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SR244 i35005U

SR244 i3-5005U

Part Number SR244 i3-5005U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003381
€95.18

SR244 i3-5005U

BD82HM77 SLJ8C

BD82HM77 SLJ8C

Part Number BD82HM77 SLJ8C Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 2012

Package/Case 500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003391
€45.95

BD82HM77 SLJ8C

2180755030

218-0755030

Part Number 218-0755030 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003393
€20.86

218-0755030

XELTEK SuperPro 610P Universal Programmer with 28 adapters plus EDID

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adapter

1 * SOP16-DIP16 (300mil) Adapter

1 * SOP20-DIP20 (300mil) Adapter

1 * SOP28-DIP28 (300mil) Adapter

1 * TSSOP16-DIP16 (170mil) Adapter

1 * TSSOP20-DIP20 (170mil) Adapter

1 * TSSOP24-DIP24 (170mil) Adapter

1 * TSSOP28-DIP28 (170mil) Adapter

1 * SSOP20-DIP20 (220mil) Adapter

1 * SSOP28-DIP28 (220mil) Adapter

1 * SSOP34-DIP34 (220mil) Adapter

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adapter

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adapter

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adapter

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adapter

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adapter

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adapter

1 * QFN8 WSON8 Simple Adapter

1 * SOP16/8-DIP8 REV4 Simple Adapter

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adapter

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adapter

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH005250
€520.00

XELTEK SuperPro 610P Universal Programmer with 28 Adapter EDID code

2160810001 HD6770

216-0810001 HD6770

Part Number 216-0810001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003402
€69.66

216-0810001 HD6770

SOP16 DIP8 REV3 Board

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
€2.70

SOP16/8-DIP8 REV3 Board

G210205A3

G210-205-A3

Part Number G210-205-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1148

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003406
€21.83

G210-205-A3

N10MGE2S G103M

N10M-GE2-S G103M

Part Number N10M-GE2-S Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003407
€6.56

N10M-GE2-S G103M

eMMC100 BGA100 IC test socket Nand flash USB Interface Reader programming 12x18mm

eMMC100 BGA100 IC test socket Nand flash USB InterfacePitch 1.0mm Reader programming 12x18mm

BGA100 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 12x18mm ( buy eMMC100 test socket , get 1 piece complimentary frame guides )

CH003807
€100.50

eMMC100 BGA100 IC test socket Nand flash USB InterfacePitch 1.0mm Reader programming 12x18mm

SR244 i35005U

SR244 i3-5005U

Part Number SR244 i3-5005U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003381
€95.18

SR244 i3-5005U

BD82HM77 SLJ8C

BD82HM77 SLJ8C

Part Number BD82HM77 SLJ8C Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 2012

Package/Case 500 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003391
€45.95

BD82HM77 SLJ8C

2180755030

218-0755030

Part Number 218-0755030 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003393
€20.86

218-0755030

XELTEK SuperPro 610P Universal Programmer with 28 adapters plus EDID

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Packing List:

1 * XELTEK SuperPro 6100N Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adapter

1 * SOP16-DIP16 (300mil) Adapter

1 * SOP20-DIP20 (300mil) Adapter

1 * SOP28-DIP28 (300mil) Adapter

1 * TSSOP16-DIP16 (170mil) Adapter

1 * TSSOP20-DIP20 (170mil) Adapter

1 * TSSOP24-DIP24 (170mil) Adapter

1 * TSSOP28-DIP28 (170mil) Adapter

1 * SSOP20-DIP20 (220mil) Adapter

1 * SSOP28-DIP28 (220mil) Adapter

1 * SSOP34-DIP34 (220mil) Adapter

1 * SOP8-DIP8 CNV-SOP20 (208mil) Adapter

1 * Double SOP8-DIP16 CNV-SOP20 (208mil) Adapter

1 * SOP20-DIP20 CNV-SOP20 (208mil) Adapter

1 * SOP8-DIP8 CNV-SOP-DIP16 (150mil) Adapter

1 * SOP16-DIP16 CNV-SOP-DIP16 (150mil) Adapter

1 * PLCC44-DIP40

1 * PLCC32-DIP32

1 * PLCC28-DIP24

1 * PLCC20-DIP20

1 * SOP8-DIP8 Simple Adapter

1 * QFN8 WSON8 Simple Adapter

1 * SOP16/8-DIP8 REV4 Simple Adapter

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adapter

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adapter

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH005250
€520.00

XELTEK SuperPro 610P Universal Programmer with 28 Adapter EDID code

2160810001 HD6770

216-0810001 HD6770

Part Number 216-0810001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003402
€69.66

216-0810001 HD6770

SOP16 DIP8 REV3 Board

Product Description

SOP16/8-DIP8 REV3 Board 1PCS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005252
€2.70

SOP16/8-DIP8 REV3 Board

G210205A3

G210-205-A3

Part Number G210-205-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1148

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003406
€21.83

G210-205-A3

N10MGE2S G103M

N10M-GE2-S G103M

Part Number N10M-GE2-S Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003407
€6.56

N10M-GE2-S G103M

eMMC100 BGA100 IC test socket Nand flash USB Interface Reader programming 12x18mm

eMMC100 BGA100 IC test socket Nand flash USB InterfacePitch 1.0mm Reader programming 12x18mm

BGA100 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 12x18mm ( buy eMMC100 test socket , get 1 piece complimentary frame guides )

CH003807
€100.50

eMMC100 BGA100 IC test socket Nand flash USB InterfacePitch 1.0mm Reader programming 12x18mm