XELTEK SuperPRO 610P Universal Programmer can use for items list:

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Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Technical Specifications

Input/Output built-in 48 pin connector

Package Types DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP

Interface USB 2.0

Software compatible OS Windows XP, Windows Vista, Windows 7, Windows 8 (32/64 bit)

Power Supply Input 90 V-250 V AC, output 12 V DC/1.5 A

Size, L W H 178 130 40 mm

Weight 0.38 kg (without package)

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * PLCC44 to DIP44 Adaptador

1 * PLCC32 to DIP32 Adaptador

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * SOP16-DIP16 (300mil) Adaptador

1 * SOP20-DIP20 (300mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP20-DIP20 (170mil) Adaptador

1 * TSSOP24-DIP24 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SSOP20-DIP20 (220mil) Adaptador

1 * SSOP28-DIP28 (220mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adaptador

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adaptador

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adaptador

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adaptador

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adaptador

1 * PLCC44-DIP44

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP28

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * TSOP28Pin 0.65mm Adapter Board

1 * SOP28Pin 1.27mm Adapter Board

1 * TSOP20Pin 0.65mm Adapter Board

1 * SOP20Pin 1.27mm Adapter Board

1 * TSOP16Pin 0.65mm Adapter Board

1 * SOP16Pin 1.27mm Adapter Board

1 * TSOP14Pin 0.65mm Adapter Board

1 * SOP14Pin 1.27mm Adapter Board

1 * TSOP10Pin 0.65mm Adapter Board

1 * SOP10Pin 1.27mm Adapter Board

1 * TSOP8Pin 0.65mm Adapter Board

1 * SOP8Pin 1.27mm Adapter Board

1 * Multipurpose ISP-DuPont-Header Adapter

1 * Anti-Static Wristband Wrist Strap Band ESD Discharge PC Electricity Grounding

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

SR27G i3-5005U

Part Number i3-5005U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

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Function

Debug the program with the simulation software, and support the simulation of 32bit-M0/8051/8-BIT E/mbedded ICE Series MCU.

(the simulation software must be keil mdk-armv4.53/m2ide v143 or later)

Note

Can be used with Starter kit STK_32FXXX for learning.

The self-developed Target board must pull out the SWD pin to debug with SN-LINK-V3.

Use with Starter kit STK_25EXX/26EXX/27EXX/22EXX/29EXX for learning.

The self-developed Target board must pull out EICK/EIDA pin to debug with SN-LINK-V3.

Use with Starter kit STK_57XX/58XX for learning.

The self-developed Target board must pull out the SWD pin to debug with SN-LINK-V3.

Supporting operating system: Win2000/XP-32bit/Vista-32bit/Win7-32bit/Win8.

G96-650-C1 9650MGT

Part Number G96-650-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

The use of programmer selftest command,to check if there is problem itself.

Selftest way I:

Step 1 : Input the SELFTEST in the Enter chip printing,click

Step 2 : Click ,look at the hint in the display area,selftest 0 means the test pass;

Step 3 : Install the NO.1 test board and the short port of VGA ISP(short circuit the 4pins and 11pins,12pins and 15pins);

Step 4 : Click ,check the hint in the software,it will hint Selftest 1,test pass;

Step 5 : Install the NO.2 Self Test Board;

Step 6 : Click ,check the hint in the software,it will hint Selftest 2, test pass;

Selftest way II :

Step 1 : When there is no chip on the locking seat,input the type of 25XX in Enter Chip Printing;

Step 2 : Click ,it will hint that there is no chip or the locking seat hasnt been impacted well,which is normal;

If it hints that there may be a pin empty solder;

Attention : In the case of that some users have no test board,as long as the selftest 0 and 25 chip test pass,the machine is normal.

If there is other hints when doing selftest 0,the way to deal with it could be as following:

The problem of connection with computer and the programmer,please step-by examine according to the hint of failure process;

Hardware trouble like pin electric leakage,problems inside the pins,VPP open circuit,GND open circuit,VPP short circuit,VCC short circuit,GND short circuit,VPP protection not shut off,which must be returned to factory to repair.

N10P-GS-A3 GT240M

Part Number N10P-GS-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1141

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX2020 Adapter for XELTEK SuperPro 6100N

216-08330000 HD7670M

Part Number 216-0833000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

1. IT85 series simple adapter plate 1PCS

2. FFC Line 200MM 0.5mm-32P 1pcs

3. FFC Line 200MM 1.0mm-32P 1pcs

4. FPC Base Under 0.5mm-32P 1pcs

5. FPC Base Under 1.0mm-32P 1pcs

PRO-250 nForce3

Part Number PRO-250 nForce 3 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 04+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX3031 Adapter for XELTEK SuperPro 6100N

SR1LM J2850

Part Number SR1LM J2850 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1LM J2850 FH8065301455104 Intel Pentium CPU BGA1170 2 41 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock