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  • Categories: CPU and Graphic Chips
  • Categories: Laptop Parts, Repair tool
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  • Condition: New

216MCA4ALA12FG XPRESS1100

216MCA4ALA12FG XPRESS1100

Part Number 216MCA4ALA12FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0715

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004004
€15.31

216MCA4ALA12FG XPRESS1100

SR1W5 N2807

SR1W5 N2807

Part Number SR1W5 N2807 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1W5 N2807 FH8065301730502 Intel Mobile Celeron CPU BGA1170 1 58 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004016
€41.52

SR1W5 N2807

N10MGE1S G105M

N10M-GE1-S G105M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004019
€6.56

N10M-GE1-S G105M

216PLAKB26FG X1600

216PLAKB26FG X1600

Part Number 216PLAKB26FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0749

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004025
€19.14

216PLAKB26FG X1600

SR3S0 N4100

SR3S0 N4100

Part Number SR3S0 N4100 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004053
€57.44

SR3S0 N4100

7pcs VETUS ESD Safe AntiStatic Stainless Steel Tweezers Set Maintenance Repair Tools

Buy Tweezers Set: * VETUS ESD-10 ESD-11 ESD-12 ESD-13 ESD-14 ESD-15 ESD-16

Set Include: 7pcs Anti-static ESD Tweezers

Condition: Brand New

Material: Stainless Steel

Color: Black(As Picture Shows)

Features:

A set of 6 different high-quality precision tweezers for all types of fine, detailed work.

Resistive ESD coating helps protect electronics from static damage.

Durable stainless steel material, non-magnetic and resistant to most acids and other corrosive agents.

Precision machined for exact alignment and a perfect grip at the tips.

Excellent for electronics, jewelry and other fine crafts, medical and laboratory work, cosmetic hair removal, and much more.

Size:

ESD-10 fine tip, straight (120mm)

ESD-11: fine tip, straight (140mm)

ESD-12: fine tip, straight (135mm)

ESD-13: rounded spade tip, straight (115mm)

ESD-14: super fine tip, straight (120mm)

ESD-15: fine tip, angled (120mm)

ESD-16: fine tip, angled (120mm)

Friendly Tips: Please Keep It Out Reach Of Child.

CH003151
€6.09

7pcs VETUS ESD Safe Anti-Static Stainless Steel Tweezers Set Maintenance Repair Tools

SR1LX N2810

SR1LX N2810

Part Number SR1LX N2810 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004071
€24.62

SR1LX N2810

Foxconn Socket LGA2011V3 CPU Base PC Connector BGA Base

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003168
€9.82

Foxconn Socket LGA2011-V3 CPU Base PC Connector BGA Base

216MCA4ALA12FG XPRESS1100

216MCA4ALA12FG XPRESS1100

Part Number 216MCA4ALA12FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0715

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004004
€15.31

216MCA4ALA12FG XPRESS1100

SR1W5 N2807

SR1W5 N2807

Part Number SR1W5 N2807 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR1W5 N2807 FH8065301730502 Intel Mobile Celeron CPU BGA1170 1 58 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004016
€41.52

SR1W5 N2807

N10MGE1S G105M

N10M-GE1-S G105M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004019
€6.56

N10M-GE1-S G105M

216PLAKB26FG X1600

216PLAKB26FG X1600

Part Number 216PLAKB26FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0749

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004025
€19.14

216PLAKB26FG X1600

SR3S0 N4100

SR3S0 N4100

Part Number SR3S0 N4100 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004053
€57.44

SR3S0 N4100

7pcs VETUS ESD Safe AntiStatic Stainless Steel Tweezers Set Maintenance Repair Tools

Buy Tweezers Set: * VETUS ESD-10 ESD-11 ESD-12 ESD-13 ESD-14 ESD-15 ESD-16

Set Include: 7pcs Anti-static ESD Tweezers

Condition: Brand New

Material: Stainless Steel

Color: Black(As Picture Shows)

Features:

A set of 6 different high-quality precision tweezers for all types of fine, detailed work.

Resistive ESD coating helps protect electronics from static damage.

Durable stainless steel material, non-magnetic and resistant to most acids and other corrosive agents.

Precision machined for exact alignment and a perfect grip at the tips.

Excellent for electronics, jewelry and other fine crafts, medical and laboratory work, cosmetic hair removal, and much more.

Size:

ESD-10 fine tip, straight (120mm)

ESD-11: fine tip, straight (140mm)

ESD-12: fine tip, straight (135mm)

ESD-13: rounded spade tip, straight (115mm)

ESD-14: super fine tip, straight (120mm)

ESD-15: fine tip, angled (120mm)

ESD-16: fine tip, angled (120mm)

Friendly Tips: Please Keep It Out Reach Of Child.

CH003151
€6.09

7pcs VETUS ESD Safe Anti-Static Stainless Steel Tweezers Set Maintenance Repair Tools

SR1LX N2810

SR1LX N2810

Part Number SR1LX N2810 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004071
€24.62

SR1LX N2810

Foxconn Socket LGA2011V3 CPU Base PC Connector BGA Base

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003168
€9.82

Foxconn Socket LGA2011-V3 CPU Base PC Connector BGA Base