Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

universal AC ADAPTER 90W

215-0804119

Part Number 215-0804119 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1442

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

1 set DC Power 5.5*2.1mm Jack to 8 Plug Adapter Notebook + SAMSUNG HP Connector

i7-5600U SR23V

Part Number SR23V i7-5600U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

ASUS Car charger for notebook 19V 3.42A 65W 5.5*2.5mm

Type DC/In-Car Manufacturer ASUS

Input DC11 - 15V max 10A Connecter Size 5.5*2.5mm

Output 19V 3.42A Condition Brand New

Compatible With:

This DC car charger is also compatible with the following models:

Asus A2 Series: A2L, A2000L

Asus A3 Series: A3A, A3Ac, A3000A, A3000Ac, A3E, A3000E, A3H, A3000H, A3L, A3000L, A3N, A3000N

Asus A5 series: A5E,A5Eb,A5Ec

Asus A6 Series: A6N, A6Ne, A6000N, A6000Ne, A6Rp, A6000Rp, A6U, A6000U, A6Vc, A6000Vc

Asus A8 Series: A8E, A8F, A8H, A8Ja, A8Jc, A8Jm, A8Jn, A8Jr, A8Jv, A8m, A8Le, A8He, A8Fm

Asus A9 Series: A9Rp, A9T

Asus B5 Series: B50A

Asus F3 Series: F3F, F3Jm, F3Jv

Asus F5 series: F5R

Asus F9 Series: F9E, F9J

Asus L2 Series: L2E, L2000E

Asus L3 Series: L3C, L3S, L3000C, L3000S, L34, L34C, L3400, L3400C

Asus L4 Series: L4E, L4R, L4000E, L4000R

Asus M2 Series: M2A, M2E, M2000A, M2000E, M2N, M2Ne, M2000N, M2000Ne

Asus M24 Series: M24, M24A, M24E, M24N, M2400, M2400A, M2400E, M2400N

Asus M3 Series: M3 M3000 M3N M3000N M3NP M3000NP

Asus M52 Series: M52A, M52Ae, M5200A, M5200Ae

Asus M6 Series: M6BN, M6BNe, M6000BN, M6000BNe, M6N, M6Ne, M6000, M6000N, M6000Ne, M6000r

Asus N10 Series: N10E, N10J, N10Jc

Asus R1 Series: R1E, R1F

Asus S1 Series: S1N, S13N, S1000N, S1300N

Asus S6 Series: S6F, S6Fm

Asus S7 series: S7F

Asus S9 Series: S96F, S96Fm VBI

ASUS U1 series: U1E, U1F

ASUS U2 series: U2E

ASUS U5 series: U5A, U5F-

ASUS U6 series: U6E, U6Ep

Asus V6 Series: V6, V6J, V6000, V6000J, V6V, V6Va, V6000V, V6000Va

Asus V68 Series: V68, V68V, V6800, V6800V

Asus W1 Series: W1, W1N, W1000, W1000N

Asus W5 Series: W5A, W5000A, W5Ae, W5000Ae, W5F, W5Fe, W5Fm, W5000F, W5000Fe, W5000Fm

Asus W6 series: W6A,W6F-,W6Fp-

Asus W7 series: W7F

Asus X50 series: X51L,X51H,X51RL,X51R

Asus X80 series: X80Le

Asus Z35 Series: Z35, Z35Fm, Z3500, Z3500Fm

Asus Z61 Series: Z61A, A61Ae, Z6100A, Z6100Ae

Asus Z63 Series: Z63A, Z6300A

Asus Z70 Series: Z70A, Z7000, Z7000A, Z70V, Z70Va, Z7000V, Z7000Va, Z70N, Z70Ne, Z7000N, Z7000Ne

Asus Z71 Series: Z71, Z71A, Z7100, Z7100A, Z71V, Z7100V, Z71Vp, Z7100Vp

Asus Z84 Series: Z84F, Z8400F

Asus Z9 Series: Z9, Z9000

Asus Z91 Series: Z91A, Z91Ac, Z9100A, Z9100Ac, Z91E, Z9100E, Z91F, Z91Fc, Z9100F, Z9100Fc, Z91N, Z9100N

Asus Z92 Series: Z92Km, Z9200Km

Asus Z93 Series: Z93E, Z9300E

Asus Z96 Series: Z96F, Z96Fm, Z9600F, Z9600Fm

Asus Lamborghini VX1

Asus SW1 VBI, U1E, U1F, U2E, U6E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N11E-GE-A1 GTX460M

Part Number N11E-GE-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1045

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DH82HM87 SR17D

Part Number DH82HM87 SR17D Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock