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TI USB20 DSP Emulator XDS100 V2 DSPARM Core Emulator CCS4 CCS5 64bit

Features:

- USB2.0 high speed port(480Mbit/s)

- 14PIN standard JTAG port, support TI core processor

- Support multi processorss: TMS320C28x, TMS320C54x, TMS320C55x, TMS320C64x+, TMS320C674x, ARM 9, ARM Cortex R4, ARM Cortex A8

- Support power off detection

- Support FTDI device drive

- Support time self adaption

- Support Code Composer Studio v4 or above

- Support LED light display control USB connection

Operation System:

- Windows 2000

- Windows XP

- Windows Vista

- Windows 7

Package Included:

- 1* XDS100 V2 Emulator

- 1* USB 2.0 Cable

- 1* 14Pin flat cable

CH004499
€28.60

TI USB2.0 DSP Emulator XDS100 V2 DSP/ARM Core Emulator CCS4 CCS5 64bit

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N13MGE7BA1 GT610M

N13M-GE7-B-A1 GT610M

Part Number N13M-GE7-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1223

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002910
€34.43

N13M-GE7-B-A1 GT610M

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OBD2 Pin Out Box Breakout Box Tester OBD II Pin Connector Covere All Test Points

Obd2 Pin Out Box Breakout Box Tester Diagnostic Obd2 Pin Connector Covere All Test Points

Description:

This tool is used to change the pin settings of other diagnostic tools/scanners without the needs to cut the connecting cable for re-wiring. You can also quickly switch between different terminals of your vehicle's OBD socket when using beta software/hardware. Comes with a quality lead with 16 pins wired. With a 16 pin female OBD connector, 16 pin male OBD connector and 15 pin D plug to connect to the breakout box.

Features:

All test points covered.

Allows monitoring of any OBD2 diagnostic systems.

Quickly switch data points without soldering.

Ideal for checking vehicle\'s diagnostic status.

Package list:

1 x OBD Breakout box with all test points.

1 x Cable

CH004518
€24.86

OBD2 Pin Out Box Breakout Box Tester OBD II Pin Connector Covere All Test Points

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AM5745SIE44HL A105745M

AM5745SIE44HL A10-5745M

Part Number AM5745SIE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 1 PCS Description Brand new

AM5745SIE44HL A10-5745M Processor for Laptop AMD A-Series BGA827 2.1 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002916
€47.37

AM5745SIE44HL A10-5745M

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TQFP44 to DIP40 AVR adapter ATMEGA16 ATMEGA32 for RT809H TL866II XELTEK

Suitable for machine models & programmers, such as ALL-100GANG, ALL-11 series, LT-48 series, SuperPRO series, TOP series and all other programmers.

Support chips 1: ATmega16, ATmega32, ATmega8535, ATmega16A, ATmega32A, ATmeag164P, ATmega324P, ATmeag644P, ATmega1284P

Support chip 2: ATmega162, ATmega8515 and other related models need to be downloaded through ISP or JTAG

CH004534
€28.00

TQFP44 to DIP40 AVR adapter ATMEGA16 ATMEGA32 for RT809H TL866II XELTEK

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N11MGE2SB1 G310M

N11M-GE2-S-B1 G310M

Part Number N11M-GE2-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1332

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002923
€15.59

N11M-GE2-S-B1 G310M

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GL82B250 SR2WC

GL82B250 SR2WC

Part Number GL82B250 SR2WC Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002931
€39.35

GL82B250 SR2WC

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6pcs SOP4SOP28 TSSOP4TSSOP28 SMD to DIP Board for RT80x809F TL866II TL866A TL866CS TNM5000 6100N 610P XELTEK

SOP4-SOP28 SSOP4-TSSOP28 SMD to DIP Adapter Board (pin spacing 0.65mm/1.27mm)

Specific size chart:

Please check carefully before the size of the board for the pros and Cons: one side is applicable to the pin spacing 0.65mm (compatible with SSOP4~24 feet); the other side is applicable to the pin spacing 1.27mm (compatible with SOP4~24 feet)

HK000031
€6.80

6pcs SOP4-SOP28 TSSOP4-TSSOP28 SMD to DIP Board for RT809H RT809F TL866II TL866A TL866CS TNM5000 6100N 610P XELTEK

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G92700A2 8800MGTS

G92-700-A2 8800MGTS

Part Number G92-700-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002941
€48.90

G92-700-A2 8800MGTS

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N12PGEA1 GT520M

N12P-GE-A1 GT520M

Part Number N12P-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002951
€35.94

N12P-GE-A1 GT520M

TI USB20 DSP Emulator XDS100 V2 DSPARM Core Emulator CCS4 CCS5 64bit

Features:

- USB2.0 high speed port(480Mbit/s)

- 14PIN standard JTAG port, support TI core processor

- Support multi processorss: TMS320C28x, TMS320C54x, TMS320C55x, TMS320C64x+, TMS320C674x, ARM 9, ARM Cortex R4, ARM Cortex A8

- Support power off detection

- Support FTDI device drive

- Support time self adaption

- Support Code Composer Studio v4 or above

- Support LED light display control USB connection

Operation System:

- Windows 2000

- Windows XP

- Windows Vista

- Windows 7

Package Included:

- 1* XDS100 V2 Emulator

- 1* USB 2.0 Cable

- 1* 14Pin flat cable

CH004499
€28.60

TI USB2.0 DSP Emulator XDS100 V2 DSP/ARM Core Emulator CCS4 CCS5 64bit

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N13MGE7BA1 GT610M

N13M-GE7-B-A1 GT610M

Part Number N13M-GE7-B-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1223

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002910
€34.43

N13M-GE7-B-A1 GT610M

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OBD2 Pin Out Box Breakout Box Tester OBD II Pin Connector Covere All Test Points

Obd2 Pin Out Box Breakout Box Tester Diagnostic Obd2 Pin Connector Covere All Test Points

Description:

This tool is used to change the pin settings of other diagnostic tools/scanners without the needs to cut the connecting cable for re-wiring. You can also quickly switch between different terminals of your vehicle's OBD socket when using beta software/hardware. Comes with a quality lead with 16 pins wired. With a 16 pin female OBD connector, 16 pin male OBD connector and 15 pin D plug to connect to the breakout box.

Features:

All test points covered.

Allows monitoring of any OBD2 diagnostic systems.

Quickly switch data points without soldering.

Ideal for checking vehicle\'s diagnostic status.

Package list:

1 x OBD Breakout box with all test points.

1 x Cable

CH004518
€24.86

OBD2 Pin Out Box Breakout Box Tester OBD II Pin Connector Covere All Test Points

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AM5745SIE44HL A105745M

AM5745SIE44HL A10-5745M

Part Number AM5745SIE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1339

Package/Case 1 PCS Description Brand new

AM5745SIE44HL A10-5745M Processor for Laptop AMD A-Series BGA827 2.1 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002916
€47.37

AM5745SIE44HL A10-5745M

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TQFP44 to DIP40 AVR adapter ATMEGA16 ATMEGA32 for RT809H TL866II XELTEK

Suitable for machine models & programmers, such as ALL-100GANG, ALL-11 series, LT-48 series, SuperPRO series, TOP series and all other programmers.

Support chips 1: ATmega16, ATmega32, ATmega8535, ATmega16A, ATmega32A, ATmeag164P, ATmega324P, ATmeag644P, ATmega1284P

Support chip 2: ATmega162, ATmega8515 and other related models need to be downloaded through ISP or JTAG

CH004534
€28.00

TQFP44 to DIP40 AVR adapter ATMEGA16 ATMEGA32 for RT809H TL866II XELTEK

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N11MGE2SB1 G310M

N11M-GE2-S-B1 G310M

Part Number N11M-GE2-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1332

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002923
€15.59

N11M-GE2-S-B1 G310M

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Universal IC Socket Adapter SSOP20 TO DIP20 SSOP16 TO DIP16 SSOP14 220mil

Universal IC Socket SSOP20 seat (0.65 spacing), has a long service life, suitable for all SSOP20 SSOP16 SSOP14 chip.

The suitable model and programmer. Such as: ALL-100GANG, ALL-11 series, LT-48 series, SuperPRO series, TOP series programmer all

Support: suitable for all SSOPS20 chip packaging base

CH004550
€6.84

Universal IC Socket Adapter SSOP20 TO DIP20 / SSOP16 TO DIP16 / SSOP14 (220mil)

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GL82B250 SR2WC

GL82B250 SR2WC

Part Number GL82B250 SR2WC Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002931
€39.35

GL82B250 SR2WC

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6pcs SOP4SOP28 TSSOP4TSSOP28 SMD to DIP Board for RT80x809F TL866II TL866A TL866CS TNM5000 6100N 610P XELTEK

SOP4-SOP28 SSOP4-TSSOP28 SMD to DIP Adapter Board (pin spacing 0.65mm/1.27mm)

Specific size chart:

Please check carefully before the size of the board for the pros and Cons: one side is applicable to the pin spacing 0.65mm (compatible with SSOP4~24 feet); the other side is applicable to the pin spacing 1.27mm (compatible with SOP4~24 feet)

HK000031
€6.80

6pcs SOP4-SOP28 TSSOP4-TSSOP28 SMD to DIP Board for RT809H RT809F TL866II TL866A TL866CS TNM5000 6100N 610P XELTEK

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G92700A2 8800MGTS

G92-700-A2 8800MGTS

Part Number G92-700-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002941
€48.90

G92-700-A2 8800MGTS

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N12PGEA1 GT520M

N12P-GE-A1 GT520M

Part Number N12P-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002951
€35.94

N12P-GE-A1 GT520M

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