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Foxconn Socket G34 LGA1944 CPU Base BGA Connector Holder for AMD Server Desktop Opteron Processor

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004769
€21.01

Foxconn Socket G34 LGA1944 CPU Base BGA Connector Holder for AMD Server Desktop Opteron Processor

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6 Port Multifunctional charging more than USB mobile phone charger Bracket

Many intelligent fast charger USB charger 6USB charger mobile phone mobile phone compatible

More than USB fast charger with smart chip, can be intelligent charging equipment, intelligent output current. Each USB port has an independent indicator light.

Product introduction:

1.wide voltage input, AC, 100--240, V input; applicable to all countries in the world

2.output voltage: AC 5V

3.output current: 6A (Single port maximum support 2.1A)

4.USB interface quantity: 6

5.plug selection: European regulations, American regulations

6.extension line: 120CM

CH004817
€17.28

6 Port Multifunctional charging more than USB mobile phone charger Bracket

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110ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 6.69inch/17cm

Width: approx. 2.36inch/6cm

Model: B-7000

Net weight: 3.7fl.oz (110ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH004821
€6.09

110ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

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CP3015 Goot Wick Desoldering

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004827
€2.70

CP-3015 Goot Wick Desoldering

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Honton HT2024T Heating table constant temperature welding stage 220V

Honton HT-2024T Heating table constant temperature welding stage

HT 2024T item is used to melt the balls on the chip with ease. After putting the balls on the chip simply place the chip carefully on the plate and it will melt them into place. Has many other uses. Can be used for cleaning chips.

Voltage: 220V/110V

Heating Power: 800W

Temperature Range:25~350C

Temperature Fluctuation: 1

Heating Plate Size: 200x240x15mm

Weight:10KG

CH004832
€364.26

Honton HT-2024T Heating table constant temperature welding stage 220V

Foxconn Socket G34 LGA1944 CPU Base BGA Connector Holder for AMD Server Desktop Opteron Processor

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004769
€21.01

Foxconn Socket G34 LGA1944 CPU Base BGA Connector Holder for AMD Server Desktop Opteron Processor

wishlist
Compare

6 Port Multifunctional charging more than USB mobile phone charger Bracket

Many intelligent fast charger USB charger 6USB charger mobile phone mobile phone compatible

More than USB fast charger with smart chip, can be intelligent charging equipment, intelligent output current. Each USB port has an independent indicator light.

Product introduction:

1.wide voltage input, AC, 100--240, V input; applicable to all countries in the world

2.output voltage: AC 5V

3.output current: 6A (Single port maximum support 2.1A)

4.USB interface quantity: 6

5.plug selection: European regulations, American regulations

6.extension line: 120CM

CH004817
€17.28

6 Port Multifunctional charging more than USB mobile phone charger Bracket

wishlist
Compare

110ml Multifunctional Adhesive Glue B7000 For Mobile Phone Universal

Description:

100% brand new and high quality

Repair rubber dock bumpers

Seal plastic containers

Repair stripped threads in wood

Specation:

Material: plastic shell + glue

Color: as pic shows

Length: approx. 6.69inch/17cm

Width: approx. 2.36inch/6cm

Model: B-7000

Net weight: 3.7fl.oz (110ml)

Solid content: 30% - 35%

After curing Hardness: 65-80A

Surface drying time: 3 minutes

Full cure time: 24-48 hours

Storage: stored at 10 degrees to 28 degrees

Method of use:

Please read carefully before using the product instruction

Large area before use, please do small area test

Please make sure that the sticking surface cleaning and drying

The best use of temperature should be between 18-32 degrees

The product after opening the cover please timely cover titch removal for the adhesive residue on the cover

Wait for 1-2 minutes , two adherend aligment bonding a little pressure

It is straight hours can be after 48 hours to achieve the best bonding strength

The product does not use the bottle cap to prevent glue after contacting air curing

Package included:

1x Strength Glue

CH004821
€6.09

110ml Multi-functional Adhesive Glue B-7000 For Mobile Phone Universal

wishlist
Compare

CP3015 Goot Wick Desoldering

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004827
€2.70

CP-3015 Goot Wick Desoldering

wishlist
Compare

Honton HT2024T Heating table constant temperature welding stage 220V

Honton HT-2024T Heating table constant temperature welding stage

HT 2024T item is used to melt the balls on the chip with ease. After putting the balls on the chip simply place the chip carefully on the plate and it will melt them into place. Has many other uses. Can be used for cleaning chips.

Voltage: 220V/110V

Heating Power: 800W

Temperature Range:25~350C

Temperature Fluctuation: 1

Heating Plate Size: 200x240x15mm

Weight:10KG

CH004832
€364.26

Honton HT-2024T Heating table constant temperature welding stage 220V

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Compare
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