The VAS 5054A is a universal diagnostic interface for the vehicles of the Volkswagen Group and all OBD vehicle systems from other manufacturers,mainly do AUDI VW Seat.It is bluetooth version.

Multi-language available: English/Germany/Russia/Spanish/Czech/France/Dutch

Newest version: V19

VAS5054A V19 New Highlights:

New arrival

Multi-language available

Add new car models Bentley and Lamborghini

VAS 5054A V19 Computer Windows System Requirements:

Windows System Language: American English

Windows XP(xp2/xp3)

System C:// have to be NTFS format

C:// need to have at least 10GB space for installing VAS5054A

Description:

Bluetooth version

The VAS 5054A is a universal diagnostic interface for the vehicles of the Volkswagen Group and all OBD vehicle systems from other manufacturers.

The integrated Bluetooth interface connects the vehicle with a notebook, desktop PC or test system.

No cables are needed for vehicle diagnostics using the VAS 5054A.

The range of the wireless Bluetooth connection is 5 to 10 meters,depending on the environment and the type of Bluetooth adapter used on the PC side.

The Serial Port Profile (SPP) is used for data transfer via Bluetooth. Different Bluetooth security levels are supported.

1.VAS 5054A Software Version:V15/V16/V17/V18/V19

2.VAS 5054A Language:English/Germany/Russia/Spanish/Czech/France/Dutch

Specification:

The vehicle protocols are handled directly in the VAS 5054A.

This ensures fast response times and a reliable real-time behavior independently of the PC operating system. Every time a connection is established, the VAS 5054A software is identifiedwith the version installed on the application PC. The VAS 5054A thus automatically adopts any new features provided after a new software version has been installed on the application PC.

The diagnostic application and the associated Diagnostic Base System are installed on the application PC.

The diagnostic base system can access the VAS 5054A via Bluetooth or USB.

Access via Bluetooth:After a connection to the VAS 5054A has been set up, the Bluetooth software provides a virtual serial COM port (Bluetooth Serial Port Profile). The Diagnostic Base System uses this COM port to communicate with the VAS 5054A.You need to specify this port when you install the diagnostic application.

Access via USB:You can also connect the VAS 5054A to the application PC by using the supplied USB cable. Windows detects the VAS 5054A through Plug and Play, and automatically installs the drivers copied when you installed the diagnostic application. Setup of the VAS 5054A is then complete and the device is ready for use by the diagnostic application.

The following vehicle bus systems are supported:

K line (ISO9141-2)

High-speed CAN (ISO 11898-2)

Low-speed CAN (ISO 11898-3)

J1850 (SAE J1850)

Package list:

1 VAS 5054A main unit

1 USB Cable

1 Bluetooth connecter

4 CD software

1Plastic case

N11M-LP2-S-A3 G210M

Part Number N11M-LP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX1001 Adapter for XELTEK SuperPro 6100N

N11M-GE1-S-B1 G210M

Part Number N11M-GE1-S-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1314

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product Description

Package includes: 1PCS X SOIC28-DIP28 (300mil) Socket

SOIC28-DIP28 (300mil) adapter will work on all programmers

Stock: in stock

Condition: NEW

216-0772003 HD5750

Part Number 216-0772003 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1118

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

OBDSTAR X300 DP configuration

Login to Download: * User manual Download

Standard package: Immobilizer+ odometer adjustment+ EEPROM/PIC adapter +OBDII

Full package: Immobilizer+ odometer adjustment+ EEPROM/PIC adapter+ OBDII+ ABS+ TPS+ SRS reset+ TPMS(low tire)reset+ Steering angle reset+ CVT learning/Value reset+ EPB+ Oil/service reset+ Battery matching+ Diagnosis(Japanese and Korean serials)

OBDSTAR X300 DP is the first tablet of OBDSTAR, which has reached a higher level in key programming and diagnosis. Inheriting from OBDSTAR professional auto programming and advanced diagnosing technology, X300 DP is characterized by covering wide range of vehicles, featuring powerful function, and providing superior quality. Meanwhile, taking advantage of Android system, X300 DP integrates more application and service, such as Maintenance Database, remote assistant, and One Key Update etc.

All in one, nothing is impossible!

OBDSTAR X300 DP is a convenient device, combining Android system, immobilizer, diagnose and special function, which closely follows the global trend and greatly meets the demand of users. In addition, abundant and powerful maintenance database and car testing video have realized easier operation and real success. Furthermore, Remote guide strengthens the communication between end users and technicians, without worries about after -sell service.

Android system is equipped with clear and user-friendly interface.

Diagnostic function strengthens professionalism in auto key programming.

Large amount of videos help users to operate it easily.

Maintenance database offers more powerful data.

Remote guide achieves zero distance between users and technicians.

Report center helps mutual improvement of terminal experience and technology.

One key upgrade realizes with one click.

Industrial design ensures that the tool works stably under tough environment, such as high or low temperatures.

Multi-language environment can be applied in different countries and areas

OBDSTAR X300 DP Vehicle Coverage:

BAIC, BENZ, BESTURN, BMW, BRILLIANE, BYD, CHANGAN, CHANGHE, CHERY, CHRYSLER(CHRYSLER/DODGE/JEEP), DFFENGSHEN, DFPV, FAW, FIAT, FORD/LINCOLN, GEELY/HUAPU/SQYL, GM(BUICK/CADILLAC/CHEVROLET/GMC/HUMMER), GREATWALL, HAFEI, HAWTAI, HIMIKO, HNMAZDA, HONDA/ACURA, HONGQI, HYUNDAI, ISUZU, JAC, JAGUAR, KIA, LANDROVER, LIEBAO, LIFAN, LUFENG, LUXGEN, MASERATI, MAZDA, MITSUBISHI, NISSAN/INFINITI, OPEL, PEUGEOT/CITROEN, PORSCHE, PROTON, QQROS, RENAULT, ROEWE/MG, SGMW, SMART, SSANGYONG, SUBARU, SUZUKI, TJFAW, TOYOTA/LEXUS, VW/AUDI/SKODA/SEAT, YOUNGLOTUS, ZZMAZDA, ZZNISSAN, ZOTYE;

Note: There would be some difference to software in different countries. If need more specific information, pls feel free to contact us or our distributors in your area.

OBDSTAR X300 DP Function:

Read and clear fault codes;

Clear key memory;

Program keys, proximity keys, smart key, flip keys;

Program after-market and OEM keys;

Display live data;

Component actuation;

Read keys from immobilizer memory

New ECU programming;

New mechanical key number programming;

Vehicle identification key programming;

Reset ECU& Reset immobilizer;

New remote controller programming;

Immo PINCODE reader;

Mileage adjustment via OBD;

With full and strong database for the most important vehicle makes;

VCI diagnose

One key upgrade via wifi

Remote assistance

Built-in repair video

Report center

EEPROM chip read and immobilizer initialization;

EPB(Electric park brake);

Oil/Service reset;

Battery matching;

ABS

TPS

SRS reset

TPMS(low tire)reset

Steering angle reset

CVT learning/Value reset

EEPROM/PIC adapter

OBDII

Diagnosis

OBDSTAR X300 DP Feature:

1. Powerful Samsung Cortex A9 dual-core processor

2. 7-inch capacitive touch screen(1280*800) & backit and multi-point LED

3. 2G RAM and 16G ROM(memory can be extended)

4. 7000MA lithium-ion battery & 10-hour battery life

5. Unique ergonomic design and tri-proof case with high security

6. Cover all functions of X100,X200,X300PRO and VAG-PRO 7. Add diagnostic function of whole-vehicle system

7. One key upgrading, long-distance diagnosis, more convenient after-sales service.

GK107-425-A2

Part Number GK107-425-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

EV2400

DH82H81 SR177

Part Number GL82H170 SR2C8 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: Download software Device List

Field of application:

This programmer can read and write the bios chips of DVD,TV,PC,harddisk,etc.

Features:

1. USB 2.0 interface, the speed is 12Mbps.

2. The speed of reading and writing is fast.

3. Auto detect chip modles.

4. Auto select power votage.

5. Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

6. Small shape.

7. Windows XP, Windows Vista, Win7,WIN8,WIN10.

List:

1. Programmer 1

2. Usb cable 1

3. CD 1

4. Manual(a file on CD) 1

5. Simple socket for SMD chips 2

7. Off-line 5V USB Power Supply

8. 150mil SOP8 to DIP8 Socket

9. 200-208mil SOP8 to DIP8 Socket

10.SOP16-DIP8 (300mil)

11.Simple SMD PIN8 DIP

12.1.8V Conversion adapter

N11P-GV-A1 GT325M

Part Number N11P-GV-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1409

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock