• Show Sidebar

There are 2058 products.

Active filters

  • Categories: Other BGA Chips & ICs
  • Categories: Programmer & Sockets
  • Categories: Programmer socket
wishlist
Compare
Quickview

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

CH000491
€60.92

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

wishlist
Compare
Quickview

ITE IT8512E KXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000284
€3.45

ITE IT8512E KXA

wishlist
Compare
Quickview

TI TPS2061 DGN8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000289
€3.45

TI TPS2061 DGN8

wishlist
Compare
Quickview

RICHTEK RT8202A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000292
€3.45

RICHTEK RT8202A

wishlist
Compare
Quickview

OZMICRO OZ8682

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000297
€3.45

OZMICRO OZ8682

wishlist
Compare
Quickview

GMT G547I2P81U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000302
€3.45

GMT G547I2P81U

wishlist
Compare
Quickview

TOP3000 Universal Programmer for MCU and EPROMs Programming ECU Chip Tunning

TOP3000 Auto Car Universal Programmer for MCU and EPROMs programming ECU Chip Tunning Tool

Login to Download: Download software

Specifications:

? Power supply input: 110 ~ 240VAC, 50/60Hz

? Power output: 5VDC, 2A

? Included: TOP3000 programmer,software CD, USB cable, power supply cable

Benefits:

? The TOP3000 programmer supports 2.5 ~ 6.5V devices

? Powered by your USB interface or the included 5V external power supply

? Fast transmission speed of 12MHz/s via the USB port

? Auto detects the device's manufacturer and part number

? Compatible with Notebooks and desktop computers

? The in-built connection inspection checks the connection for every pins in the unit

? Current protection function protects both the programmer and connected devices

? Has 48-pin self-lock sockets

? Compact programmer with tough plastic casing

Supports:

Actrans (EEPROM)

AMD (PLD, MPU, EPROM, EEPROM)

AMIC (EEPROM)

ASD (EEPROM)

Atmel (PLD, MPU, EPROM, EEPROM)

BDTIC (RAM)

Catalyst (EPROM, EEPROM)

Crescentec (MPU)

Dallas (RAM, MPU, EEPROM)

Elan (MPU)

EON (EEPROM)

EXEL (EEPROM)

Fujitsu (EPROM, EEPROM)

Future (MPU)

Hitachi (EPROM, EEPROM)

HMWIN (MPU)

Holtek (MPU)

Hynix (EEPROM)

Hyundai (EPROM)

ICT (EPROM)

Intel (MPU, RAM, EPROM, EEPROM)

ISSI (MPU, EEPROM)

Lattice (PLD)

LG (MPU)

Linksmart (EEPROM)

Macronix (EEPROM)

Matsushita (EPROM)

Megawin (MPU)

Micon (MPU)

Microchip (MPU, EPROM, EEPROM)

Mitsubishi (EPROM, EEPROM)

Mosel (MPU, EEPROM)

MXIC (EPROM, EEPROM)

NEC (EPROM, EEPROM)

NS (PLD, EPROM)

OKI (EPROM, EEPROM)

PDK (MPU)

Philips (MPU)

PMC (EEPROM)

PTC (EEPROM)

Ricoh (EPROM)

Samsung (MPU, EPROM, EEPROM)

SEEQ (EPROM, EEPROM)

SGS Thomson (PLD, EPROM, EEPROM)

Signetics (EPROM)

SMOS (EPROM

Sony (EPROM)

Sonix (MPU)

Spansion (EEPROM)

SST (MPU, EEPROM)

ST (EPROM, EEPROM)

STC (MPU)

Stand (RAM)

Syncmos (MPU, EEPROM)

TI (EPROM, EEPROM)

Topro (MPU)

Toptek (MPU)

Toshiba (EPROM, EEPROM)

Versachip (MPU)

VLSI (PLD, EPROM, EEPROM)

Winbond (MPU, RAM, EEPROM)

WSI (EPROM)

Xicor (EEPROM)

Package Include:

1pc x TOP3000 universal programmer

1pc x USB 2.0 cable (USB 1.1 compatible)

1pc x 5V/2A AC adapter

1pc x TOPwin software CD

1pc x English User Manual

CH000548
€98.21

TOP3000 Universal Programmer for MCU and EPROMs Programming ECU Chip Tunning

wishlist
Compare
Quickview

OZMICRO OZ813

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000303
€3.45

OZMICRO OZ813

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

OBDII Protocol Detector & Break Out Box mainly used car OBD line signal judgment and signal transfer. Using car fault diagnosis instrument can quickly determine car OBD signal receiving. Signal may not meet angle can take other signal transfer angle. Application is very convenient and solve risks across the line.

Features:

1. In the process of using decoder, error can be found and diagnosed OBD connector link.

2. You can monitor the OBD interface voltage and ground, showed low voltage. Display diagnostic stitching error.

3. Jump for OBD interface signals. Signal lines such as decoder of 7 to 15 vehicles online.

4. Rapid detection of OBD2 diagnostic connector whether every stitch of the normal communication.

5. Replace the battery, save the car data function. When replace the battery, plug OBD2 connector into the car, at the same time connect additional power to the control box, so that ensure vehicle data is not lost.

This OBDII Protocol Detector & Break Out Box has wide range of applications in diagnostics, key programming and chip tuning:

- To monitor data steam while performing test on vehicle using a Scantool. This makes it possible for you to both execute a test and simultaneously monitor the testing process.

- Display testing voltage on the car or truck

- Display communicating pin number

- Is an extension of OBD Diagnostic Link Connector (DLC)

Packing List:

1pc x Break Out Box Interface

1pc x OBD pin Cable

1pc x Box

CH000491
€60.92

OBDII BreaK Out Box Protocol Detector Diagnostic Tool

wishlist
Compare

ITE IT8512E KXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000284
€3.45

ITE IT8512E KXA

wishlist
Compare

TI TPS2061 DGN8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000289
€3.45

TI TPS2061 DGN8

wishlist
Compare

RICHTEK RT8202A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000292
€3.45

RICHTEK RT8202A

wishlist
Compare

OZMICRO OZ8682

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000297
€3.45

OZMICRO OZ8682

wishlist
Compare

GMT G547I2P81U

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000302
€3.45

GMT G547I2P81U

wishlist
Compare

TOP3000 Universal Programmer for MCU and EPROMs Programming ECU Chip Tunning

TOP3000 Auto Car Universal Programmer for MCU and EPROMs programming ECU Chip Tunning Tool

Login to Download: Download software

Specifications:

? Power supply input: 110 ~ 240VAC, 50/60Hz

? Power output: 5VDC, 2A

? Included: TOP3000 programmer,software CD, USB cable, power supply cable

Benefits:

? The TOP3000 programmer supports 2.5 ~ 6.5V devices

? Powered by your USB interface or the included 5V external power supply

? Fast transmission speed of 12MHz/s via the USB port

? Auto detects the device's manufacturer and part number

? Compatible with Notebooks and desktop computers

? The in-built connection inspection checks the connection for every pins in the unit

? Current protection function protects both the programmer and connected devices

? Has 48-pin self-lock sockets

? Compact programmer with tough plastic casing

Supports:

Actrans (EEPROM)

AMD (PLD, MPU, EPROM, EEPROM)

AMIC (EEPROM)

ASD (EEPROM)

Atmel (PLD, MPU, EPROM, EEPROM)

BDTIC (RAM)

Catalyst (EPROM, EEPROM)

Crescentec (MPU)

Dallas (RAM, MPU, EEPROM)

Elan (MPU)

EON (EEPROM)

EXEL (EEPROM)

Fujitsu (EPROM, EEPROM)

Future (MPU)

Hitachi (EPROM, EEPROM)

HMWIN (MPU)

Holtek (MPU)

Hynix (EEPROM)

Hyundai (EPROM)

ICT (EPROM)

Intel (MPU, RAM, EPROM, EEPROM)

ISSI (MPU, EEPROM)

Lattice (PLD)

LG (MPU)

Linksmart (EEPROM)

Macronix (EEPROM)

Matsushita (EPROM)

Megawin (MPU)

Micon (MPU)

Microchip (MPU, EPROM, EEPROM)

Mitsubishi (EPROM, EEPROM)

Mosel (MPU, EEPROM)

MXIC (EPROM, EEPROM)

NEC (EPROM, EEPROM)

NS (PLD, EPROM)

OKI (EPROM, EEPROM)

PDK (MPU)

Philips (MPU)

PMC (EEPROM)

PTC (EEPROM)

Ricoh (EPROM)

Samsung (MPU, EPROM, EEPROM)

SEEQ (EPROM, EEPROM)

SGS Thomson (PLD, EPROM, EEPROM)

Signetics (EPROM)

SMOS (EPROM

Sony (EPROM)

Sonix (MPU)

Spansion (EEPROM)

SST (MPU, EEPROM)

ST (EPROM, EEPROM)

STC (MPU)

Stand (RAM)

Syncmos (MPU, EEPROM)

TI (EPROM, EEPROM)

Topro (MPU)

Toptek (MPU)

Toshiba (EPROM, EEPROM)

Versachip (MPU)

VLSI (PLD, EPROM, EEPROM)

Winbond (MPU, RAM, EEPROM)

WSI (EPROM)

Xicor (EEPROM)

Package Include:

1pc x TOP3000 universal programmer

1pc x USB 2.0 cable (USB 1.1 compatible)

1pc x 5V/2A AC adapter

1pc x TOPwin software CD

1pc x English User Manual

CH000548
€98.21

TOP3000 Universal Programmer for MCU and EPROMs Programming ECU Chip Tunning

wishlist
Compare

OZMICRO OZ813

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000303
€3.45

OZMICRO OZ813

wishlist
Compare
Back to top