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  • Categories: Laptop Parts, Repair tool
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48MP 2K Industrial Microscope Camera HDMI USB Outputs 130X Cmount Lens 56 LED Light Boom for PCB Repair Soldering

Features:

Model: Camera with HDMI USB2.0 two output

Image format: jpg

Image resolution: 48 MegaPixel

Video format: MP4(for TF card)

Video recorder: 2K@30FPS, 1080P@60FPS

HDMI Video resolution: 1920*1080 @ 60FPS

USB Video resolution: 1920*1080@30FPS; 1280*720@30FPS; 640*480@30FPS; 320*240@30FPS

White Balance: Auto/Manual

Light: Auto/Manual

Exposure: Auto/Manual, value adjustable

Color: Color

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese/French/Spanish/Japanese/German

Line: different color,5 horizontal line , 5 vertical line,any positions

Specification:

Image sensor: 48 megapixel Panasonic CMOS sensor 1/2.33 inch

Effective pixel: 48 megapixel

Pixel size:1.335m 1.335m

Frame rate:60fps

Definition:FULL HD

Housing:metal

Lens:C/CS

Video format: MOV

Digital Zoom:Support

Brightness control:Auto/manual

Color:R/G/B adjustable

Film and record:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:

Support multi-color, 5 pcs of transverse lines/vertical lines, moveable

Different color,5 horizontal line , 5 vertical line,any positions

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

USB interface:Standard usb2.0 interface (Type B)

Input Voltage: DC 12V

130x zoom c-mount Lens

Magnification Power by 0.12 - 2X (about 8X - 130X on the display)

Work distance: 50mm-200mm

Visual field :2.4mm-32mm

Size: 115mm(L) * 40mm(DIA)

Weight:220g

C-mount Thread: 25mm (to connect electronic eyepiece or CCD camera)

56 LED Ring Light

Provides intense and focused shadow-free illumination

56 bright white LED bulbs

Lighting direction changeable

Variable intensity control

Intense and focused shadow-free illumination

100,000 hours of life

Power input: 100-240V, 50-60HZ, auto switching

Inside diameter of the ring light: 1.0" (27mm)

Overall outside diameter: 1.77" (45mm)

Working Distance: 27mm-45mm

Package including:

1 x 48MP Microscope Camera

1 x 130X C-mount lens

1 x 56 LED light

1 x Power supply

1 x USB line

1 x Software DISC

1 x Remote Control

1 x boom Stand

CH002905
€165.35

48MP 2K Industrial Microscope Camera HDMI USB Outputs 130X C-mount Lens 56 LED Light Boom for PCB Repair Soldering

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216PDAGA23F X600

216PDAGA23F X600

Part Number 216PDAGA23F Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0610

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003747
€15.65

216PDAGA23F X600

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GT218300B1 GT210

GT218-300-B1 GT210

Part Number GT218-300-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003755
€16.41

GT218-300-B1 GT210

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SR2EZ i76500U

SR2EZ i7-6500U

Part Number i7-6500U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003764
€241.23

SR2EZ i7-6500U

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10m S993A S995A Pump Solder Sucker Gun Suction nozzle

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002932
€8.58

1.0m S-993A S-995A Pump Solder Sucker Gun Suction nozzle

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GFGO7400BNA3

GF-GO7400-B-N-A3

Part Number GF-GO7400-B-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0843

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003768
€24.58

GF-GO7400-B-N-A3

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2160729042 HD4650

216-0729042 HD4650

Part Number 216-0729042 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003777
€60.95

216-0729042 HD4650

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2180660017 SB710

218-0660017 SB710

Part Number 218-0660017 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003782
€5.22

218-0660017 SB710

48MP 2K Industrial Microscope Camera HDMI USB Outputs 130X Cmount Lens 56 LED Light Boom for PCB Repair Soldering

Features:

Model: Camera with HDMI USB2.0 two output

Image format: jpg

Image resolution: 48 MegaPixel

Video format: MP4(for TF card)

Video recorder: 2K@30FPS, 1080P@60FPS

HDMI Video resolution: 1920*1080 @ 60FPS

USB Video resolution: 1920*1080@30FPS; 1280*720@30FPS; 640*480@30FPS; 320*240@30FPS

White Balance: Auto/Manual

Light: Auto/Manual

Exposure: Auto/Manual, value adjustable

Color: Color

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese/French/Spanish/Japanese/German

Line: different color,5 horizontal line , 5 vertical line,any positions

Specification:

Image sensor: 48 megapixel Panasonic CMOS sensor 1/2.33 inch

Effective pixel: 48 megapixel

Pixel size:1.335m 1.335m

Frame rate:60fps

Definition:FULL HD

Housing:metal

Lens:C/CS

Video format: MOV

Digital Zoom:Support

Brightness control:Auto/manual

Color:R/G/B adjustable

Film and record:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:

Support multi-color, 5 pcs of transverse lines/vertical lines, moveable

Different color,5 horizontal line , 5 vertical line,any positions

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

USB interface:Standard usb2.0 interface (Type B)

Input Voltage: DC 12V

130x zoom c-mount Lens

Magnification Power by 0.12 - 2X (about 8X - 130X on the display)

Work distance: 50mm-200mm

Visual field :2.4mm-32mm

Size: 115mm(L) * 40mm(DIA)

Weight:220g

C-mount Thread: 25mm (to connect electronic eyepiece or CCD camera)

56 LED Ring Light

Provides intense and focused shadow-free illumination

56 bright white LED bulbs

Lighting direction changeable

Variable intensity control

Intense and focused shadow-free illumination

100,000 hours of life

Power input: 100-240V, 50-60HZ, auto switching

Inside diameter of the ring light: 1.0" (27mm)

Overall outside diameter: 1.77" (45mm)

Working Distance: 27mm-45mm

Package including:

1 x 48MP Microscope Camera

1 x 130X C-mount lens

1 x 56 LED light

1 x Power supply

1 x USB line

1 x Software DISC

1 x Remote Control

1 x boom Stand

CH002905
€165.35

48MP 2K Industrial Microscope Camera HDMI USB Outputs 130X C-mount Lens 56 LED Light Boom for PCB Repair Soldering

wishlist
Compare

216PDAGA23F X600

216PDAGA23F X600

Part Number 216PDAGA23F Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0610

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003747
€15.65

216PDAGA23F X600

wishlist
Compare

GT218300B1 GT210

GT218-300-B1 GT210

Part Number GT218-300-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003755
€16.41

GT218-300-B1 GT210

wishlist
Compare

SR2EZ i76500U

SR2EZ i7-6500U

Part Number i7-6500U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003764
€241.23

SR2EZ i7-6500U

wishlist
Compare

10m S993A S995A Pump Solder Sucker Gun Suction nozzle

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002932
€8.58

1.0m S-993A S-995A Pump Solder Sucker Gun Suction nozzle

wishlist
Compare

GFGO7400BNA3

GF-GO7400-B-N-A3

Part Number GF-GO7400-B-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0843

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003768
€24.58

GF-GO7400-B-N-A3

wishlist
Compare

2160729042 HD4650

216-0729042 HD4650

Part Number 216-0729042 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003777
€60.95

216-0729042 HD4650

wishlist
Compare

2180660017 SB710

218-0660017 SB710

Part Number 218-0660017 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003782
€5.22

218-0660017 SB710

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Compare
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