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SR1LP J1750

SR1LP J1750

Part Number SR1LP J1750 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1331

Package/Case 240 PCS Description Original new

SR1LP J1750 FH8065301562600 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004378
€41.52

SR1LP J1750

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G96750A1 9700MGT

G96-750-A1 9700MGT

Part Number G96-750-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1131

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004398
€25.93

G96-750-A1 9700MGT

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BD82HM55 SLGZS

BD82HM55 SLGZS

Part Number BD82HM55 SLGZS Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1111

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004425
€45.95

BD82HM55 SLGZS

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N13PGLA1 GT635M

N13P-GL-A1 GT635M

Part Number N13P-GL-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1222

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004451
€37.74

N13P-GL-A1 GT635M

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SR3LB i58250U

SR3LB i5-8250U

Part Number i5-8250U SR3LB Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004456
€306.87

SR3LB i5-8250U

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Arduino Nano V30 ATmega328P CH340 5V 16M Microcontroller Compatible Mini USB

Item Description

Specification:

-CH340G Replace FT232RL.

-Operating Voltage(logic level): 5V.

-8 analog inputs ports:A0 ~ A7.

-14 Digital input / output ports:TX,RX,D2 ~ D13.

-6 PWM ports:D3, D5, D6, D9, D10, D11.

-1 pairs of TTL level serial transceiver ports RX / TX.

-Support USB download and Power.

-Support for external 5V ~ 12V DC power supply, and 9V battery.

-Support ISP download.

2014 Driver version 3.4.2014.8 for Windows 8+: arduined.eu/ch340-windows-8-driver-download/

The new driver CH34x_Install.zip for Mac OS-X El Capitan: kig.re/downloads/CH34x_Install.zip Older Driver for MAC: kig.re/downloads/CH341SER_MAC.ZIP

Arduino IDE download link : arduino.cc/en/Main/Software

You can learn more about how to use the nano at below link:

https://kiguino.moos.io/2014/12/31/how-to-use-arduino-nano-mini-pro-with-CH340G-on-mac-osx-yosemite.html

Package included

1* Nano V3.0 ATmega328P 5V 16MHz CH340G Micro-controller Development Board (Welded)

Main Features

CH340G Replace FT232RL, works well with Arduino IDE

Micro-controller chip: Atmega328P, support ISP download

8 Analog inputs ports and 14 digital input/output ports

Mini USB for download and power supply

Support for external 5V~12V DC power supply and 9V battery

CH003452
€6.50

Arduino Nano V3.0 ATmega328P CH340 5V 16M Microcontroller Compatible Mini USB

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GFGO7600THNA2

GF-GO7600T-H-N-A2

Part Number GF-GO7600T-H-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004467
€25.11

GF-GO7600T-H-N-A2

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SR2A8 N3150

SR2A8 N3150

Part Number SR2A8 N3150 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR2A8 N3150 FH8066501715924 Intel Mobile Celeron CPU BGA1170 1.6 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004472
€63.18

SR2A8 N3150

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G96630A1 9600MGT

G96-630-A1 9600MGT

Part Number G96-630-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1131

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004477
€25.93

G96-630-A1 9600MGT

SR1LP J1750

SR1LP J1750

Part Number SR1LP J1750 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1331

Package/Case 240 PCS Description Original new

SR1LP J1750 FH8065301562600 Intel Celeron CPU BGA1170 2 41 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004378
€41.52

SR1LP J1750

wishlist
Compare

G96750A1 9700MGT

G96-750-A1 9700MGT

Part Number G96-750-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1131

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004398
€25.93

G96-750-A1 9700MGT

wishlist
Compare

BD82HM55 SLGZS

BD82HM55 SLGZS

Part Number BD82HM55 SLGZS Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1111

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004425
€45.95

BD82HM55 SLGZS

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N13PGLA1 GT635M

N13P-GL-A1 GT635M

Part Number N13P-GL-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1222

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004451
€37.74

N13P-GL-A1 GT635M

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Compare

SR3LB i58250U

SR3LB i5-8250U

Part Number i5-8250U SR3LB Manufacturer INTEL

BGA Alloy No Pb/Lead Free BGA1356 Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004456
€306.87

SR3LB i5-8250U

wishlist
Compare

Arduino Nano V30 ATmega328P CH340 5V 16M Microcontroller Compatible Mini USB

Item Description

Specification:

-CH340G Replace FT232RL.

-Operating Voltage(logic level): 5V.

-8 analog inputs ports:A0 ~ A7.

-14 Digital input / output ports:TX,RX,D2 ~ D13.

-6 PWM ports:D3, D5, D6, D9, D10, D11.

-1 pairs of TTL level serial transceiver ports RX / TX.

-Support USB download and Power.

-Support for external 5V ~ 12V DC power supply, and 9V battery.

-Support ISP download.

2014 Driver version 3.4.2014.8 for Windows 8+: arduined.eu/ch340-windows-8-driver-download/

The new driver CH34x_Install.zip for Mac OS-X El Capitan: kig.re/downloads/CH34x_Install.zip Older Driver for MAC: kig.re/downloads/CH341SER_MAC.ZIP

Arduino IDE download link : arduino.cc/en/Main/Software

You can learn more about how to use the nano at below link:

https://kiguino.moos.io/2014/12/31/how-to-use-arduino-nano-mini-pro-with-CH340G-on-mac-osx-yosemite.html

Package included

1* Nano V3.0 ATmega328P 5V 16MHz CH340G Micro-controller Development Board (Welded)

Main Features

CH340G Replace FT232RL, works well with Arduino IDE

Micro-controller chip: Atmega328P, support ISP download

8 Analog inputs ports and 14 digital input/output ports

Mini USB for download and power supply

Support for external 5V~12V DC power supply and 9V battery

CH003452
€6.50

Arduino Nano V3.0 ATmega328P CH340 5V 16M Microcontroller Compatible Mini USB

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Compare

GFGO7600THNA2

GF-GO7600T-H-N-A2

Part Number GF-GO7600T-H-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1017

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004467
€25.11

GF-GO7600T-H-N-A2

wishlist
Compare

SR2A8 N3150

SR2A8 N3150

Part Number SR2A8 N3150 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code

Package/Case 240 PCS Description Original new

SR2A8 N3150 FH8066501715924 Intel Mobile Celeron CPU BGA1170 1.6 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004472
€63.18

SR2A8 N3150

wishlist
Compare

G96630A1 9600MGT

G96-630-A1 9600MGT

Part Number G96-630-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1131

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH004477
€25.93

G96-630-A1 9600MGT

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Compare
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