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2160833002 HD7650M

216-0833002 HD7650M

Part Number 216-0833002 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003331
€62.69

216-0833002 HD7650M

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USBASP USBISP AVR Programmateur adaptateur ISP Downloader USB ATMEGA8 HG

Features:

Onboard ATMega8(L)chip

With power and write indicator lamp

With overcurrent protection

Support 5V/3.3V power supply

Cable length: 20cm

Support Chip List:

51 series: AT89S51 AT89S52 AT89S53 AT89S8252

AVR series: ATTiny12(L), ATTiny13(V), ATTiny15(L), ATTiny24(V), ATTiny25(V), ATTiny26(L), ATTiny2313(V), ATTiny44(V), ATTiny45(V), ATTiny84(V), ATTiny85(V), AT90S2313(L), AT90S2323(L), AT90S2343(L), AT90S1200(L), AT90S8515(L), AT90S8535(L), ATMEGA48(V), ATMEGA8(L), ATMEGA88(V), ATMEGA8515(L), ATMEGA8535(L), ATMEGA16(L), ATMEGA162(V), ATMEGA163(L), ATMEGA164(V), ATMEGA165(V), ATMEGA168(V), ATMEGA169(V), ATMEGA169P(V), ATMEGA32(L), ATMEGA324(V), ATMEGA325(V), ATMEGA3250(V), ATMEGA329(V), ATMEGA3290(V), ATMEGA64(L), ATMEGA640(V), ATMEGA644(V), ATMEGA645(V), ATMEGA6450(V), ATMEGA649(V), ATMEGA6490(V), ATMEGA128(L), ATMEGA1280(V), ATMEGA1281(V), ATMEGA2560(V), ATMEGA2561(V), AT90CAN32, AT90CAN64, AT90CAN128, AT90PWM2(B), AT90PWM3(B), etc.

Package includes:

1x USBASP downloader

1x 10P data cable

CH005147
€3.61

USBASP USB-ISP AVR Programmateur adaptateur ISP Downloader USB ATMEGA8 HG

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2180697020 SB820M

218-0697020 SB820M

Part Number 218-0697020 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003332
€16.81

218-0697020 SB820M

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N10PGEA3 G230M

N10P-GE-A3 G230M

Part Number N10P-GE-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1148

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003333
€25.27

N10P-GE-A3 G230M

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216MQA6AVA12FG RS690M

216MQA6AVA12FG RS690M

Part Number 216MQA6AVA12FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0747

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003345
€26.12

216MQA6AVA12FG RS690M

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QDNVS110MTNA3

QD-NVS-110MT-N-A3

Part Number QD-NVS-110MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1338

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003346
€21.33

QD-NVS-110MT-N-A3

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N11PGE1WA3 G330M

N11P-GE1-W-A3 G330M

Part Number N11P-GE1-W-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1327

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003349
€26.06

N11P-GE1-W-A3 G330M

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Universal IC Socket Adapter SSOP34 TO DIP34 SSOP28 TO DIP28 SSOP20 TO DIP20 SSOP16 TO DIP16 220mil

Universal IC Socket (0.65 spacing), has a long service life, suitable for all SSOP34 SSOP28 SSOP24 SSOP20 SSOP16 SSOP14 chip.

The suitable model and programmer. Such as: ALL-100GANG, ALL-11 series, LT-48 series, SuperPRO series, TOP series programmer all

Support chip: PL2303HX......

CH005176
€7.96

Universal IC Socket Adapter SSOP34 TO DIP34 / SSOP28 TO DIP28 / SSOP20 TO DIP20 / SSOP16 TO DIP16 (220mil)

2160833002 HD7650M

216-0833002 HD7650M

Part Number 216-0833002 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003331
€62.69

216-0833002 HD7650M

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USBASP USBISP AVR Programmateur adaptateur ISP Downloader USB ATMEGA8 HG

Features:

Onboard ATMega8(L)chip

With power and write indicator lamp

With overcurrent protection

Support 5V/3.3V power supply

Cable length: 20cm

Support Chip List:

51 series: AT89S51 AT89S52 AT89S53 AT89S8252

AVR series: ATTiny12(L), ATTiny13(V), ATTiny15(L), ATTiny24(V), ATTiny25(V), ATTiny26(L), ATTiny2313(V), ATTiny44(V), ATTiny45(V), ATTiny84(V), ATTiny85(V), AT90S2313(L), AT90S2323(L), AT90S2343(L), AT90S1200(L), AT90S8515(L), AT90S8535(L), ATMEGA48(V), ATMEGA8(L), ATMEGA88(V), ATMEGA8515(L), ATMEGA8535(L), ATMEGA16(L), ATMEGA162(V), ATMEGA163(L), ATMEGA164(V), ATMEGA165(V), ATMEGA168(V), ATMEGA169(V), ATMEGA169P(V), ATMEGA32(L), ATMEGA324(V), ATMEGA325(V), ATMEGA3250(V), ATMEGA329(V), ATMEGA3290(V), ATMEGA64(L), ATMEGA640(V), ATMEGA644(V), ATMEGA645(V), ATMEGA6450(V), ATMEGA649(V), ATMEGA6490(V), ATMEGA128(L), ATMEGA1280(V), ATMEGA1281(V), ATMEGA2560(V), ATMEGA2561(V), AT90CAN32, AT90CAN64, AT90CAN128, AT90PWM2(B), AT90PWM3(B), etc.

Package includes:

1x USBASP downloader

1x 10P data cable

CH005147
€3.61

USBASP USB-ISP AVR Programmateur adaptateur ISP Downloader USB ATMEGA8 HG

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2180697020 SB820M

218-0697020 SB820M

Part Number 218-0697020 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003332
€16.81

218-0697020 SB820M

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N10PGEA3 G230M

N10P-GE-A3 G230M

Part Number N10P-GE-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1148

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003333
€25.27

N10P-GE-A3 G230M

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216MQA6AVA12FG RS690M

216MQA6AVA12FG RS690M

Part Number 216MQA6AVA12FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0747

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003345
€26.12

216MQA6AVA12FG RS690M

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QDNVS110MTNA3

QD-NVS-110MT-N-A3

Part Number QD-NVS-110MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1338

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003346
€21.33

QD-NVS-110MT-N-A3

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N11PGE1WA3 G330M

N11P-GE1-W-A3 G330M

Part Number N11P-GE1-W-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1327

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003349
€26.06

N11P-GE1-W-A3 G330M

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Universal IC Socket Adapter SSOP34 TO DIP34 SSOP28 TO DIP28 SSOP20 TO DIP20 SSOP16 TO DIP16 220mil

Universal IC Socket (0.65 spacing), has a long service life, suitable for all SSOP34 SSOP28 SSOP24 SSOP20 SSOP16 SSOP14 chip.

The suitable model and programmer. Such as: ALL-100GANG, ALL-11 series, LT-48 series, SuperPRO series, TOP series programmer all

Support chip: PL2303HX......

CH005176
€7.96

Universal IC Socket Adapter SSOP34 TO DIP34 / SSOP28 TO DIP28 / SSOP20 TO DIP20 / SSOP16 TO DIP16 (220mil)

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