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MX 25L6406EM2I12G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000899
€3.45

MX 25L6406EM2I-12G

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4415U SR348 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000900
€4.35

4415U SR348 Stencil Template

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Intersil ISL6215

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000902
€3.45

Intersil ISL6215

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2150910018 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000903
€6.71

215-0910018 Stencil Template

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GFGO7600THNA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000904
€5.40

GF-GO7600T-H-N-A2 Stencil Template

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MCP67MDA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000905
€5.40

MCP67MD-A2 Stencil Template

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XELTEK SuperPro 7500 High Speed StandAlone Universal Device Programmer

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer:

Login to Download: Download software

Features:

> Until now,Support 310 IC manufacturer, 77083 pcs devices and keeps growing.

> Support devices with Vcc from 1.2V to 5V.

> The programming speed up further increase 30% compared to SUPERPRO 5000.

> The programmer support files up to 256 GBytes

> Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. New device support will be easier.

> PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.

User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode.

> Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.

> Advanced and powerful functions.

Production mode start chip operation at the moment the chip is inserted in the socket properly.

Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.

Password can be set for project files and production volume control

Batch command combines device operations like program, verify, security into a single command at any sequence.

Serial numbers generators are available as standard or customer-specific functions.

Log file is useful for quality tracking.

> ver-current and over-voltage protection for safety of the chip and programmer hardware.

> WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility

Program Speed table

Manufacturer Device 3968MB (P+V) 1984MB (P+V) 1024MB (P+V)

TOSHIBA THGBM6D1KBAIL 221s 98 s 52 s

SANDISK SDIN7DU2-32G 314 s 155 s 56 s

SAMSUNG KLMCG8GE4A 320 s 158 s 58 s

SAMSUNG KLMAG4FEKA 318 s 160 s 62 s

Device Updates:

XELTEK updates software and device algorithm regularly.

View the latestDevice List .

Download the current software version free of charge .

Updates are available by mail at a nominal charge.

XELTEK also adds devices upon customer's request at its option.

Warranty Support:

Programmer is warranted to be free of manufacturing or workmanship defects for one year from the date of purchase.

Online Technical Support is also available 24 hours or you may call us during our business hours through Friday 8:30am to 5:30pm (Beijing Time).

Hardware & Electrical Specifications:

Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND)n, BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU.

Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...

PC interface: USB2.0 LAN

Stand-alone Feature: Supported, SD Card .

Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output 12V/1.5A; power:15W

Mechanical parameter: Main unit: Size: 181*138*90 mm Weight: 1.2Kg.

Packing Box: Size 310*240*140 mm Weight: 1.9 Kg.

Accessories:

Main unit, AC adaptor, USB2.0 cable, software CD (user manual), register card

Optional accessories: ZIF48 Socket, adaptor in varies packages, SD card for stand-alone operation.

CH000906
€1,799.00

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer

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G86636A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000908
€5.40

G86-636-A2 Stencil Template

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Realtek RTL8111GUX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000909
€3.45

Realtek RTL8111GUX

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RICHTEK RT8841

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000910
€3.45

RICHTEK RT8841

MX 25L6406EM2I12G

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000899
€3.45

MX 25L6406EM2I-12G

wishlist
Compare

4415U SR348 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000900
€4.35

4415U SR348 Stencil Template

wishlist
Compare

Intersil ISL6215

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000902
€3.45

Intersil ISL6215

wishlist
Compare

2150910018 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000903
€6.71

215-0910018 Stencil Template

wishlist
Compare

GFGO7600THNA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000904
€5.40

GF-GO7600T-H-N-A2 Stencil Template

wishlist
Compare

MCP67MDA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000905
€5.40

MCP67MD-A2 Stencil Template

wishlist
Compare

XELTEK SuperPro 7500 High Speed StandAlone Universal Device Programmer

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer:

Login to Download: Download software

Features:

> Until now,Support 310 IC manufacturer, 77083 pcs devices and keeps growing.

> Support devices with Vcc from 1.2V to 5V.

> The programming speed up further increase 30% compared to SUPERPRO 5000.

> The programmer support files up to 256 GBytes

> Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. New device support will be easier.

> PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.

User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode.

> Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.

> Advanced and powerful functions.

Production mode start chip operation at the moment the chip is inserted in the socket properly.

Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.

Password can be set for project files and production volume control

Batch command combines device operations like program, verify, security into a single command at any sequence.

Serial numbers generators are available as standard or customer-specific functions.

Log file is useful for quality tracking.

> ver-current and over-voltage protection for safety of the chip and programmer hardware.

> WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility

Program Speed table

Manufacturer Device 3968MB (P+V) 1984MB (P+V) 1024MB (P+V)

TOSHIBA THGBM6D1KBAIL 221s 98 s 52 s

SANDISK SDIN7DU2-32G 314 s 155 s 56 s

SAMSUNG KLMCG8GE4A 320 s 158 s 58 s

SAMSUNG KLMAG4FEKA 318 s 160 s 62 s

Device Updates:

XELTEK updates software and device algorithm regularly.

View the latestDevice List .

Download the current software version free of charge .

Updates are available by mail at a nominal charge.

XELTEK also adds devices upon customer's request at its option.

Warranty Support:

Programmer is warranted to be free of manufacturing or workmanship defects for one year from the date of purchase.

Online Technical Support is also available 24 hours or you may call us during our business hours through Friday 8:30am to 5:30pm (Beijing Time).

Hardware & Electrical Specifications:

Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND)n, BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU.

Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...

PC interface: USB2.0 LAN

Stand-alone Feature: Supported, SD Card .

Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output 12V/1.5A; power:15W

Mechanical parameter: Main unit: Size: 181*138*90 mm Weight: 1.2Kg.

Packing Box: Size 310*240*140 mm Weight: 1.9 Kg.

Accessories:

Main unit, AC adaptor, USB2.0 cable, software CD (user manual), register card

Optional accessories: ZIF48 Socket, adaptor in varies packages, SD card for stand-alone operation.

CH000906
€1,799.00

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer

wishlist
Compare

G86636A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000908
€5.40

G86-636-A2 Stencil Template

wishlist
Compare

Realtek RTL8111GUX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000909
€3.45

Realtek RTL8111GUX

wishlist
Compare

RICHTEK RT8841

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000910
€3.45

RICHTEK RT8841

wishlist
Compare
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