UFi Box Features

UFi Box is a powerful EMMC Service Tool that can Read EMMC user data, as well as repair, resize, format, erase, read write and update the firmware on EMMC in Samsung, china phone SK Hynix, Toshiba, Kingston, micron, and other brands.

UFi Box is a tool to repair phones with the ability to:

? Repair EMMC

? Resize EMMC

? Format EMMC

? Write full data, erase fully

? Read boot1

? Read boot2

? Read EXT CSD

? Read User Data

? Update firmware

? Via test point

What are the advantages of UFi Box?

? Has its own software, a stand-alone

? Display that is easily understood by the user or newbie first technical advance that has been made as easy as possible usage Or ONE CLICK without having configurations app.

? Supported database of various kinds of IC EMMC, which in included in the software Ufi box

? Support Ic EMMC Samsung and china phone SK Hynix, Toshiba, Kingston, micron, and other brands

? Has a faster speed compared to other boxes because it uses an interface 8bit full speed

? Support the use, installation and use in support by practitioners directly

Hardware Features:

? USB 2.0 High-Speed(480 Mbps)

? Modern design, with built-in LDO Voltage Out and external power source

? Secured with Java smart card and online system

? Multiprotocol ready, with 20 (13 usable) multi-purpose IO pins and 1 Full-Speed USB-HOST

? Integrated software managed over-current protection

Software Features:

? Lowest-cost universal software platform in the market

? Work with standalone and user-friendly software

? Strong and secure software platform integrated with online(server based) security

? Planned to support as many as possible up-to-date repair solution

? Integrated file synchronising function

Compatibility

What are the supported OSes?

UFI software developed inside Windows 7 64bit environment, but it can work with All other Windows version starting Windows XP.

However, we recommend to use the software with Windows 7 or later.

We have tested the software and drivers to be working with the following OSes:

? Windows XP Service Pack 3 (32bit)

? Windows 7 Home (32bit)

? Windows 7 Ultimate (32bit)

? Windows 7 Ultimate (64bit)

? Windows 8 Profesional (64bit)

? Windows 8.1 Profesional (64bit)

? Windows 10 Final (64bit)

Warranty

All the hardware was passed the QC in the factory before dispatch, however, some devices may have problems in the customer's hand.

UFi Box, UFI-Lite and the eMMC Socket were covered by 6-months limited warranty.

This warranty does not include problems that were caused by the user himself, such as water damage, burns because of over-voltage, etc.

Package Contents:

? UFi Box USB2.0 High-Speed + Smartcard

? UFI-Lite USB3.0 SuperSpeed uSD/eMMC Reader

? 2 In 1 eMMC/eMCP socket (169-FBGA,153-FBGA,162-FBGA,186-FBGA)

? eMMC/eMCP socket (221-FBGA)

? UFI ISP Adapter V2

? USB Data Cable

? USB to DC 5V External Power cable

Over 3.3TB compressed files(and counting) available on support server comes with built-in download manager, so user can download required files with easy.

G86-704-A2 8400MGS

Part Number G86-704-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Specification and Dimension :

* Type : Test & Programming Socket ( with pcb )

* Package : QFP100 , TQFP100 , LQFP100

* Pin Pitch : 0.5 mm

* Pin Count : 100 pins

* Applicable IC body size : 14x14 mm

* IC tip-to-tip : 16x16 mm

Package Including :

* QFP100-0.5 adapter 1 pcs

SR1UT J1900

Part Number SR1UT J1900 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1443

Package/Case 240 PCS Description Original new

SR1UT J1900 FH8065301615010 Intel Celeron CPU BGA1170 2.0 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX3077 Adapter for XELTEK SuperPro 6100N

216-0833002 HD7650M

Part Number 216-0833002 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Features:

Onboard ATMega8(L)chip

With power and write indicator lamp

With overcurrent protection

Support 5V/3.3V power supply

Cable length: 20cm

Support Chip List:

51 series: AT89S51 AT89S52 AT89S53 AT89S8252

AVR series: ATTiny12(L), ATTiny13(V), ATTiny15(L), ATTiny24(V), ATTiny25(V), ATTiny26(L), ATTiny2313(V), ATTiny44(V), ATTiny45(V), ATTiny84(V), ATTiny85(V), AT90S2313(L), AT90S2323(L), AT90S2343(L), AT90S1200(L), AT90S8515(L), AT90S8535(L), ATMEGA48(V), ATMEGA8(L), ATMEGA88(V), ATMEGA8515(L), ATMEGA8535(L), ATMEGA16(L), ATMEGA162(V), ATMEGA163(L), ATMEGA164(V), ATMEGA165(V), ATMEGA168(V), ATMEGA169(V), ATMEGA169P(V), ATMEGA32(L), ATMEGA324(V), ATMEGA325(V), ATMEGA3250(V), ATMEGA329(V), ATMEGA3290(V), ATMEGA64(L), ATMEGA640(V), ATMEGA644(V), ATMEGA645(V), ATMEGA6450(V), ATMEGA649(V), ATMEGA6490(V), ATMEGA128(L), ATMEGA1280(V), ATMEGA1281(V), ATMEGA2560(V), ATMEGA2561(V), AT90CAN32, AT90CAN64, AT90CAN128, AT90PWM2(B), AT90PWM3(B), etc.

Package includes:

1x USBASP downloader

1x 10P data cable

218-0697020 SB820M

Part Number 218-0697020 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX3016 Adapter for XELTEK SuperPro 6100N

N10P-GE-A3 G230M

Part Number N10P-GE-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1148

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SA244 Adapter PLCC44/DIP44 for XELTEK SuperPro 610P 611S

216MQA6AVA12FG RS690M

Part Number 216MQA6AVA12FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0747

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock