G73M-U-N-A2

Part Number G73M-U-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LVDS Cable for screen Lenovo G50-45 G50-70 G50-30 Z50-70 Z50-45 Ver.1 p/n: 90205236 DC02001MC00

G86-921-A2 8400MGS

Part Number G86-921-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1246

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

100% Brand new and high quality

The copper has high purity coefficient of thermal conductivity as high as 407 w/ (m?K)

With this copper pad to greatly lower GPU temperatures, can be used for graphics, northbridge, CPU chips.

It can be applied to HP, Dell, Acer, Thinkpad and all laptop and computer heatsink solution!

Material: Copper

Color: As the picture

Size: Approx. 1.5T x 15 x 15(T*L*W)

How to use: First daub a little thermal silicone grease (FYI: Do not use the low-end silicone grease), then put the right size copper shims, then daub a little thermal silicone grease again, last install the heatsink and tighten the screws

GF119-300-A1 GT610

Part Number GF119-300-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Dinghua Model:DH-A1L-C BGA rework station

Buy BGA repaired Nozzle: * BGA repaired Nozzle Operation manual

Specification:

Total Power 4900W

Top heater 800W

Bottom heater Second heater 1200W,IR preheating

2700w, digital thermostat soldering iron

80W

Power AC220V10% 50/60Hz

Dimensions L650W700H650 mm

Positioning V-groove, PCB support can be adjusted in any direction with

external universal fixture

Temperature control K Sensor, Closed loop

Temp accuracy 1?

PCB size Max 500450 mm Min 2222 mm

BGA chip 22-8080mm

Minimum chip spacing 0.15mm

External Temperature Sensor 1(optional)

Net weight 55kg

Feature:

1.Embedded Industrial PC, high definition touch screen interface, PLC control, and

instant profile analysis function. Real-time settings and actual temperature profile

display can be used to analyzed and correct parameters if necessary.

2.It uses precise K-type close circuit control and automatic temperature adjustment

system, with PLC and temperature module to enable precision temperature control of

1 deg C. External temperature sensor enables temperature monitoring and accurate

analysis of real time temperature profile.

3.V-groove PCB support for rapid, convenience and accurate positioning that fits for

all kinds of PCB board.

4.Flexible and convenient removable fixture on the PCB board which protects and

prevent damage to PCB. It can also adapt to rework various BGA packages.

5.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy

installation and replacement;

6.Three temperature areas can independently heat and are multiple controllable and

adjustable to ensure best integration of different temperature areas. Heating

temperature, time, angle, cooling and vacuuming can all be set on the interface.

7.There are 6-8 levels of variable and constant temperature controls. Massive storage

of temperature curves which are Instant accessible according to different BGA. Curve

analysis, setting and adjustment are all accessible via touch screen. Three heating

areas adopts independent PID calculation to control heating process to enable more

accurate and precise temperature control.

8.It uses high powered blower to enable fast cooling of PCB board and prevent it from

deformation. There are also internal vacuum pump and external vacuum pen to assist

with fetching the BGA chip.

9.Laser positioning, fast and effectively fix PCB

10.USB output interface.

11.Equipped with constant temperature digital display soldering iron

12.Including Voice "early warning" function. 5-10 seconds before the completion of

uninstalling or welding, voice reminder / warning to get the workers prepared.

Cooling system will start after vertical wind stopped heating. When the temperature

drops to room temperature, the cooling process will stop, so that the machine will not

age after

heated up.

13.HD Display screen+camera + support. With the equipment, we can see the

melting ball of outermost row very clear.

14.CE certification, with emergency switch and automatic power-off protection

device when emergency happens.

216-0774009 HD5470

Part Number 216-0774009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 400 Description Refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Super Strong Suction Cup Tool LCD Screen Opening Pliers For IPhone 5C 5S 6 6Plus

Compatible with iPhone 6 6S Plus 6 5S 5C 5 Color As the pictures shown

Size 17*8.5*3.5 cm Date Code 16+

Package/Case 1 PCS Description Bulk new

216-0707007 HD3430

Part Number 216-0707007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0928

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Specification:

100% Brand new and high quality.

Material: Alloy Steel

Color: Random

Quantity: 17pcs/Set

Features: Portable, Training Tools, Unlocking Tool

Description:

Made of high quality material, durable and anti-rust.

Comes with storage bag, portable and convenient to carry around.

Ideal for mechanic and locksmiths to get out broken keys.

Trying to get a broken key out of a lock can be tricky. This is a broken key removal set that is great for your home or office and a must have for anyone.

Package included:

17pcs/Set Lock Pick Tools With Storage Bag (Random Color)

Notice:

1.Please allow 1-3mm error due to manual measurement,Please make sure you do not mind before you bid.

2.The colors may be a little difference for the different monitors displays, please understand.

N17P-G1-B-KC-A1

Part Number N17P-G1-B-KC-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.