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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Other BGA Chips & ICs
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apple 339S0242

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000326
€4.77

apple 339S0242

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POWER SUPPLY 310W Apple iMac 27 A1312 Mid 2011 MC813 MC814 PA231102A

COMPATIBILITY

iMac 27" A1312

iMac10,1 Late 2009: MB952LL/A (3.06 GHz Core 2 Duo)

iMac10,1 Late 2009: MB952LL/A (3.33 GHz Core 2 Duo)

iMac11,1 Late 2009: MB953LL/A (2.66 GHz Core i5)

iMac11,1 Late 2009: MB953LL/A (2.8 GHz Core i7)

iMac11,3 Mid 2010: MC510LL/A (3.2 GHz Core i3)

iMac11,3 Mid 2010: MC511LL/A (2.8 GHz Core i5)

iMac11,3 Mid 2010: MC511LL/A (3.6 GHz Core i5)

iMac11,3 Mid 2010: MC511LL/A (2.93 GHz Core i7)

iMac12,2 Mid 2011: MC813LL/A (2.7 GHz Core i5)

iMac12,2 Mid 2011: MC814LL/A (3.1 GHz Core i5)

iMac12,2 Mid 2011: MD063LL/A (3.4 GHz Core i7)

IDENTIFYING NUMBERS

Apple Part #:661-5310, 661-5468, 661-5972

CH001229
€98.21

POWER SUPPLY 310W - Apple iMac 27 A1312 Mid 2011 MC813 MC814 PA-2311-02A

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ITE IT8718FS HXS GB

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000329
€3.97

ITE IT8718F-S HXS GB

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FAIRCHILD FAN7601N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000338
€3.45

FAIRCHILD FAN7601N

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Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G SSD to 25 SATA converter ID16

Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G ssd to 2.5 SATA converter ID16

GOODS DESCRIPTION:

PA5025A Apple MACBOOK AIR A1369 A1370 A1377 64G 128G 256G ssd to 2.5 SATA converter Adapter card

FEATURES

100% Brand NEW and High Quality

PA525 Apple MACBOOK AIR A1369 A1370 A1377 64G 128G 256G ssd to 3.5" SATA converter Adapter card is smaller than a 2.5 inch SATA HDD.

1. Only for APPLE MacBook Air MC505 MC503 MC506 MC968 MC969 MC965 = Late 2010 MacBook Air 3,1 (A1370)/3,2 (A1369)& Mid 2011 MacBook Air.

Fit the following SSD models from Apple MACBOOK AIR: A1369 A1370 1375 A1377 mc505 mc506 ssd:

toshiba THNSNC128GMDJ, toshiba THNSNC256GMDJ, Samsung MZ-CPA0640/0A2(64GB),Samsung MZ-CPA1280/0A2(128GB) ,Samsung MZ-CPA2560/0A5(256GB)

2. Not FIT 2.5 inch SATA HDD because the length of the adapter plate is bigger than 2.5 inch SATA HDD. Only converted to 2.5 inch SATA HDD

3. No need extra power adapter and any drivers .

4. Supports DOS, Win98/SE, 2000, Server 2003, XP, Vista, 7, Sever 2008 & Mac OS & Linux.

5.Compatible with both 3.3V and 5V Power.

6. dimension: 132mm x 43mm x 12mm

CH001309
€11.06

Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G SSD to 2.5 SATA converter ID16

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Maxim MAX1997

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000340
€3.45

Maxim MAX1997

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DC IN USB Jack Encendido Audio Placa 8203057A Apple MacBook Air 13A1369 2011

DC IN USB Jack Power Audio Board 820-3057-A Apple MacBook Air 13A1369 2011

Product Condition:

Etat Neuf

Compatible Model:

MacBook Air 13A1369 2011

Compatible Subfamily:

MacBook Air "Core i51.6 13(Edu Only)

MacBook Air "Core i51.7 13(Mid-2011)

MacBook Air "Core i71.8 13(Mid-2011)

Compatible Model No:

MC965LL/A*, MD508LL/A*

CH001441
€47.12

DC IN USB Jack Encendido Audio Placa 820-3057-A Apple MacBook Air 13A1369 2011

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Diodes AP4957GM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000342
€3.45

Diodes AP4957GM

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Intersil ISL6259AHRTZ_TQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000344
€3.45

Intersil ISL6259AHRTZ_TQFN

apple 339S0242

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000326
€4.77

apple 339S0242

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POWER SUPPLY 310W Apple iMac 27 A1312 Mid 2011 MC813 MC814 PA231102A

COMPATIBILITY

iMac 27" A1312

iMac10,1 Late 2009: MB952LL/A (3.06 GHz Core 2 Duo)

iMac10,1 Late 2009: MB952LL/A (3.33 GHz Core 2 Duo)

iMac11,1 Late 2009: MB953LL/A (2.66 GHz Core i5)

iMac11,1 Late 2009: MB953LL/A (2.8 GHz Core i7)

iMac11,3 Mid 2010: MC510LL/A (3.2 GHz Core i3)

iMac11,3 Mid 2010: MC511LL/A (2.8 GHz Core i5)

iMac11,3 Mid 2010: MC511LL/A (3.6 GHz Core i5)

iMac11,3 Mid 2010: MC511LL/A (2.93 GHz Core i7)

iMac12,2 Mid 2011: MC813LL/A (2.7 GHz Core i5)

iMac12,2 Mid 2011: MC814LL/A (3.1 GHz Core i5)

iMac12,2 Mid 2011: MD063LL/A (3.4 GHz Core i7)

IDENTIFYING NUMBERS

Apple Part #:661-5310, 661-5468, 661-5972

CH001229
€98.21

POWER SUPPLY 310W - Apple iMac 27 A1312 Mid 2011 MC813 MC814 PA-2311-02A

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ITE IT8718FS HXS GB

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000329
€3.97

ITE IT8718F-S HXS GB

wishlist
Compare

FAIRCHILD FAN7601N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000338
€3.45

FAIRCHILD FAN7601N

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Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G SSD to 25 SATA converter ID16

Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G ssd to 2.5 SATA converter ID16

GOODS DESCRIPTION:

PA5025A Apple MACBOOK AIR A1369 A1370 A1377 64G 128G 256G ssd to 2.5 SATA converter Adapter card

FEATURES

100% Brand NEW and High Quality

PA525 Apple MACBOOK AIR A1369 A1370 A1377 64G 128G 256G ssd to 3.5" SATA converter Adapter card is smaller than a 2.5 inch SATA HDD.

1. Only for APPLE MacBook Air MC505 MC503 MC506 MC968 MC969 MC965 = Late 2010 MacBook Air 3,1 (A1370)/3,2 (A1369)& Mid 2011 MacBook Air.

Fit the following SSD models from Apple MACBOOK AIR: A1369 A1370 1375 A1377 mc505 mc506 ssd:

toshiba THNSNC128GMDJ, toshiba THNSNC256GMDJ, Samsung MZ-CPA0640/0A2(64GB),Samsung MZ-CPA1280/0A2(128GB) ,Samsung MZ-CPA2560/0A5(256GB)

2. Not FIT 2.5 inch SATA HDD because the length of the adapter plate is bigger than 2.5 inch SATA HDD. Only converted to 2.5 inch SATA HDD

3. No need extra power adapter and any drivers .

4. Supports DOS, Win98/SE, 2000, Server 2003, XP, Vista, 7, Sever 2008 & Mac OS & Linux.

5.Compatible with both 3.3V and 5V Power.

6. dimension: 132mm x 43mm x 12mm

CH001309
€11.06

Apple MACBOOK AIR 2011 A1369 A1370 A1377 64G 128G 256G SSD to 2.5 SATA converter ID16

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Compare

Maxim MAX1997

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000340
€3.45

Maxim MAX1997

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DC IN USB Jack Encendido Audio Placa 8203057A Apple MacBook Air 13A1369 2011

DC IN USB Jack Power Audio Board 820-3057-A Apple MacBook Air 13A1369 2011

Product Condition:

Etat Neuf

Compatible Model:

MacBook Air 13A1369 2011

Compatible Subfamily:

MacBook Air "Core i51.6 13(Edu Only)

MacBook Air "Core i51.7 13(Mid-2011)

MacBook Air "Core i71.8 13(Mid-2011)

Compatible Model No:

MC965LL/A*, MD508LL/A*

CH001441
€47.12

DC IN USB Jack Encendido Audio Placa 820-3057-A Apple MacBook Air 13A1369 2011

wishlist
Compare

Diodes AP4957GM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000342
€3.45

Diodes AP4957GM

wishlist
Compare

Intersil ISL6259AHRTZ_TQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000344
€3.45

Intersil ISL6259AHRTZ_TQFN

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Compare
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