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2160833132 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000265
€5.40

216-0833132 Stencil Template

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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000266
€5.40

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57500 MNE92LLA

PO000001
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7500 MNE92LL/A

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57600 MNEA2LLA

PO000002
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7600 MNEA2LL/A

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2150708001 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000274
€5.40

215-0708001 Stencil Template

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J5005 SR3S3 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000280
€14.92

J5005 SR3S3 Stencil Template 90*90

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57600K MNED2LLA

PO000003
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7600K MNED2LL/A

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2160833000 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000287
€5.40

216-0833000 Stencil Template

  • -20%
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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i7 I77700K BTOCTO

PO000004
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i7 I7-7700K BTO/CTO

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N15EGTA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000288
€7.46

N15E-GT-A2 Stencil Template

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A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LLA

PO000005
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LL/A

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N17EESA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000291
€7.46

N17E-ES-A1 Stencil Template

2160833132 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000265
€5.40

216-0833132 Stencil Template

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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000266
€5.40

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57500 MNE92LLA

PO000001
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7500 MNE92LL/A

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A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57600 MNEA2LLA

PO000002
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7600 MNEA2LL/A

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2150708001 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000274
€5.40

215-0708001 Stencil Template

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Compare

J5005 SR3S3 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000280
€14.92

J5005 SR3S3 Stencil Template 90*90

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Compare
  • -20%

A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i5 I57600K MNED2LLA

PO000003
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i5 I5-7600K MNED2LL/A

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2160833000 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000287
€5.40

216-0833000 Stencil Template

wishlist
Compare
  • -20%

A1419 EMC 3070 Bios Chip EFI Firmware 820-00609 Retina Mid2017 Core i7 I77700K BTOCTO

PO000004
€19.80 €24.75

A1419 EMC 3070 Bios EFI Firmware 820-00609 Retina Mid-2017 Core i7 I7-7700K BTO/CTO

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N15EGTA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000288
€7.46

N15E-GT-A2 Stencil Template

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  • -20%

A1283 EMC 2264 Bios Chip EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LLA

PO000005
€18.00 €22.50

A1283 EMC 2264 Bios EFI Firmware 820-2366 Early 2009 Core 2 Duo P7350 MB463LL/A

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N17EESA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000291
€7.46

N17E-ES-A1 Stencil Template

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