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  • Categories: BGA Reballing Kits, Stencils
  • Categories: DC Jacks, Connector
  • Categories: Laptop Parts, Repair tool
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2150876184 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000231
€9.22

215-0876184 Stencil Template 90*90

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NFSPP100NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000241
€5.40

NF-SPP-100-N-A2 Stencil Template

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i56300HQ SR2FP Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000246
€6.84

i5-6300HQ SR2FP Stencil Template

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DC Power Jack Part PJ063

Acer Aspire 4410 Series DC Power Jack Connector: 4410 AS4410-xxxx AS4410

Acer Aspire Timeline 4810 (MS2271) Series DC Power Jack Connector: MS2271, 4810-4439 AS4810-4439, 4810T-351G16Mn AS4810T-351G16Mn, 4810T-351G25Mn AS4810T-351G25Mn, 4810T-352G16Mn AS4810T-352G16Mn, 4810T-352G25Mn AS4810T-352G25Mn, 4810T-352G32Mn AS4810T-352G32Mn, 4810T-353G25Mn AS4810T-353G25Mn, 4810T-353G32Mn AS4810T-353G32Mn, 4810T-354G32Mi AS4810T-354G32Mi, 4810T-354G32Mn AS4810T-354G32Mn, 4810T-354G50Mi AS4810T-354G50Mi, 4810T-354G50Mn AS4810T-354G50Mn, 4810T-942G32Mn AS4810T-942G32Mn, 4810T-942G50Mn AS4810T-942G50Mn, 4810T-944G32Mn AS4810T-944G32Mn, 4810T-944G50Mi AS4810T-944G50Mi, 4810T-944G50Mn AS4810T-944G50Mn, 4810T-8194 AS4810T-8194, 4810T-8480 AS4810T-8480, 4810T-8702 AS4810T-8702, 4810TG-352G25Mn AS4810TG-352G25Mn, 4810TG-352G32Mn AS4810TG-352G32Mn, 4810TG-354G50Mi AS4810TG-354G50Mi, 4810TG-354G50Mn AS4810TG-354G50Mn, 4810TG-942G32Mn AS4810TG-942G32Mn, 4810TG-944G32Mn AS4810TG-944G32Mn, 4810TZ-271G16Mn AS4810TZ-271G16Mn, 4810TZ-272G16Mn AS4810TZ-272G16Mn, 4810TZ-272G25Mn AS4810TZ-272G25Mn, 4810TZ-272G32Mn AS4810TZ-272G32Mn, 4810TZ-273G32Mn AS4810TZ-273G32Mn, 4810TZ-274G25Mi AS4810TZ-274G25Mi, 4810TZ-274G25Mn AS4810TZ-274G25Mn, 4810TZ-4011 AS4810TZ-4011, 4810TZ-4120 AS4810TZ-4120, 4810TZ-4183 AS4810TZ-4183, 4810TZ-4439 AS4810TZ-4439, 4810TZ-4473 AS4810TZ-4473, 4810TZ-4508 AS4810TZ-4508, 4810TZG-274G32Mn AS4810TZG-274G32Mn

Acer Aspire 5810 Series DC Power Jack Connector: MS2272, 5810 AS5810, 5810T AS5810T, 5810TG-354G32Mn AS5810TG-354G32Mn, 5810TZ AS5810TZ, 5810TZ-4112 AS5810TZ-4112, 5810TZ-4274 AS5810TZ-4274, 5810TZ-4657 AS5810TZ-4657, 5810TZ-4761 AS5810TZ-4761, 5810TZ-4784 AS5810TZ-4784, 5810Z AS5810Z

Gateway EC54 Series DC Power Jack Connector: EC54

Gateway EC58 Series DC Power Jack Connector: EC58

CH001060
€7.21

DC Power Jack, Part #PJ063

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ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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BST8800E Repair Tools Kit Set ScrewDriver For Electronics PC Mobile Iphone PDA Tablet

Disassemble Tool

Brands: Best

Model: BST-8800E

Size: 4.3 x 5.7 x 0.7

Weight: 168g

Item Included: 10x Screw Drive - T3/T4/T5/T6/-2.0/Phillips 00/ Phillips 000/?0.8/?1.2/Y2.5/flat 2.0

Features:

1. The handle is made of ABS material with high hardness, good stability, resistance to environmental change

2. Carved stripes, beautiful, easy to draw the line and have non-slip

3. Flexible rotating nut, effectively improve the efficiency of

4. Batch mouth using high quality chrome vanadium steel, superior strength and toughness

5. High quality steel manufacturing, through the whole heat treatment, titanium plating, to ensure product quality

CH000314
€9.82

BST-8800E Repair Tools Kit Set ScrewDriver For Electronics PC Mobile Iphone PDA Tablet

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GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

2150876184 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000231
€9.22

215-0876184 Stencil Template 90*90

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NFSPP100NA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000241
€5.40

NF-SPP-100-N-A2 Stencil Template

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i56300HQ SR2FP Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000246
€6.84

i5-6300HQ SR2FP Stencil Template

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DC Power Jack Part PJ063

Acer Aspire 4410 Series DC Power Jack Connector: 4410 AS4410-xxxx AS4410

Acer Aspire Timeline 4810 (MS2271) Series DC Power Jack Connector: MS2271, 4810-4439 AS4810-4439, 4810T-351G16Mn AS4810T-351G16Mn, 4810T-351G25Mn AS4810T-351G25Mn, 4810T-352G16Mn AS4810T-352G16Mn, 4810T-352G25Mn AS4810T-352G25Mn, 4810T-352G32Mn AS4810T-352G32Mn, 4810T-353G25Mn AS4810T-353G25Mn, 4810T-353G32Mn AS4810T-353G32Mn, 4810T-354G32Mi AS4810T-354G32Mi, 4810T-354G32Mn AS4810T-354G32Mn, 4810T-354G50Mi AS4810T-354G50Mi, 4810T-354G50Mn AS4810T-354G50Mn, 4810T-942G32Mn AS4810T-942G32Mn, 4810T-942G50Mn AS4810T-942G50Mn, 4810T-944G32Mn AS4810T-944G32Mn, 4810T-944G50Mi AS4810T-944G50Mi, 4810T-944G50Mn AS4810T-944G50Mn, 4810T-8194 AS4810T-8194, 4810T-8480 AS4810T-8480, 4810T-8702 AS4810T-8702, 4810TG-352G25Mn AS4810TG-352G25Mn, 4810TG-352G32Mn AS4810TG-352G32Mn, 4810TG-354G50Mi AS4810TG-354G50Mi, 4810TG-354G50Mn AS4810TG-354G50Mn, 4810TG-942G32Mn AS4810TG-942G32Mn, 4810TG-944G32Mn AS4810TG-944G32Mn, 4810TZ-271G16Mn AS4810TZ-271G16Mn, 4810TZ-272G16Mn AS4810TZ-272G16Mn, 4810TZ-272G25Mn AS4810TZ-272G25Mn, 4810TZ-272G32Mn AS4810TZ-272G32Mn, 4810TZ-273G32Mn AS4810TZ-273G32Mn, 4810TZ-274G25Mi AS4810TZ-274G25Mi, 4810TZ-274G25Mn AS4810TZ-274G25Mn, 4810TZ-4011 AS4810TZ-4011, 4810TZ-4120 AS4810TZ-4120, 4810TZ-4183 AS4810TZ-4183, 4810TZ-4439 AS4810TZ-4439, 4810TZ-4473 AS4810TZ-4473, 4810TZ-4508 AS4810TZ-4508, 4810TZG-274G32Mn AS4810TZG-274G32Mn

Acer Aspire 5810 Series DC Power Jack Connector: MS2272, 5810 AS5810, 5810T AS5810T, 5810TG-354G32Mn AS5810TG-354G32Mn, 5810TZ AS5810TZ, 5810TZ-4112 AS5810TZ-4112, 5810TZ-4274 AS5810TZ-4274, 5810TZ-4657 AS5810TZ-4657, 5810TZ-4761 AS5810TZ-4761, 5810TZ-4784 AS5810TZ-4784, 5810Z AS5810Z

Gateway EC54 Series DC Power Jack Connector: EC54

Gateway EC58 Series DC Power Jack Connector: EC58

CH001060
€7.21

DC Power Jack, Part #PJ063

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ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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BST8800E Repair Tools Kit Set ScrewDriver For Electronics PC Mobile Iphone PDA Tablet

Disassemble Tool

Brands: Best

Model: BST-8800E

Size: 4.3 x 5.7 x 0.7

Weight: 168g

Item Included: 10x Screw Drive - T3/T4/T5/T6/-2.0/Phillips 00/ Phillips 000/?0.8/?1.2/Y2.5/flat 2.0

Features:

1. The handle is made of ABS material with high hardness, good stability, resistance to environmental change

2. Carved stripes, beautiful, easy to draw the line and have non-slip

3. Flexible rotating nut, effectively improve the efficiency of

4. Batch mouth using high quality chrome vanadium steel, superior strength and toughness

5. High quality steel manufacturing, through the whole heat treatment, titanium plating, to ensure product quality

CH000314
€9.82

BST-8800E Repair Tools Kit Set ScrewDriver For Electronics PC Mobile Iphone PDA Tablet

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Compare

GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

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