Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

T48 (TL866II 3rd Generation) Programmer Support 31000+ ICS for EPROM / MCU / SPI / Nor / NAND Flash / EMMC.

• Programming speed much faster: (30MHZ); for SPI NOR FLASH 25Q128, 30s+5.4s(P+V) (30MHZ); for P_NAND 29F1G08AB, 27s+17s(P+V); for P_NOR FLASH EN29LV320 TSOP48, 24s+1.9s(P+V)......
• Support EMMC/EMCP; P-NAND; SPI NAND FLASH; GAL PLD; MCU: 51/PIC/AVR; 27/28/29/39/49/50; 24/25/45/93/95; 74 Series Logic IC Visual Test
• Production of high-density SMD technology, a unified user interface, easy to use, fully functional, reliable program running of application software, ultra-small (size is almost the same as TL866II), code-runs much faster, support multilanguage menu (English, Chinese, Russian, Polish, German, Spanish, Portuguese, Turkish, Czech, Italian), it can automatically identify the operating system to install and run under Windows XP,2003,2008,Vista Win7 WIN8 WIN10 WIN11.
• T48 hardware Parameters: 32-bit MCU with 120MHZ, 4-layer PCB Design, USB2.0 HS 480MHZ; Volume: 10X6.5X2.8 cm (almost the same as TL866II); 16 channel ISP, total 56-channel dedicated IO, 56-channel high-speed high-voltage isolation; VCC voltage 1.8-6.5V 64 levels adjustable, VPP voltage 9V-25V 64 levels adjustable; Power consumption: 5V <500MA.
• With 40-pin industrial high-quality ZIF Socket (Pluggable/replaceable), newest model T48 (TL866-3G) programmer is the improvement of TL866II Plus programmer. Based on 32-bit MCU with 120MHZ and 4-layer PCB design, this professional T48 programmer support high-capacity NAND EMMC up to 256GB and programming speed is much higher. Suppport high-voltage chips, such as 27Cxxx series, VCC Maximum up to 25V, that is what TL866II cannot achieve.

DH82HM87 SR17D

Part Number DH82HM87 SR17D Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N11M-OP2-S-A3 G210M

Part Number N11M-OP2-S-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1014

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

In package included:

1 pcs x GZUT EZP XPRO Programmer

1 pcs x EFI Riboon Cable

2 pcs x small PCB

1 pcs x USB cable

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 With this Professional SET you can make adjustments for Bios manually and fix EFI.

This flashing set (GZUT v2 PRO + EFI RIBBON CABLE) used for Mcbook, McBook Air and new McBook Pro models from 2010 to 2017 

It has three connectors for the years 2010 – 2011, 2012 – 2014 and 2015 – 2017

You can read bios chip without desoldering process. 

Programmer EZP GZUT v2 PRO set supported  :

MBA11 2015 A1465 820-00164
MBA11 2013 A1465 820-3435
MBA13 2011 A1369 820-3023
MBA11 2011 A1370 820-3024
MBA 13 2013 A1466 820-3437
MBA 13 2012 A1466 820-3209
MBA13 2015 A1466 820-00165
MBA13 2017 A1466 820-00165
MBP13 2016 A1708 820-00875
MBP13 2016 A1706 820-00239
MBP15 2017 A1707 820-00928
MBP15 2016 A1707 820-00281
MBP13 2017 A1706 820-00923
MBP13 2017 A1708 820-00840
MBP13 2015 A1502 820-4924
MBP13 2014 A1502 820-3476
MBP13 2014 A1502 820-3536 
MBP13 2013 A1502 820-3476
MBP13 2014 A1502 820-3476
MBP15 2012 A1398 820-3332
MBP15 2013 A1398 820-3332
MBP15 2013 A1398 820-3662
MBP15 2013 A1398 820-3787
MBP15 2014 A1398 820-3662
MBP15 2015 A1398 820-00138 
MBP15 2015 A1398 820-00163
MBP12 2015 A1534 820-00045
MBP12 2016 A1534 820-00244
MacMini 2011 A1347 820-2993

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B - EFI ribbon cable not compatible, support GOLDEN pin silicone cable. 

You can used GOLD PIN SILICONE CABLE and read this bios chip (visit our shop and check)

Apple A1278 K6 MCP89MZ-A2 SST25VF032B -  EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Imac 27 A1312 820-2828-A_MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1297 820-2914-B-MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E  - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

In our store also you can find and Chips Cards: 

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect  - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SR3S1 N4000

Part Number SR3S1 N4000 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock