Probes Adapters

Top 3 Reasons to Get Iprog+ Programmer:

1. Functions including airbag, dashboard, car radio, ecu, eeprom, immo, mcu.

and more special functions like dpf off, MIL to KM, PINABS, PINCODE SMATRA3,PINCODE SENSOR SPEED LIMIT,ODO Adjust, Fujutsu, Microchip, Motorola, Motorola912EN, NECV850, BLR, CAN,CRC_Cript, ibutton, sd_unlocker,test etc.

2. Reasonable price: much more cheaper than original iprog+, but work as well as the original

3. IProg+ is designed to work in the operating systems of the Windows family:

Windows xp

Windows vista

Windows 7

Windows 8

IProg+ Programmer Detailed Function List:

Working with odometers on OBDII connector

Working with odometers on the table through adapters

Work with multimedia unlocking the tape recorder

Work with keys (IMMO, Transponders), copying, preparation, unlocking

Work with IMMO-Key Auto dumps

Working with the airbag computer, deleting crash data

Transfer readings from miles to km

Read and write processors and its used in cars

Removing the particulate filter in the dump

Working with keys to the intercom

Realign Pin cod from dump (some brands)

Control board number, + scripts full Base number. Ability to update!

Iprog+ Programmer Software Display:

1. Airbag:

Read and erase crash to some cars

Read and erase DTC

Repair CFG

2. Dashboard:

Read km

Write a new km

3. Car Radio & ECU:

Car Radio:

Read and erase info

Reset count

ECU:

Immo OFF

DPF off

4. Eeprom:

Read/write/erase eeprom

5. Immo:

Program and copy chips for cars and truck

Unlock keys

Cover Toyota smart keys: reset key prepare

Write a key by immo dump

6. Mcu:

Read and write chips

Cover chips Atmel, Fujitsu and microchips Motorola, NEC v850

7. Special functions:

Mile to km

Pincode from dump

Iprog+ Programmer Connection Display:

IProg+ Programmer Package List:

1pc x iprog+ Main Unit

1pc x RFID 125+134 adapter

1pc x Eeprom adapter

1pc x UARTBDM adapter

1pc x OBD Cable

1pc x USB

1pc x CD

1pc x Can Adapter

1pc x K-line Adapter

1pc x Welding Line

1set x Probes Adapters for in-circuit ECU

1pc x IPROG Plus PCF79xx SD-Card Adapter

1pc x Universal RDIF Adapter

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

ELM327 OBD2 Shell 16pin

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock