• Show Sidebar

There are 5243 products.

Active filters

wishlist
Compare
Quickview

RICHTEK RT8209A FH

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000972
€3.45

RICHTEK RT8209A FH=

wishlist
Compare
Quickview

i56287U SR2JJ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000973
€9.97

i5-6287U SR2JJ Stencil Template 90*90

wishlist
Compare
Quickview

G94700A1

G94-700-A1

Part Number G94-700-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0837

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000974
€36.10

G94-700-A1

wishlist
Compare
Quickview

HYNIX H5PS1G63EFR

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000976
€4.77

HYNIX H5PS1G63EFR

wishlist
Compare
Quickview

Maxim MAX8731A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000977
€3.45

Maxim MAX8731A

wishlist
Compare
Quickview

Maxim MAX1773AEUP

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000978
€3.45

Maxim MAX1773AEUP

wishlist
Compare
Quickview

2160707009 HD3470

216-0707009 HD3470

Part Number 216-0707009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1025

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000979
€29.57

216-0707009 HD3470

wishlist
Compare
Quickview

RICHTEK RT8179B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000980
€4.77

RICHTEK RT8179B

wishlist
Compare
Quickview

eMMC BGA153 BGA169 test socket USB Reader IC size 11.5x13mm NAND Flash Test

eMMC153/169 test socket USB Reader IC size 11.5x13mm nand flash test

Login to Download: Download software Data Recovery Tutorial

Limit frame specification: 11.5*13mm

Buy Limit Frame: * 12*16mm, 12*18mm, 14*18mm

Description:

BGA169/BGA153 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 11.5x13mm

It is designed for test, debug, validation, data recovery and programming of eMMC.

It provides a compact test solution for eMMC used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC devices.

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

Feature:

1) This eMMC socket is for BGA 169 and BGA 153 testing.

2) The main control chip is ITE IT1327, which is a USB 2.0 with multi partition of SD/MMC card reader controller, T1327 built-in SD/MMC card power supply. It also integrates 5v to 3.3v voltage regulator, high speed USB 2.0 interface and downward compatible with USB 1.1.

3) Support hot swap and a separate power supply switch.

4) Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.

5) eMMC data could be read and written fastly.

6) With 30 pins and pin pictch 0.5mm.

7) eMMC size of this product is 11.5x13mm , we also provide size 12x16mm ,12x18mm , 14x18mm , please see more products in our store .

Apply to eMMC thickness of 0.8mm and 1.5mm.

Just insert the USB into your PC, it is easy use.

Accurate positioning on flat bottom pad and solder of eMMC.

Life cycle is around 25,000 times.

CH000981
€82.00

eMMC BGA153/BGA169 test socket USB Reader IC size 11.5x13mm NAND Flash Test

wishlist
Compare
Quickview

Computer PC Power Supply Tester Checker 2024 pin PSU ATX SATA HDD Meter Tester

Product Description:

Test your psu diet and avoid costly damage to your hardware, this ATX power supply tester.

Easy to connect to the power pins 20/24.

Prevents damage to your computer hardware.

For 20 or 24 pin power supplies.

quick and easy to use.

LED Status.

+3.3 V, +5 V, + VSB,-5V,-12V and 12 V.

CH000982
€6.09

Computer PC Power Supply Tester Checker 20/24 pin PSU ATX SATA HDD Meter Tester

wishlist
Compare
Quickview

LGE35230 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000983
€9.97

LGE35230 Stencil Template 90*90

RICHTEK RT8209A FH

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000972
€3.45

RICHTEK RT8209A FH=

wishlist
Compare

i56287U SR2JJ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000973
€9.97

i5-6287U SR2JJ Stencil Template 90*90

wishlist
Compare

G94700A1

G94-700-A1

Part Number G94-700-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0837

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000974
€36.10

G94-700-A1

wishlist
Compare

HYNIX H5PS1G63EFR

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000976
€4.77

HYNIX H5PS1G63EFR

wishlist
Compare

Maxim MAX8731A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000977
€3.45

Maxim MAX8731A

wishlist
Compare

Maxim MAX1773AEUP

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000978
€3.45

Maxim MAX1773AEUP

wishlist
Compare

2160707009 HD3470

216-0707009 HD3470

Part Number 216-0707009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1025

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000979
€29.57

216-0707009 HD3470

wishlist
Compare

RICHTEK RT8179B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000980
€4.77

RICHTEK RT8179B

wishlist
Compare

eMMC BGA153 BGA169 test socket USB Reader IC size 11.5x13mm NAND Flash Test

eMMC153/169 test socket USB Reader IC size 11.5x13mm nand flash test

Login to Download: Download software Data Recovery Tutorial

Limit frame specification: 11.5*13mm

Buy Limit Frame: * 12*16mm, 12*18mm, 14*18mm

Description:

BGA169/BGA153 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 11.5x13mm

It is designed for test, debug, validation, data recovery and programming of eMMC.

It provides a compact test solution for eMMC used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC devices.

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

Feature:

1) This eMMC socket is for BGA 169 and BGA 153 testing.

2) The main control chip is ITE IT1327, which is a USB 2.0 with multi partition of SD/MMC card reader controller, T1327 built-in SD/MMC card power supply. It also integrates 5v to 3.3v voltage regulator, high speed USB 2.0 interface and downward compatible with USB 1.1.

3) Support hot swap and a separate power supply switch.

4) Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.

5) eMMC data could be read and written fastly.

6) With 30 pins and pin pictch 0.5mm.

7) eMMC size of this product is 11.5x13mm , we also provide size 12x16mm ,12x18mm , 14x18mm , please see more products in our store .

Apply to eMMC thickness of 0.8mm and 1.5mm.

Just insert the USB into your PC, it is easy use.

Accurate positioning on flat bottom pad and solder of eMMC.

Life cycle is around 25,000 times.

CH000981
€82.00

eMMC BGA153/BGA169 test socket USB Reader IC size 11.5x13mm NAND Flash Test

wishlist
Compare

Computer PC Power Supply Tester Checker 2024 pin PSU ATX SATA HDD Meter Tester

Product Description:

Test your psu diet and avoid costly damage to your hardware, this ATX power supply tester.

Easy to connect to the power pins 20/24.

Prevents damage to your computer hardware.

For 20 or 24 pin power supplies.

quick and easy to use.

LED Status.

+3.3 V, +5 V, + VSB,-5V,-12V and 12 V.

CH000982
€6.09

Computer PC Power Supply Tester Checker 20/24 pin PSU ATX SATA HDD Meter Tester

wishlist
Compare

LGE35230 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000983
€9.97

LGE35230 Stencil Template 90*90

wishlist
Compare
Back to top