Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Important !!! Before placing an order please to check back cover information  Model , EMC !!!

In package:

EFI Bios card  x 1 pcs

Compatible: For Late 2013 A1502 820-3536 EMC 2678

This chip card can be used for:

    It will Fix EFI  ( 4 pin, 6 pin, cloud)
    It will Fix Corrupted Firmware
    Disabled Mac
    MDM, DEP Profile, NVME

Chip will come with a clean S/N.

(It will NOT remove the operating system password or Hard Drive password)

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Full list in our store :

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect  - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

TL631-Pro Diagnosis Card + MINI PCIE + A-DEBUG Desktop PCI Mainboard PCI-e Notebook Debugging Card Apple PC LPC Debug

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description

Condition: new and original

Note : Due to post air mail can not send button battery (CR2032 ,3.2V) , so we will not send button battery , please you buy from your hometown. thank you so much !

Package includes:

1 * Tester (No English Manual)

Important !!! Before placing an order please to check back cover information  Model , EMC !!!

In package:

EFI Bios card  x 1 pcs

Compatible: For Early 2014 A1466 820-3437 EMC 2632

This chip card can be used for:

    It will Fix EFI  ( 4 pin, 6 pin, cloud)
    It will Fix Corrupted Firmware
    Disabled Mac
    MDM, DEP Profile, NVME

Chip will come with a clean S/N.

(It will NOT remove the operating system password or Hard Drive password)

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Full list in our store :

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect  - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Mini PCI/Mini PCI-E/LPC Combo-Debug-Card VIP version Notebook Combo-Debug-Card (VIP Version) User Guide

This notebook Combo-Debug Card Uses 4-layers PCB design to provide a very stable signal quality. Also, it uses Tantalum capacitance to provide good power supply. So this VIP version Debug card is more suitable to be used in poor environment. This VIP version is the upgraded version of the Combo-Debug-Card, and it supports three bus interfaces: MINI PCI, MINI PCI-E and LPC. This product is easy to use, and is designed with good stability. It is your ideal tool for notebook repair.

combo ?debug- card structure and usage

1. Mini-PCI interface:

This is used to connect this Combo Debug Card to notebooks Mini-PCI slot.

2. Mini-PCI-E interface:

This is used to connect this Combo Debug Card to notebooks Mini-PCI-e slot

3. LPC interface:

This is used to connect this Combo Debug Card to notebooks LPC connector.

4. ASIC

5. Two 7-segment LEDS:

This is used to display the Error-code

6. Test port:

This port is reserved, and end-user should not use this port.

7. indicator : this is for showing the status of CLK and RST signal.

The Mini-PCI interface in the Combo-Debug-Card

Mini PCI is a general interface, which is used in notebook. It includes 124 pins. This combo-debug-card doesnt fully use those pins, and only 101 pins are used. When installing this combo-debug-card to your notebook main-board , you will find the combo-debug-card is shorter than the notebook Mini-PCI slot. This is correct, and it servers better for you to plug or unplug this combo-debug-card.

The Mini-PCI-e interface in the Combo-Debug-Card

Mini-PCI is used as a trend in the new notebooks. Comparing to Mini-PCI, Mini-PCI-e occupies less space. This Combo-Debug-Card doesnt use all of the Mini-PCI-e bus pins. And only the below pins are used: PIN-8, PIN-10, PIN-12, PIN-14, PIN-16, PIN-17, and PIN-19. in the Mini-PCI-e spec, those pins are reserved, and it is not standard, so some of Notebook manufacturers define it as a LPC debug-port. And more and more notebook manufacturers are using this standard, such as IBM, Toshiba, HP, ASUS, TCL and etc??this Combo-Debug-Card can only work in the notebooks, which are with the LPC debug-port definition. For the notebooks, which dont support this LPC debug-port definition, this Combo-debug-card PCI-E interface will not work.

Note: Please be aware that Mini-PCI-e is supported with limitation, and it can works in most of notebooks, but not all.

The LPC interface in the Combo-Debug-Card

For the user, whose notebooks dont support the Mini-PCI interface and the Mini-PCI-e interface, you can use the third port: LPC interface. LPC interface exists in all notebook main-boards. In the Combo-Debug-Card, from left to right, the LPC definition is:

PIN1-LFRAME?, PIN2-LAD3, PIN3-LAD2, PIN4-LAD1, PIN5-LAD0, PIN6-GND, PIN7-LRESET?, PIN8- LCLK, PIN9-3.3V

Usually, the notebook boards havent LPC connectors or slots. And the users will need to connect this LPC port to the notebook by using wires. Below is some description for how to connect the Combo-Debug-Card to your notebook through this LPC interface.

If your notebooks use LPC VBIOS, you can connect the Combo-Debug-Card to your notebooks VBIOS bus.

LPC VBIOS Pin definition:

PIN2-RST? PIN13-LAD0 PIN14-LAD1 PIN15-LAD2 PIN16-GND PIN17-LAD3 PIN23-LFRAME? PIN25-VCC PIN31-CLK

You can connect this Combo-Debug-Card to any LPC bus. Some LPC interface chips are listed as below. You can connect the Combo-Debug-Card to the corresponding pins. For more information, please refer those chips datasheets.

Note: this Combo-Debug-Card uses 3.3V as power supply, and you can use any 3V3 and GND signals in your notebook main-board. Please be aware that connecting the Combo-Debug-Card to a non-3.3V power may damage this Combo-Debug-Card.

For IBM X 60 notebooks, the LPC interfaces are located in the U39 slot of the main-board. The Pin definitions are as below: A2->LRESET? A3->LFRAME? A5->LCLK A9->LAD3 A10->LAD2 A11->LAD1 A12->LAD0

For IBM T6 R6 notebooks, the LPC interfaces are located in the J26 slot of the main-board. The Pin definitions are as below: A1->LCLK, A3->LFRAME? B2->LRESET? B7->LAD3 A7->LAD2 B6->LAD1 A6->LAD0

The LED-Display in the Combo-Debug-Card

The Display includes Error-Code display, Bus-Type display, and CLK,RST signal, status display .

1, Error-Code display: It is composed with two 7-segment LED s.

2, Bus-Type display: The two Dots of the LED s are used to indicate the notebook bus type. The left side Dot is for Mini-PCI bus, and the right side Dot is for Mini-PCI-e and LPC bus. When the notebook works in Mini-PCI bus, the right side Dot will be lighted.

3, CLK, RST signal status display: when you hold on the notebooks RESET button, the RST indicator will be lighted, and the CLK indicator will be off. When you release the notebook RESET button, the RST indicator will be off, and the CLK indicator will be twinkled.

Part of Error-Code explanation

When the notebooks are running, this Combo-Debug-Card will show the corresponding debug code. If there is a problem in the notebook, you can judge the problem by the debug code. Below is the explanation for some main error codes.

AWARD BIOS:The explanation when the Combo-Debug-Card shows the below debug codes.

Code Explanation

C0 Close cache

01 Processor test

07 CMOS test

C1 Memory size test

0A Set the interrupt table

0C Initiate the keyboard

0D Initiate the Graphic card

1A Show CPU frequency

3C CMOS setting

42 Initiate hardware

52 Test the extended ROM

FF Boot

AMI BIOS: The explanation when the Combo-Debug-Card shows the below debug codes.

Code Explanation

00 Error in self test

01 Error in processor test

0D,0F Error in CMOS test

1A~22 Error in Memory test

3A Error in graphic card

FF Pass the self test

Q/A

Question: RST indicator is off, but CLK indicator is NOT twinkled.

Answer: this symptom shows there is no CLK signal for debug card so that the CLK indicator isnt twinkled .Usually, it may mean the motherboard can NOT support this Mini-PCI-e interface. Please use Mini-PCI or LPC interface to test it.

Question: RST indicator is off ,and CLK indicator is twinkled. But it shows 00

Answer: In this case, please check the Bus-Type display to check if the Bus-Type display is corresponding to the bus type.

Important !!! Before placing an order please to check back cover information  Model , EMC !!!

In package:

EFI Bios card  x 1 pcs

Compatible: For Mid 2013 A1466 820-3437 EMC 2632

This chip card can be used for:

    It will Fix EFI  ( 4 pin, 6 pin, cloud)
    It will Fix Corrupted Firmware
    Disabled Mac
    MDM, DEP Profile, NVME

Chip will come with a clean S/N.

(It will NOT remove the operating system password or Hard Drive password)

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Full list in our store :

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect  - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Featuring LPC and Compal NGFF interfaces, this multifaceted device offers compatibility with a wide range of systems, ensuring versatility across various platforms. Whether troubleshooting desktops, laptops, or embedded systems, our POST card delivers accurate diagnostic data to streamline fault identification and resolution.

Designed with advanced circuitry and robust construction, our POST card guarantees reliability and durability in demanding environments. Its compact form factor and user-friendly interface make it an indispensable tool for technicians, enabling swift and efficient troubleshooting without the need for complex setup procedures.

Stay ahead of technical issues and minimize downtime with our Universal Multi-function POST Card LPC + Compal NGFF. From system builders to IT professionals, this essential diagnostic tool is the ultimate solution for ensuring optimal performance and reliability in today's fast-paced computing landscape.