G86-620-A2 8400MGS

Part Number G86-620-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1225

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

G92-740-A2 8800MGTS

Part Number G92-740-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Buy Tweezers Set: * VETUS ESD-10 ESD-11 ESD-12 ESD-13 ESD-14 ESD-15 ESD-16

GF-GO7300T-B-N-A3

Part Number GF-GO7300T-B-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1202

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

20mm*30m Single Conductive COPPER FOIL TAPE Electronic Tool

Part Number Copper Foil Tape Material CU 99.98%

Side One Sided Conductive Heat Resistance -10 ?~120 ?

Adhesion Single sided adhesive Size 20mm*30m

GF116-100-KA-A1

Part Number GF116-100-KA-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base

Part Number LGA1150 Socket Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Socket type BGA1150

Package/Case 1 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

218-0755034

Part Number 218-0755034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

HDD Open repair&data recovery tool: * Use Tutorials Video

HD HPE PRO: A Must-Have hardware level of disk repair and data recovery equipment, which enables you an easy and exact drive disassembling and HEAD stack/Platter exchange.

Main Features: Easy to use; Universal-fit workbench; Pioneer platter exchanger; change multiple platters without moving the platters out of alignment with each other; Special Actuator Remover with strong magnetism works (removal, installation) easily on the upper magnet of the actuator.

Highlights:

Universal-fit workbench assures you to operate on your HD on a relatively stable table, making your job easier and more reliable.

Pioneer platter exchanger maintains the original cylinder status by removing and placing each platter of the multiple platters together, so that allows you to change multiple platters without moving the platters out of alignment with each other which otherwise will result in data corruption.

Special Actuator Remover assures you to perform easy operation (removal, installation) on the upper magnet of the actuator which is very hard to be removed and put back because of its strong magnetism and it's sensitive and embarrassed position (being very close to both the Head Stack and Media Platter), in case it slips out and touch either of its fragile neighbors during the operations - the consequences will be a disaster.

Packing List:

1.Universal-fit Workbench -1pc;

2.Multiple Platter Exchanger -4pcs;

3.Stable Actuator Exchanger -1pc;

4.Replacement tools for 2.5 inch disk -1pc

5.Replacement tools for 3.5 inch disk -1pc

6.Tool 96pcs kits

216MSA4ALA12FG RS485M

Part Number 216MSA4ALA12FG Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0832

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N13P-GS-A2 GT640M

Part Number N13P-GS-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Package/Case: 1 PCS