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SR1EQ i34025U

SR1EQ i3-4025U

Part Number i3-4025U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003000
€100.10

SR1EQ i3-4025U

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SNADPVGA adpter for XGecu T56 Programmer support VGA interface HDMIcompatible

Login to Download: * VGA_adpter DIY for T56 Programmer

Package include:

one pcs SN-ADP-VGA adapter

one pcs VGA adapter cable

Note: please don't make a adapter by manually connection. HDMI-compatiblesignal working frequency up to 900mb / s. The different length of lines and the crossing of lines may make the HDMI-compatible can't work normally.

The VGA head on PCB board is female.

For serial printing and ISP on-line programming.

You can use VGA to USB3.0/USB2.0 cable and VGA to headset cable, can buy on website or do it yourself according to the wiring diagram. All kinds of lines can be recognized automatically by the software.

Please note:This adapter only can work on XGecu T56 programmer, other programmers cannot use it!!!

CH004686
€17.41

SN-ADP-VGA adpter for XGecu T56 Programmer support VGA interface HDMI-compatible

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N11MGE1SA3 GT210M

N11M-GE1-S-A3 GT210M

Part Number N11M-GE1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003006
€16.87

N11M-GE1-S-A3 GT210M

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2180697014 SB820

218-0697014 SB820

Part Number 218-0697014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1007

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003012
€25.21

218-0697014 SB820

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G94706B1 9800MGTS

G94-706-B1 9800MGTS

Part Number G94-701-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0910

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003018
€36.10

G94-706-B1 9800MGTS

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N10PNSA2 GT240M

N10P-NS-A2 GT240M

Part Number N10P-NS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0925

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003028
€31.67

N10P-NS-A2 GT240M

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G86743A2

G86-743-A2

Part Number G86-743-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003051
€55.47

G86-743-A2

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SR24B 3825U

SR24B 3825U

Part Number 3825U SR24B Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003061
€78.77

SR24B 3825U

SR1EQ i34025U

SR1EQ i3-4025U

Part Number i3-4025U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003000
€100.10

SR1EQ i3-4025U

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SNADPVGA adpter for XGecu T56 Programmer support VGA interface HDMIcompatible

Login to Download: * VGA_adpter DIY for T56 Programmer

Package include:

one pcs SN-ADP-VGA adapter

one pcs VGA adapter cable

Note: please don't make a adapter by manually connection. HDMI-compatiblesignal working frequency up to 900mb / s. The different length of lines and the crossing of lines may make the HDMI-compatible can't work normally.

The VGA head on PCB board is female.

For serial printing and ISP on-line programming.

You can use VGA to USB3.0/USB2.0 cable and VGA to headset cable, can buy on website or do it yourself according to the wiring diagram. All kinds of lines can be recognized automatically by the software.

Please note:This adapter only can work on XGecu T56 programmer, other programmers cannot use it!!!

CH004686
€17.41

SN-ADP-VGA adpter for XGecu T56 Programmer support VGA interface HDMI-compatible

wishlist
Compare

N11MGE1SA3 GT210M

N11M-GE1-S-A3 GT210M

Part Number N11M-GE1-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003006
€16.87

N11M-GE1-S-A3 GT210M

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XGADPBGA64A10 Adapter For XGecu T56 Programmer

XG-ADP-BGA64A-1.0mm spacing frame 11*13mm Adapt to S29GL512 S29GL256 S29GL128 S29GL064 S29GL032

XG-ADP-BGA64A-1.0mm spacing frame 10*13mm Adapt to 28F640,28F128

XG-ADP-BGA64A-1.0mm spacing frame 10*15mm Adapt to 28F256

CH004708
€53.46

XG-ADP-BGA64A-1.0 Adapter For XGecu T56 Programmer

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2180697014 SB820

218-0697014 SB820

Part Number 218-0697014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1007

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003012
€25.21

218-0697014 SB820

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G94706B1 9800MGTS

G94-706-B1 9800MGTS

Part Number G94-701-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0910

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003018
€36.10

G94-706-B1 9800MGTS

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N10PNSA2 GT240M

N10P-NS-A2 GT240M

Part Number N10P-NS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0925

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003028
€31.67

N10P-NS-A2 GT240M

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G86743A2

G86-743-A2

Part Number G86-743-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003051
€55.47

G86-743-A2

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SR24B 3825U

SR24B 3825U

Part Number 3825U SR24B Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003061
€78.77

SR24B 3825U

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