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  • Categories: Other BGA Chips & ICs
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GMT G547I2P81U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000302
€3.45

GMT G547I2P81U

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DC Power Jack Part PJ052

Dell Latitude DC Power Jack Connector: E5410, E5510

Dell Studio Series DC Power Jack Connector: 1569

HP Compaq NC Series DC Power Jack Connector: NC8430

HP Compaq NW Series DC Power Jack Connector: NW8440, NW9440

HP Compaq NX Series DC Power Jack Connector: NX7300, NX7400, NX8420, NX9410, NX9420

HP Elitebook DC Power Jack Connector: 6930P

HP Mini 2100 Notebook PC Series DC Power Jack Connector: 2133, 2140

CH001105
€3.61

DC Power Jack, Part #PJ052

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OZMICRO OZ813

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000303
€3.45

OZMICRO OZ813

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Asus Pro551L Dell Inspiron 14 15 Series E5250 DC30100QM00 08JJ7T DC Power Jack

Details:

Asus Pro551L Pro551LA Pro551LD Dell Inspiron 14 5455 15 5555 5558 Series Laptop Genuine OEM Original AC DC Power Jack Socket Connector Charging Port Replacement

Item SKU: A196001

Item Specification:

DC Power Jack Socket Connector Charging Port

Item Status: New, Genuine OEM, Original, Top Quality

Compatible Laptop Models:

Asus Pro551L Pro551LA Pro551LD Series

Dell Inspiron 14-5455 Series

Dell Inspiron 15-5000 15-5555 15-5558 Series

CH001192
€4.10

Asus Pro551L Dell Inspiron 14 15 Series E5250 DC30100QM00 08JJ7T DC Power Jack

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LUPXA255A0C400 MARVELL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000310
€24.62

LUPXA255A0C400 MARVELL

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Intersil ISL6266A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000313
€3.45

Intersil ISL6266A

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NUVOTON NCT5573D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000316
€7.94

NUVOTON NCT5573D

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Maxim MAX17480GTL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000317
€3.45

Maxim MAX17480GTL

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ASUS ZenPad 10 Micro USB Charging Port P023 Z380C P022 80 Z300CG Z300CL

Compatibility :

ASUS ZenPad 10 Z300C P023

ASUS ZenPad 8.0 Z380C P022

ASUS ZenPad 10 Z300M

ASUS ZenPad 10 Z300CG

ASUS ZenPad 10 Z300CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001341
€3.98

ASUS ZenPad 10 Micro USB Charging Port P023 Z380C P022 8.0 Z300CG Z300CL

GMT G547I2P81U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000302
€3.45

GMT G547I2P81U

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DC Power Jack Part PJ052

Dell Latitude DC Power Jack Connector: E5410, E5510

Dell Studio Series DC Power Jack Connector: 1569

HP Compaq NC Series DC Power Jack Connector: NC8430

HP Compaq NW Series DC Power Jack Connector: NW8440, NW9440

HP Compaq NX Series DC Power Jack Connector: NX7300, NX7400, NX8420, NX9410, NX9420

HP Elitebook DC Power Jack Connector: 6930P

HP Mini 2100 Notebook PC Series DC Power Jack Connector: 2133, 2140

CH001105
€3.61

DC Power Jack, Part #PJ052

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OZMICRO OZ813

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000303
€3.45

OZMICRO OZ813

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Asus Pro551L Dell Inspiron 14 15 Series E5250 DC30100QM00 08JJ7T DC Power Jack

Details:

Asus Pro551L Pro551LA Pro551LD Dell Inspiron 14 5455 15 5555 5558 Series Laptop Genuine OEM Original AC DC Power Jack Socket Connector Charging Port Replacement

Item SKU: A196001

Item Specification:

DC Power Jack Socket Connector Charging Port

Item Status: New, Genuine OEM, Original, Top Quality

Compatible Laptop Models:

Asus Pro551L Pro551LA Pro551LD Series

Dell Inspiron 14-5455 Series

Dell Inspiron 15-5000 15-5555 15-5558 Series

CH001192
€4.10

Asus Pro551L Dell Inspiron 14 15 Series E5250 DC30100QM00 08JJ7T DC Power Jack

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LUPXA255A0C400 MARVELL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000310
€24.62

LUPXA255A0C400 MARVELL

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Intersil ISL6266A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000313
€3.45

Intersil ISL6266A

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NUVOTON NCT5573D

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000316
€7.94

NUVOTON NCT5573D

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Maxim MAX17480GTL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000317
€3.45

Maxim MAX17480GTL

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ASUS ZenPad 10 Micro USB Charging Port P023 Z380C P022 80 Z300CG Z300CL

Compatibility :

ASUS ZenPad 10 Z300C P023

ASUS ZenPad 8.0 Z380C P022

ASUS ZenPad 10 Z300M

ASUS ZenPad 10 Z300CG

ASUS ZenPad 10 Z300CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001341
€3.98

ASUS ZenPad 10 Micro USB Charging Port P023 Z380C P022 8.0 Z300CG Z300CL

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