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SNLINKV3 Sonix

Login to Download: Download software

Function

Debug the program with the simulation software, and support the simulation of 32bit-M0/8051/8-BIT E/mbedded ICE Series MCU.

(the simulation software must be keil mdk-armv4.53/m2ide v143 or later)

Note

Can be used with Starter kit STK_32FXXX for learning.

The self-developed Target board must pull out the SWD pin to debug with SN-LINK-V3.

Use with Starter kit STK_25EXX/26EXX/27EXX/22EXX/29EXX for learning.

The self-developed Target board must pull out EICK/EIDA pin to debug with SN-LINK-V3.

Use with Starter kit STK_57XX/58XX for learning.

The self-developed Target board must pull out the SWD pin to debug with SN-LINK-V3.

Supporting operating system: Win2000/XP-32bit/Vista-32bit/Win7-32bit/Win8.

CH004403
€61.54

SN-LINK-V3 Sonix

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G96650C1 9650MGT

G96-650-C1 9650MGT

Part Number G96-650-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002870
€25.93

G96-650-C1 9650MGT

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RT-Self Test Board-1 RT-Self Test Board-2 for RT809H programmer

The use of programmer selftest command,to check if there is problem itself.

Selftest way I:

Step 1 : Input the SELFTEST in the Enter chip printing,click

Step 2 : Click ,look at the hint in the display area,selftest 0 means the test pass;

Step 3 : Install the NO.1 test board and the short port of VGA ISP(short circuit the 4pins and 11pins,12pins and 15pins);

Step 4 : Click ,check the hint in the software,it will hint Selftest 1,test pass;

Step 5 : Install the NO.2 Self Test Board;

Step 6 : Click ,check the hint in the software,it will hint Selftest 2, test pass;

Selftest way II :

Step 1 : When there is no chip on the locking seat,input the type of 25XX in Enter Chip Printing;

Step 2 : Click ,it will hint that there is no chip or the locking seat hasnt been impacted well,which is normal;

If it hints that there may be a pin empty solder;

Attention : In the case of that some users have no test board,as long as the selftest 0 and 25 chip test pass,the machine is normal.

If there is other hints when doing selftest 0,the way to deal with it could be as following:

The problem of connection with computer and the programmer,please step-by examine according to the hint of failure process;

Hardware trouble like pin electric leakage,problems inside the pins,VPP open circuit,GND open circuit,VPP short circuit,VCC short circuit,GND short circuit,VPP protection not shut off,which must be returned to factory to repair.

CH004408
€4.97

RT-SelfTestBoard-1 RT-SelfTestBoard-2 for RT809H programmer

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N10PGSA3 GT240M

N10P-GS-A3 GT240M

Part Number N10P-GS-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1141

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002873
€26.06

N10P-GS-A3 GT240M

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21608330000 HD7670M

216-08330000 HD7670M

Part Number 216-0833000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002884
€69.62

216-08330000 HD7670M

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PRO250 nForce3

PRO-250 nForce3

Part Number PRO-250 nForce 3 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 04+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002903
€9.85

PRO-250 nForce3

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SR1LM J2850

SR1LM J2850

Part Number SR1LM J2850 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1LM J2850 FH8065301455104 Intel Pentium CPU BGA1170 2 41 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002907
€44.80

SR1LM J2850

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218S6ECLA21FG SB600

218S6ECLA21FG SB600

Part Number 218S6ECLA21FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002909
€5.22

218S6ECLA21FG SB600

SNLINKV3 Sonix

Login to Download: Download software

Function

Debug the program with the simulation software, and support the simulation of 32bit-M0/8051/8-BIT E/mbedded ICE Series MCU.

(the simulation software must be keil mdk-armv4.53/m2ide v143 or later)

Note

Can be used with Starter kit STK_32FXXX for learning.

The self-developed Target board must pull out the SWD pin to debug with SN-LINK-V3.

Use with Starter kit STK_25EXX/26EXX/27EXX/22EXX/29EXX for learning.

The self-developed Target board must pull out EICK/EIDA pin to debug with SN-LINK-V3.

Use with Starter kit STK_57XX/58XX for learning.

The self-developed Target board must pull out the SWD pin to debug with SN-LINK-V3.

Supporting operating system: Win2000/XP-32bit/Vista-32bit/Win7-32bit/Win8.

CH004403
€61.54

SN-LINK-V3 Sonix

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G96650C1 9650MGT

G96-650-C1 9650MGT

Part Number G96-650-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002870
€25.93

G96-650-C1 9650MGT

wishlist
Compare

RT-Self Test Board-1 RT-Self Test Board-2 for RT809H programmer

The use of programmer selftest command,to check if there is problem itself.

Selftest way I:

Step 1 : Input the SELFTEST in the Enter chip printing,click

Step 2 : Click ,look at the hint in the display area,selftest 0 means the test pass;

Step 3 : Install the NO.1 test board and the short port of VGA ISP(short circuit the 4pins and 11pins,12pins and 15pins);

Step 4 : Click ,check the hint in the software,it will hint Selftest 1,test pass;

Step 5 : Install the NO.2 Self Test Board;

Step 6 : Click ,check the hint in the software,it will hint Selftest 2, test pass;

Selftest way II :

Step 1 : When there is no chip on the locking seat,input the type of 25XX in Enter Chip Printing;

Step 2 : Click ,it will hint that there is no chip or the locking seat hasnt been impacted well,which is normal;

If it hints that there may be a pin empty solder;

Attention : In the case of that some users have no test board,as long as the selftest 0 and 25 chip test pass,the machine is normal.

If there is other hints when doing selftest 0,the way to deal with it could be as following:

The problem of connection with computer and the programmer,please step-by examine according to the hint of failure process;

Hardware trouble like pin electric leakage,problems inside the pins,VPP open circuit,GND open circuit,VPP short circuit,VCC short circuit,GND short circuit,VPP protection not shut off,which must be returned to factory to repair.

CH004408
€4.97

RT-SelfTestBoard-1 RT-SelfTestBoard-2 for RT809H programmer

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N10PGSA3 GT240M

N10P-GS-A3 GT240M

Part Number N10P-GS-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1141

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002873
€26.06

N10P-GS-A3 GT240M

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21608330000 HD7670M

216-08330000 HD7670M

Part Number 216-0833000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002884
€69.62

216-08330000 HD7670M

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RT80x80E IT8386E Transfer Board FFC Lline FPC Base

1. IT85 series simple adapter plate 1PCS

2. FFC Line 200MM 0.5mm-32P 1pcs

3. FFC Line 200MM 1.0mm-32P 1pcs

4. FPC Base Under 0.5mm-32P 1pcs

5. FPC Base Under 1.0mm-32P 1pcs

CH004447
€7.42

RT809H PEB-1 Extension Board IT8985E IT8595E IT8587E IT8586E IT8585E IT8580E IT8386E Transfer Board + FFC Lline FPC Base

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PRO250 nForce3

PRO-250 nForce3

Part Number PRO-250 nForce 3 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 04+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002903
€9.85

PRO-250 nForce3

wishlist
Compare

SR1LM J2850

SR1LM J2850

Part Number SR1LM J2850 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1LM J2850 FH8065301455104 Intel Pentium CPU BGA1170 2 41 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002907
€44.80

SR1LM J2850

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Compare

218S6ECLA21FG SB600

218S6ECLA21FG SB600

Part Number 218S6ECLA21FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002909
€5.22

218S6ECLA21FG SB600

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