Teensy 3.2 Development Board

The Teensy is a breadboard-friendly development board with loads of features in a, well, teensy package. Each Teensy 3.2 comes pre-flashed with a bootloader so you can program it using the onboard USB connection: No external programmer needed! You can program for the Teensy in your favourite program editor using C or you can install the Teensyduino add-on for the Arduino IDE and write Arduino sketches for Teensy!

The processor on the Teensy also has access to the USB and can emulate any kind of USB device you need it to be, making it great for USB-MIDI and other HID projects. The 32-bit processor brings a few other features to the table as well, such as multiple channels of Direct Memory Access, several high-resolution ADCs and even an I2S digital audio interface! There are also 4 separate interval timers plus a delay timer! Oh yeah, and all pins have interrupt capability. Also, it can provide system voltage of 3.3V to other devices at up to 100mA.

All of this functionality is jammed into a 1.4 x 0.7 inch board with all headers on a 0.1" grid so you can slap in on a breadboard and get to work! The Teensy 3.2 adds a more powerful 3.3-volt regulator, with the ability to directly power an ESP8266 Wifi, WIZ820io Ethernet, and other 3.3V add-on boards that require a little more power. Additionally, if it is used within the Teensy 3.1 limits of operation, the Teensy 3.2 and 3.1 are interchangeable!

Note: This does not come with a USB cable, please check below for an appropriate one.

Dimensions: 1.4 x 0.7" (~35 x 18 mm)

Features:

32 bit ARM Cortex-M4 72 MHz CPU (M4 = DSP extensions)

256K Flash Memory, 64K RAM, 2K EEPROM

21 High-Resolution Analog Inputs (13 bits usable, 16-bit hardware)

34 Digital I/O Pins (5V tolerance on Digital Inputs)

12 PWM outputs

7 Timers for intervals/delays, separate from PWM

USB with dedicated DMA memory transfers

3 UARTs (serial ports)

SPI, I2C, I2S, CAN Bus, IR modulator

I2S (for high-quality audio interface)

Real Time Clock (with user-added 32.768 crystal and battery)

16 DMA channels (separate from USB)

Touch Sensor Inputs

GP107-300-A1 GTX1050

Part Number GP107-300-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1648

Package/Case 360 PCS Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Buy DuPont cable jumper: * Male-Male Male-Female Female-Female

Brand new and high quality.

3lot 40P Color Jumper Cable Dupont Line, it contains 120pcs jumper cables in total.

Length : 20cm

1p-1p pin header

A row of 40 root

Compatible with 2.54mm spacing pin headers

Package Included:

40pcs DuPont line of male-to-female

40pcs DuPont line of male-to-male

40pcs DuPont line of female-to-female

GL82Q170 SR2C5

Part Number GL82Q170 SR2C5 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Packard Bell EasyNote TJ62 TJ65 TJ72 p/n: 50.4BU01.001 50.4BU01.002 50.4BU

J3710 SR2KQ

Part Number J3710 SR2KQ Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo Y470 P/N: DC020017610

G98-605-U2

Part Number G98-605-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1135

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Handheld stabilizer L08 mobile phone self timer stick Bluetooth single axis anti shake shooting tripod bracket

N16S-GT-B-A2

Part Number N16S-GT-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product Parameters

Product Name: Heat Shrink Tube Set

Product material: Irradiation cross-linked modified polyolefin resin

Tensile strength: >10.4mpv

Product color: yellow, blue, black, green, red

Uses: Widely used in wire connection, insulation protection of solder joints, wire

end treatment resistance, capacitor insulation protection, wire mark and

end metal pipe, rod rust and corrosion protection, antenna protection

N17P-G1-A1 GTX1050TI

Part Number N17P-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock