SR1SB J2900

Part Number SR1SB J2900 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1344

Package/Case 240 PCS Description Original new

SR1SB J2900 FH8065301614903 Intel Pentium CPU BGA1170 2 41 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

USB CP2102 to TTL RS232 USB TTL to RS485 Mutual Convert 6 in 1 Convert Module

Description:

Six in ONE Multifunctional Convert interface module:

USB to TTL

USB to 232

USB to 485

TTL to 232

TTL to 485

232 to 485

Features:

CP2102 core chip : CP2102 USB to serial chip is the best quality , most stable performance far exceeds the cost of the same chip , such as PL2303, FT232, CH341 and so on. High-speed, reliable, stable is capable of leading CP2102 USB to serial module sales in the important reasons.

Ultra-small size : the circuit board only 3.1cm X 1.8cm. Ultra- small size , lack of a U disk size , only with a USB port width , even on those two USB ports from a very tight laptop can easily be placed side by side two .

3.3V and +5 V Compatibility: This product perfectly supports 3.3V. Now a lot of high-end microcontroller, such as ARM, STM32, DSP , adopted 3.3V. Additional modules are only compatible 5V level , they do not have 3.3V voltage output function.

Power Output: This module can be powered through to the microcontroller system to facilitate debugging. 5V-500mA or 3.3V-100mA.

Overcurrent protection : Onboard resettable fuse , even if the positive and negative short-circuit will not damage the circuit board or computer. If there is a short circuit or current exceeds 500mA , the fuse will automatically disconnect , to be short-circuited fuse circuit to restore non- normal . Effectively protect the security of your computer.

Transceiver indicator : When the serial line to send or receive data lines , the board will receive indicator lights for easy debugging.

TTL level interface : can be directly connected microcontroller or other embedded devices, such as 51, STC, AVR, ARM, FPGA , etc., without conversion.

RS232 level interface : connect a computer or Rs232 level serial devices.

RS485 level interface : automatic send and receive control without transceiver control line , the default receiving state , to send status line when sending data .

Freedom Huzhuan four levels : a unique circuit design , USB, TTL, RS232, RS485 freedom of conversion, switched by the switch to achieve physical , convenient and reliable , without interference.

High-speed communications : baud rate up to 2Mbps.

DTR, RTS signals: serial module leads the DTR, RTS signal is versatile, supporting MSP430 microcontroller BSL downloads.

SMT machines , industrial-grade chips : This module uses the whole machine placement process technology, quality and cheap manual patch welding have a qualitative difference , stable and reliable performance guarantee.

Package included:

1 X CP2102 USB to TTL RS232 USB TTL to RS485 Mutual Convert 6 in 1 Convert Module(No cables included)

216-0842000 HD8750M

Part Number 216-0842000 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo G580 G585 G480 V.2 P/N: DC02001ES10 DC02001ES00

218-0792006 M1 FCH

Part Number 218-0792006 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

MECHANIC LY-UVH900 10ML Green UV Solder + Dianbu green paint tin pad repair BGA Template curing lamp set

AM4455SHE24HJ A10-5745M

Part Number AM4455SHE24HJ Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1244

Package/Case 1 PCS Description Brand new

AM4455SHE24HJ A10-5745M Processor for Laptop AMD A-Series BGA827 2.1 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

Model: Camera with HDMI USB2.0 two output

Image format: jpg

Image resolution: 21 MegaPixel

Video format: MP4(for TF card)

Video recorder: 2K@30FPS, 1080P@60FPS

HDMI Video resolution: 1920*1080 @ 60FPS

USB Video resolution: 1920*1080@30FPS; 1280*720@30FPS; 640*480@30FPS; 320*240@30FPS

White Balance: Auto/Manual

Light: Auto/Manual

Exposure: Auto/Manual, value adjustable

Color: Color

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese/French/Spanish/Japanese/German

Line: different color,5 horizontal line , 5 vertical line,any positions

Specification:

Image sensor: 21 megapixel P'anasonic CMOS sensor 1/2.33 inch

Effective pixel: 21 megapixel

Pixel size:1.335m 1.335m

Frame rate:60fps

Definition:FULL HD

Housing:metal

Lens:C/CS

Video format: MOV

Digital Zoom:Support

Brightness control:Auto/manual

Color:R/G/B adjustable

Film and record:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:

Support multi-color, 5 pcs of transverse lines/vertical lines, moveable

Different color,5 horizontal line , 5 vertical line,any positions

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

USB interface:Standard usb2.0 interface (Type B)

Input Voltage: DC 12V

Working distance: 55mm-700mm

Field of view: 4mm-100mm

zoom c-mount Lens

zoom ratios: 15:1

Magnification Power by 120X

Size: 110mm(L) * 28mm(DIA)

With 50mm ring adapter

Package includes:

1 * HDMI camera

1 * HDMI cable

1 * remote control

1 * C-MOUNT Lens

1 * 12V power supply

1 * Table Stand

216XJBKA15FG

Part Number 216XJBKA15FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0924

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Battery for HP Mini 210-3000, DM1 (10.8V 5200mAh) PN: HSTNN-DB3B HSTNN-YB3B MT03 MT06 MTO3 MTO6

Battery Type Li-ion Product Type Replacement Battery

Voltage 10,8V Color Black

Capacity 5200 mAh Description New OEM

N14E-GL-A1 GTX760M

Part Number N14E-GL-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1413

Package/Case 240 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo S100 S110 p/n: 1109-00284 31-050131