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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

2150804119

215-0804119

Part Number 215-0804119 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1442

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000330
€35.35

215-0804119

Intersil ISL95870A UTQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000272
€3.45

Intersil ISL95870A UTQFN

SR23V i75600U

i7-5600U SR23V

Part Number SR23V i7-5600U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000333
€237.95

SR23V i7-5600U

ASUS Car charger for notebook 19V 342A 65W 5525mm

ASUS Car charger for notebook 19V 3.42A 65W 5.5*2.5mm

Type DC/In-Car Manufacturer ASUS

Input DC11 - 15V max 10A Connecter Size 5.5*2.5mm

Output 19V 3.42A Condition Brand New

Compatible With:

This DC car charger is also compatible with the following models:

Asus A2 Series: A2L, A2000L

Asus A3 Series: A3A, A3Ac, A3000A, A3000Ac, A3E, A3000E, A3H, A3000H, A3L, A3000L, A3N, A3000N

Asus A5 series: A5E,A5Eb,A5Ec

Asus A6 Series: A6N, A6Ne, A6000N, A6000Ne, A6Rp, A6000Rp, A6U, A6000U, A6Vc, A6000Vc

Asus A8 Series: A8E, A8F, A8H, A8Ja, A8Jc, A8Jm, A8Jn, A8Jr, A8Jv, A8m, A8Le, A8He, A8Fm

Asus A9 Series: A9Rp, A9T

Asus B5 Series: B50A

Asus F3 Series: F3F, F3Jm, F3Jv

Asus F5 series: F5R

Asus F9 Series: F9E, F9J

Asus L2 Series: L2E, L2000E

Asus L3 Series: L3C, L3S, L3000C, L3000S, L34, L34C, L3400, L3400C

Asus L4 Series: L4E, L4R, L4000E, L4000R

Asus M2 Series: M2A, M2E, M2000A, M2000E, M2N, M2Ne, M2000N, M2000Ne

Asus M24 Series: M24, M24A, M24E, M24N, M2400, M2400A, M2400E, M2400N

Asus M3 Series: M3 M3000 M3N M3000N M3NP M3000NP

Asus M52 Series: M52A, M52Ae, M5200A, M5200Ae

Asus M6 Series: M6BN, M6BNe, M6000BN, M6000BNe, M6N, M6Ne, M6000, M6000N, M6000Ne, M6000r

Asus N10 Series: N10E, N10J, N10Jc

Asus R1 Series: R1E, R1F

Asus S1 Series: S1N, S13N, S1000N, S1300N

Asus S6 Series: S6F, S6Fm

Asus S7 series: S7F

Asus S9 Series: S96F, S96Fm VBI

ASUS U1 series: U1E, U1F

ASUS U2 series: U2E

ASUS U5 series: U5A, U5F-

ASUS U6 series: U6E, U6Ep

Asus V6 Series: V6, V6J, V6000, V6000J, V6V, V6Va, V6000V, V6000Va

Asus V68 Series: V68, V68V, V6800, V6800V

Asus W1 Series: W1, W1N, W1000, W1000N

Asus W5 Series: W5A, W5000A, W5Ae, W5000Ae, W5F, W5Fe, W5Fm, W5000F, W5000Fe, W5000Fm

Asus W6 series: W6A,W6F-,W6Fp-

Asus W7 series: W7F

Asus X50 series: X51L,X51H,X51RL,X51R

Asus X80 series: X80Le

Asus Z35 Series: Z35, Z35Fm, Z3500, Z3500Fm

Asus Z61 Series: Z61A, A61Ae, Z6100A, Z6100Ae

Asus Z63 Series: Z63A, Z6300A

Asus Z70 Series: Z70A, Z7000, Z7000A, Z70V, Z70Va, Z7000V, Z7000Va, Z70N, Z70Ne, Z7000N, Z7000Ne

Asus Z71 Series: Z71, Z71A, Z7100, Z7100A, Z71V, Z7100V, Z71Vp, Z7100Vp

Asus Z84 Series: Z84F, Z8400F

Asus Z9 Series: Z9, Z9000

Asus Z91 Series: Z91A, Z91Ac, Z9100A, Z9100Ac, Z91E, Z9100E, Z91F, Z91Fc, Z9100F, Z9100Fc, Z91N, Z9100N

Asus Z92 Series: Z92Km, Z9200Km

Asus Z93 Series: Z93E, Z9300E

Asus Z96 Series: Z96F, Z96Fm, Z9600F, Z9600Fm

Asus Lamborghini VX1

Asus SW1 VBI, U1E, U1F, U2E, U6E

CH001574
€16.04

ASUS Car charger for notebook 19V 3.42A 65W 5.5*2.5mm

NUVOTON NPCE794LAODX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000273
€3.97

NUVOTON NPCE794LAODX

N11EGEA1 GTX460M

N11E-GE-A1 GTX460M

Part Number N11E-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1045

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000339
€45.95

N11E-GE-A1 GTX460M

DH82HM87 SR17D

DH82HM87 SR17D

Part Number DH82HM87 SR17D Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000349
€62.36

DH82HM87 SR17D

AK09911

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000281
€3.45

AK09911

IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

2150804119

215-0804119

Part Number 215-0804119 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1442

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000330
€35.35

215-0804119

Intersil ISL95870A UTQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000272
€3.45

Intersil ISL95870A UTQFN

SR23V i75600U

i7-5600U SR23V

Part Number SR23V i7-5600U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000333
€237.95

SR23V i7-5600U

ASUS Car charger for notebook 19V 342A 65W 5525mm

ASUS Car charger for notebook 19V 3.42A 65W 5.5*2.5mm

Type DC/In-Car Manufacturer ASUS

Input DC11 - 15V max 10A Connecter Size 5.5*2.5mm

Output 19V 3.42A Condition Brand New

Compatible With:

This DC car charger is also compatible with the following models:

Asus A2 Series: A2L, A2000L

Asus A3 Series: A3A, A3Ac, A3000A, A3000Ac, A3E, A3000E, A3H, A3000H, A3L, A3000L, A3N, A3000N

Asus A5 series: A5E,A5Eb,A5Ec

Asus A6 Series: A6N, A6Ne, A6000N, A6000Ne, A6Rp, A6000Rp, A6U, A6000U, A6Vc, A6000Vc

Asus A8 Series: A8E, A8F, A8H, A8Ja, A8Jc, A8Jm, A8Jn, A8Jr, A8Jv, A8m, A8Le, A8He, A8Fm

Asus A9 Series: A9Rp, A9T

Asus B5 Series: B50A

Asus F3 Series: F3F, F3Jm, F3Jv

Asus F5 series: F5R

Asus F9 Series: F9E, F9J

Asus L2 Series: L2E, L2000E

Asus L3 Series: L3C, L3S, L3000C, L3000S, L34, L34C, L3400, L3400C

Asus L4 Series: L4E, L4R, L4000E, L4000R

Asus M2 Series: M2A, M2E, M2000A, M2000E, M2N, M2Ne, M2000N, M2000Ne

Asus M24 Series: M24, M24A, M24E, M24N, M2400, M2400A, M2400E, M2400N

Asus M3 Series: M3 M3000 M3N M3000N M3NP M3000NP

Asus M52 Series: M52A, M52Ae, M5200A, M5200Ae

Asus M6 Series: M6BN, M6BNe, M6000BN, M6000BNe, M6N, M6Ne, M6000, M6000N, M6000Ne, M6000r

Asus N10 Series: N10E, N10J, N10Jc

Asus R1 Series: R1E, R1F

Asus S1 Series: S1N, S13N, S1000N, S1300N

Asus S6 Series: S6F, S6Fm

Asus S7 series: S7F

Asus S9 Series: S96F, S96Fm VBI

ASUS U1 series: U1E, U1F

ASUS U2 series: U2E

ASUS U5 series: U5A, U5F-

ASUS U6 series: U6E, U6Ep

Asus V6 Series: V6, V6J, V6000, V6000J, V6V, V6Va, V6000V, V6000Va

Asus V68 Series: V68, V68V, V6800, V6800V

Asus W1 Series: W1, W1N, W1000, W1000N

Asus W5 Series: W5A, W5000A, W5Ae, W5000Ae, W5F, W5Fe, W5Fm, W5000F, W5000Fe, W5000Fm

Asus W6 series: W6A,W6F-,W6Fp-

Asus W7 series: W7F

Asus X50 series: X51L,X51H,X51RL,X51R

Asus X80 series: X80Le

Asus Z35 Series: Z35, Z35Fm, Z3500, Z3500Fm

Asus Z61 Series: Z61A, A61Ae, Z6100A, Z6100Ae

Asus Z63 Series: Z63A, Z6300A

Asus Z70 Series: Z70A, Z7000, Z7000A, Z70V, Z70Va, Z7000V, Z7000Va, Z70N, Z70Ne, Z7000N, Z7000Ne

Asus Z71 Series: Z71, Z71A, Z7100, Z7100A, Z71V, Z7100V, Z71Vp, Z7100Vp

Asus Z84 Series: Z84F, Z8400F

Asus Z9 Series: Z9, Z9000

Asus Z91 Series: Z91A, Z91Ac, Z9100A, Z9100Ac, Z91E, Z9100E, Z91F, Z91Fc, Z9100F, Z9100Fc, Z91N, Z9100N

Asus Z92 Series: Z92Km, Z9200Km

Asus Z93 Series: Z93E, Z9300E

Asus Z96 Series: Z96F, Z96Fm, Z9600F, Z9600Fm

Asus Lamborghini VX1

Asus SW1 VBI, U1E, U1F, U2E, U6E

CH001574
€16.04

ASUS Car charger for notebook 19V 3.42A 65W 5.5*2.5mm

NUVOTON NPCE794LAODX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000273
€3.97

NUVOTON NPCE794LAODX

N11EGEA1 GTX460M

N11E-GE-A1 GTX460M

Part Number N11E-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1045

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000339
€45.95

N11E-GE-A1 GTX460M

DH82HM87 SR17D

DH82HM87 SR17D

Part Number DH82HM87 SR17D Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000349
€62.36

DH82HM87 SR17D

AK09911

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000281
€3.45

AK09911