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Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

SR29H N3050

Part Number SR29H N3050 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1542

Package/Case 440 PCS Description Original new

SR29H N3050 FH8066501715914 Intel Mobile Celeron CPU BGA1170 1.6 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Toshiba L500 LED p/n: 6017B0198301 V000180110

216-0674022 RS780M

Part Number 216-0674022 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1001

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Cabledeconn G0101 MINI SAS 36P SFF 8087 to 4 SATA 7P Cable 0.5m 12Gbps Hard Drive Data Transmission Splitter Cord

What is the SAS cable?

SAS is a point-to-point connected storage system that has many advantages over previous parallel SCS connection systems. It is a smaller, more flexible serial design connection system that replaces SCS. The SAS connector allows the device to be connected via a cable or directly to the backboard. Data transmission speed can reach 12Gbps.

Features:

Data transmission cable, MINI SAS 36P SFF 8087 to SATA 7P.

Transmission rate up to 12Gbps, fast quick.

Plug and use, universal for various size of the hard drive.

Support hot swap, SATA interface.

Specifications:

Model: G0101

Working Frequency: High Frequency

Application Area: Network Communication

Interface Type: SATA/ATA

Shape: Strip

Line Length: 500mm/19.69"/ 30cm

Features: Fire Retardant

Number Of Pin: 36P

Notes:

1. Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!

2. Please allow 1-3mm measuring deviation due to manual measurement.

G94-665-B1

Part Number G94-665-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0920

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Buy Tweezers Set: * VETUS ESD-10 ESD-11 ESD-12 ESD-13 ESD-14 ESD-15 ESD-16

EM2500IBJ23HM E1-2500

Part Number EM2500IBJ23HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Bulk new

EM2500IBJ23HM E1-2500 Processor AMD Mobile CPU BGA769 1.4 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

2in1 Black Brush Plastic Round Handle Anti Static ESD Scraper

N10P-GE-A2 GT240M

Part Number N10P-GE-A2 Manufacturer N10P-GE-A2

BGA Alloy No Pb/Lead Free Date Code 0925

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Dell 3721 5721 17RV p/n: DC02001MH00 0249YD

216-0867030

Part Number 216-0867030 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1512

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock