Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

3.5 Inch SAS SATA Tray Caddy Dell 0G302D 0F238F 0X968D R720 R710

Power supply 12V 2A 5.5x2.5

Input Voltage Range 100-240V Output DC 12V 2A

Connector Size 5.5mm*2.5mm Connection Plug In

AC Cable NO Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

LEAD-FREE TITANIUM ALLOY SOLDERING POT

Operation instruction

Login to Download: * Manual Download

Our Lead-free titanium alloy soldering pot passed by SGS, built-in advanced microcomputer digital control and display system, make it more safe, more steady and more accurate. Its a good tool for electronic fields.

FEATURES:

* With big power heater, only within 25minutes to reach 450? from room temperature, (Different items with a little different heating time.)

* With advanced microcomputer digital control and double displays. make it more accurate heating and fast temperature returning capability.

* The boiler made of titanium alloy, can resist high temperature, cauterization and abrasion, largely prolong the life.

* With temperature setting and locking function, will not be affected by wrong operation.

* The setting value will be saved for long time, and can not be affected by power on or off. With auto sleeping function, prolong the machines life.

* With malfunction alarm.

Working conditions:

Working voltage: AC22010V

Working temperature: 0-55?

Working temperature: < 90% no dew

WARNING:

1. The soldering pot must be put on the balanced and ovenproof working desk, prevent the glowing tin go out of the pot. And also take care of the hot tin and the hot body.

2. Do not put other pb items together with the lead-free soldering pot, prevent pb pollution. If cause the products do not eligible, then we wont take on this liability.

3. It cant be used where it will be exposed to ignitable or corrosive materials and gases.

4. If you need to move the soldering pot, please turn off the switch and move it after the pot turn cool.

5. The pot is a hot equipment, if you no need to use, please shut off the switch, and put out the plug.

6. In order to keep it safe and prolong the life, its better stop working after it has worked more than 12hours.

7. Do not heating the pot when its empty, and use the power supplier with grounding cord.

8. The pot is made of titanium which import from Japan, after it is heated by hot temperature, the color will turn to golden or blue, its natural for the material.

OPERATION:

1. Set temperature:

Press the * button, the left LED will display ?,and the right LED will display numerical value, then press the + or -button, temperature will go up or down. Press * button, the value of temperature will be saved.

2. Microcomputer adjusting itself

If the temperature has obvious discrepancy, we can adjust the inside P, I, D value, it will make the pot with accurate control, the followings are two ways of P, I, D adjusting:

A. Auto adjusting

Keep pressing + button, then press * , the left LED will display AT; the right LED will display _ _ _. Then press ? or + change the _ _ _ to AT, this time please press * for 3 times, then the pot will begin P, I, D adjusting itself. Usually it will take for about 15-30 minutes to finish this adjusting, during this adjusting the temperature will fluctuate obviously, but its no wonder. Usually, we do not recommend the users use P, I, D adjusting.

B. Adjust the value of P, I, D by manual (Do not advise users use this way, its fit for the engineers who know P, I, D very well, otherwise maybe cause bad temperature control. If really need, we just recommend the first way.) The operation as follows: Keep pressing + , then press * , the LED will display above (A) setting mode, press * again the LED will display the value of P, I, D. Manual adjusting just can be set the original value.

Remarks: The original of P, I, D value is: P=20, I=80, D=20; If the temperature in

confusion, please set the P, I, D value as original value.

3. Calibration between display and real temperature.

After the heater was replaced or the sensor was oxidated, the temperature will occur warp, the users need to calibrate the pot termly, and as the follow steps:

A. Press CAL button (If your pot without this button, please open the front cover, there is a black button on the PCB of temperature control, that is CAL), the right LED will display OFF, keep pressing ? , and press * at the same time, the left LED will display LOC, the right LED will display -3-, then press * for 3 times (just this button, do not press any other buttons), the LED will display: The first time: Left ?H, right 999; The second time: Left ?L, right 0; The third time: Left ?L, then please input the value of temperature compensation. This value is the warp between display temperature and real temperature. For example, the real temperature is more 5? higher than the display temperature, it can use ? to set -5; If the real temperature is 5? less than the display temperature, it can use + to set 5.

B. The warp temperature is the value to input, after finish setting, press * again, the set value will be saved. Then press CAL (If your pot without this button, please open the front cover, there is a black button on the PCB of temperature control, that is CAL), it will come into the ordinary display mode.

TROUBLE SHOOTING:

1. Turn on the switch but no reflection, please check the fuse, and the plug.

2. The LED display setting temperature, but the pot temperature wont go up, it means that the heater is open circuit.

3. The pot display Err when the power switch is turned on, it means that the sensor is open circuit.

Type-C DC Power Jack to DC 5.5*2.1mm

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Cooling Fan for MSI GE60 MS-16GA MS-16GC

Part Number MSI GE60 MS-16GA MS-16GC Manufacturer China

Voltage 5V Type CPU Fan

Power Connection 3-Pin Brand Unbranded/Generic

Buy Tweezers Set: * VETUS ESD-10 ESD-11 ESD-12 ESD-13 ESD-14 ESD-15 ESD-16

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Powerful Backup Charge Cable:

As fast as your original USB-C cable. Best choice to backup for home, work or travel.

High Speed Syncing:

Transfer data from all your USB-C devices at speeds of up to 480 Mbps.

Reversible Connector:

USB-C's user-friendly design helps you plug and unplug easily without checking for the connector orientation.

High Quality:

CHOE usb type c cable with sturdy construction has connectors with molded strain relief for frequent unplugging and durability.

Popular USB C Cable Compatibility List:

For Apple(2015) new MacBook with 12" Retina Display

For 2015 Google Chromebook Pixel

For HP Pavilion x2

For Nokia N1

For Lenovo Zuk Z1

For Google Nexus 5X / 6P

For Google Pixel C

For Microsoft Lumia 950 / 950 XL

For ASUS Z580C tablet

And More

Specifications

Item: USB Type C Cable

Current Output: 5V 3A(Max)

Date Transfer: USB 2.0/480Mbps

Important Note:

1.Compatible with the USB Type-C port on the Apple USB-C Digital AV Multiport Adapter for charging only.

2.This cable is not compatible with OnePlus 2.

1 x USB Type C Cable

Power supply 12V 3A 6.5x4.4

Input Voltage Rang 100-240V Output DC 12V 3A

Connector Size 6.5mm*4.4mm Model Senes PPP009D

AC Cable Include AC Cable Description New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock