GF-GO7600T-N-A2

Part Number GF-GO7600T-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR2A7 N3700

Part Number SR2A7 N3700 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1513

Package/Case 240 PCS Description Original new

SR2A7 N3700 FH8066501715923 Intel Pentium CPU BGA1170 1.6 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo G460 G465 Z460 Z465 P/N: DC02000ZM10 1BB9PL050E6 NIWE1

GF104-325-A1

Part Number GF104-325-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1042

Package/Case 100 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

NH82801HBM SLB9A

Part Number NH82801HBM SLB9A Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

MAISHENG MS3010DH 0-30V/0-10A Adjustable Voltage Switching DC Power Supply

Login to Download: * Instruction manual

Features:

1.Thicker steel chassis, beautiful and durable. Handle design for easy handling.

2.To be more precise the values of the voltage, it was deigned with 10-turn potentiometers.

3.It can be automatic conversion with constant voltage and constant current, so it not only can be used as constant voltage power supply but also can be used as constant current power supply.

4.Protection: overvoltage protection (OVP), over current protection (OCP), over temperature protection (OTP).

5.Reasonable Circuit designed, the key components are imported, can be used for 24-hour full load working.

6.PWM switching pre-regulator, MOS linear adjustment mode, high efficiency, energy saving and environmental protection.

7.Intelligent fan controlled by temperature.

Applications:

1.Industrial products aging testing for DC motors, DC fans, car DVD, car audio, resistors, capacitors, etc.

2.Perfect applied to charge the batteries, it can provide constant current charging, then constant trickle charging with constant voltage, prevent overcharge, battery protection, effectively extending the battery life.

3.Inverter Industry: It overcome the problem of linear power relay stuck conversion, fast response speed, to meet the instantaneous change in the load requirements.

4.LED test and aging.

5.Widely used in electrolysis, electroplating, PCB manufacturing industry.

(If used in Electroplating, you should give us advance instructions to do some comprehensive protective treatments, and there will have some additional charges)

6.Others.

Parameters:

1.Voltage Input: AC 220V 50Hz 110V 60Hz(be customized)

2.Voltage Output:DC 0-30V adjustable

3.Current Output:DC 0-10A adjustable

4.Resolution: voltage 0.1V, current 0.1A

5.Accuracy:+/-1%+/-1 digit

6.Voltage stability: =0.2%

7.Current stability: =0.5%

8.Load stability: CV=0.5% CC=0.5%

9.Ripple and noise: =0.5% RMS

10.Cooling method: Intelligent fan controlled by temperature.

11.Working environment: -10 - 40 Relative humidity <80%

12.Storage environment: -20 - 80 Relative humidity <80%

216RMAKA14FG HD2400

Part Number 216RMAKA14FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

T13-IL BaKon integrated heating core lead-free portable 75W constant temperature soldering iron core

G86-740-A2 8400MGS

Part Number G86-740-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1009

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Model number: T-FLEX700

Size: 15mm*15mm*0.5mmT

Temperature resistance: -40~220?

Thermal conductivity: 5.0W/mk

Thermal resistance coefficient: 0.15?-in/W

Density: 1.73g/cc

QG82945GME SLA94

Part Number QG82945GME SLA94 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock