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SR342 i57200U

SR342 i5-7200U

Part Number i5-7200U SR342 Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000960
€237.95

SR342 i5-7200U

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DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A30CR11DLB3H

Description:

1 - Flat printed circuit connector (30 Pin)

COMPATIBILITY:

MacBook Unibody 13" A1278

MacBook5,1 Late 2008: MB466LL/A (2.0 GHz Core 2 Duo)

MacBook5,1 Late 2008: MB467LL/A (2.4 GHz Core 2 Duo)

MacBook Unibody 13" A1342

MacBook6,1 Late 2009: MC207LL/A (2.26 GHz Core 2 Duo)

MacBook7,1 Mid 2010: MC516LL/A (2.4 GHz Core 2 Duo)

MacBook Pro Unibody 13" A1278

MacBookPro5,5 Mid 2009: MB990LL/A (2.26 GHz Core 2 Duo)

MacBookPro5,5 Mid 2009: MB991LL/A (2.53 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC374LL/A (2.4 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC375LL/A (2.66 GHz Core 2 Duo)

MacBookPro8,1 Early 2011: MC700LL/A (2.3 GHz Core i5)

MacBookPro8,1 Early 2011: MC724LL/A (2.7 GHz Core i7)

MacBookPro8,1 Late 2011: MD313LL/A (2.4 GHz Core i5)

MacBookPro8,1 Late 2011: MD314LL/A (2.8 GHz Core i7)

MacBookPro9,2 Mid 2012: MD101LL/A (2.5 GHz Core i5)

MacBookPro9,2 Mid 2012: MD102LL/A (2.9 GHz Core i7)

MacBook Pro Unibody 15" A1286

MacBookPro5,1 Late 2008: MB470LL/A (2.4 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.53 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB985LL/A (2.66 Ghz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (3.06 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MC406LL/A (2.8 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,3 Mid 2009: MC406LL/A (3.06 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,4 Mid 2009: MC118LL/A (2.53 GHz Core 2 Duo)

MacBookPro6,2 Mid 2010: MC371LL/A (2.4 GHz Core i5)

MacBookPro6,2 Mid 2010: MC372LL/A (2.53 GHz Core i5)

MacBookPro6,2 Mid 2010: MC373LL/A (2.66 GHz Core i7)

MacBookPro6,2 Mid 2010: MC373LL/A (2.8 GHZ Core i7)

MacBookPro8,2 Early 2011: MC721LL/A (2.0 GHz Core i7)

MacBookPro8,2 Early 2011: MC723LL/A (2.2 GHz Core i7)

MacBookPro8,2 Early 2011: MD035LL/A (2.3 GHz Core i7)

MacBookPro8,2 Late 2011: MD318LL/A (2.2 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.4 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.5 GHz Core i7)

MacBookPro9,1 Mid 2012: MD103LL/A (2.3 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.6 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.7 GHz Core i7)

MacBook Pro Unibody 17" A1297

MacBookPro5,2 Early 2009: MB604LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,2 Early 2009: MB604LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (3.06 GHz Core 2 Duo)

MacBookPro6,1 Mid 2010: MC024LL/A (2.53 GHz Core i5)

MacBookPro6,1 Mid 2010: MC024LL/A (2.66 GHz Core i7)

MacBookPro6,1 Mid 2010: MC024LL/A (2.8 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.2 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.3 GHz Core i7)

MacBookPro8,3 Late 2011: MD311LL/A (2.4 GHz Core i7)

CH000962
€4.35

DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A-30C-R11DL-B-3H

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SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000965
€5.40

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

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AUO123G1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000966
€3.45

AUO-123G1

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1.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000967
€5.59

1.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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MARVELL 88W8686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000968
€3.97

MARVELL 88W8686

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Intersil ISL6256AHRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000969
€3.45

Intersil ISL6256AHRZ

wishlist
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ATMEL AT24C64

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000970
€3.45

ATMEL AT24C64

SR342 i57200U

SR342 i5-7200U

Part Number i5-7200U SR342 Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000960
€237.95

SR342 i5-7200U

wishlist
Compare

DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A30CR11DLB3H

Description:

1 - Flat printed circuit connector (30 Pin)

COMPATIBILITY:

MacBook Unibody 13" A1278

MacBook5,1 Late 2008: MB466LL/A (2.0 GHz Core 2 Duo)

MacBook5,1 Late 2008: MB467LL/A (2.4 GHz Core 2 Duo)

MacBook Unibody 13" A1342

MacBook6,1 Late 2009: MC207LL/A (2.26 GHz Core 2 Duo)

MacBook7,1 Mid 2010: MC516LL/A (2.4 GHz Core 2 Duo)

MacBook Pro Unibody 13" A1278

MacBookPro5,5 Mid 2009: MB990LL/A (2.26 GHz Core 2 Duo)

MacBookPro5,5 Mid 2009: MB991LL/A (2.53 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC374LL/A (2.4 GHz Core 2 Duo)

MacBookPro7,1 Mid 2010: MC375LL/A (2.66 GHz Core 2 Duo)

MacBookPro8,1 Early 2011: MC700LL/A (2.3 GHz Core i5)

MacBookPro8,1 Early 2011: MC724LL/A (2.7 GHz Core i7)

MacBookPro8,1 Late 2011: MD313LL/A (2.4 GHz Core i5)

MacBookPro8,1 Late 2011: MD314LL/A (2.8 GHz Core i7)

MacBookPro9,2 Mid 2012: MD101LL/A (2.5 GHz Core i5)

MacBookPro9,2 Mid 2012: MD102LL/A (2.9 GHz Core i7)

MacBook Pro Unibody 15" A1286

MacBookPro5,1 Late 2008: MB470LL/A (2.4 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.53 GHz Core 2 Duo)

MacBookPro5,1 Late 2008: MB471LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,1 Early 2009: MC026LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB985LL/A (2.66 Ghz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MB986LL/A (3.06 GHz Core 2 Duo)

MacBookPro5,3 Mid 2009: MC406LL/A (2.8 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,3 Mid 2009: MC406LL/A (3.06 GHz Core 2 Duo) (Anti-Glare Display)

MacBookPro5,4 Mid 2009: MC118LL/A (2.53 GHz Core 2 Duo)

MacBookPro6,2 Mid 2010: MC371LL/A (2.4 GHz Core i5)

MacBookPro6,2 Mid 2010: MC372LL/A (2.53 GHz Core i5)

MacBookPro6,2 Mid 2010: MC373LL/A (2.66 GHz Core i7)

MacBookPro6,2 Mid 2010: MC373LL/A (2.8 GHZ Core i7)

MacBookPro8,2 Early 2011: MC721LL/A (2.0 GHz Core i7)

MacBookPro8,2 Early 2011: MC723LL/A (2.2 GHz Core i7)

MacBookPro8,2 Early 2011: MD035LL/A (2.3 GHz Core i7)

MacBookPro8,2 Late 2011: MD318LL/A (2.2 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.4 GHz Core i7)

MacBookPro8,2 Late 2011: MD322LL/A (2.5 GHz Core i7)

MacBookPro9,1 Mid 2012: MD103LL/A (2.3 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.6 GHz Core i7)

MacBookPro9,1 Mid 2012: MD104LL/A (2.7 GHz Core i7)

MacBook Pro Unibody 17" A1297

MacBookPro5,2 Early 2009: MB604LL/A (2.66 GHz Core 2 Duo)

MacBookPro5,2 Early 2009: MB604LL/A (2.93 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (2.8 GHz Core 2 Duo)

MacBookPro5,2 Mid 2009: MC226LL/A (3.06 GHz Core 2 Duo)

MacBookPro6,1 Mid 2010: MC024LL/A (2.53 GHz Core i5)

MacBookPro6,1 Mid 2010: MC024LL/A (2.66 GHz Core i7)

MacBookPro6,1 Mid 2010: MC024LL/A (2.8 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.2 GHz Core i7)

MacBookPro8,3 Early 2011: MC725LL/A (2.3 GHz Core i7)

MacBookPro8,3 Late 2011: MD311LL/A (2.4 GHz Core i7)

CH000962
€4.35

DDK FUJIKURA FPC FLEXIBLE PRINTED CIRCUIT CONNECTOR 30 PIN FF14A-30C-R11DL-B-3H

wishlist
Compare

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000965
€5.40

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

wishlist
Compare

AUO123G1

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000966
€3.45

AUO-123G1

wishlist
Compare

1.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000967
€5.59

1.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

wishlist
Compare

MARVELL 88W8686

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000968
€3.97

MARVELL 88W8686

wishlist
Compare

Intersil ISL6256AHRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000969
€3.45

Intersil ISL6256AHRZ

wishlist
Compare

ATMEL AT24C64

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000970
€3.45

ATMEL AT24C64

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Compare
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