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  • Categories: BGA Reballing Kits, Stencils
  • Categories: DC Jacks, Connector
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ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

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2160833132 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000265
€5.40

216-0833132 Stencil Template

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DC Power Jack Part PJ052

Dell Latitude DC Power Jack Connector: E5410, E5510

Dell Studio Series DC Power Jack Connector: 1569

HP Compaq NC Series DC Power Jack Connector: NC8430

HP Compaq NW Series DC Power Jack Connector: NW8440, NW9440

HP Compaq NX Series DC Power Jack Connector: NX7300, NX7400, NX8420, NX9410, NX9420

HP Elitebook DC Power Jack Connector: 6930P

HP Mini 2100 Notebook PC Series DC Power Jack Connector: 2133, 2140

CH001105
€3.61

DC Power Jack, Part #PJ052

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Asus Pro551L Dell Inspiron 14 15 Series E5250 DC30100QM00 08JJ7T DC Power Jack

Details:

Asus Pro551L Pro551LA Pro551LD Dell Inspiron 14 5455 15 5555 5558 Series Laptop Genuine OEM Original AC DC Power Jack Socket Connector Charging Port Replacement

Item SKU: A196001

Item Specification:

DC Power Jack Socket Connector Charging Port

Item Status: New, Genuine OEM, Original, Top Quality

Compatible Laptop Models:

Asus Pro551L Pro551LA Pro551LD Series

Dell Inspiron 14-5455 Series

Dell Inspiron 15-5000 15-5555 15-5558 Series

CH001192
€4.10

Asus Pro551L Dell Inspiron 14 15 Series E5250 DC30100QM00 08JJ7T DC Power Jack

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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000266
€5.40

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

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2150708001 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000274
€5.40

215-0708001 Stencil Template

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J5005 SR3S3 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000280
€14.92

J5005 SR3S3 Stencil Template 90*90

ZME350GBB22GT Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000248
€5.40

ZME350GBB22GT Stencil Template

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GK106875A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000251
€6.47

GK106-875-A1 Stencil Template

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Compare

2160833132 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000265
€5.40

216-0833132 Stencil Template

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DC Power Jack Part PJ052

Dell Latitude DC Power Jack Connector: E5410, E5510

Dell Studio Series DC Power Jack Connector: 1569

HP Compaq NC Series DC Power Jack Connector: NC8430

HP Compaq NW Series DC Power Jack Connector: NW8440, NW9440

HP Compaq NX Series DC Power Jack Connector: NX7300, NX7400, NX8420, NX9410, NX9420

HP Elitebook DC Power Jack Connector: 6930P

HP Mini 2100 Notebook PC Series DC Power Jack Connector: 2133, 2140

CH001105
€3.61

DC Power Jack, Part #PJ052

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Asus Pro551L Dell Inspiron 14 15 Series E5250 DC30100QM00 08JJ7T DC Power Jack

Details:

Asus Pro551L Pro551LA Pro551LD Dell Inspiron 14 5455 15 5555 5558 Series Laptop Genuine OEM Original AC DC Power Jack Socket Connector Charging Port Replacement

Item SKU: A196001

Item Specification:

DC Power Jack Socket Connector Charging Port

Item Status: New, Genuine OEM, Original, Top Quality

Compatible Laptop Models:

Asus Pro551L Pro551LA Pro551LD Series

Dell Inspiron 14-5455 Series

Dell Inspiron 15-5000 15-5555 15-5558 Series

CH001192
€4.10

Asus Pro551L Dell Inspiron 14 15 Series E5250 DC30100QM00 08JJ7T DC Power Jack

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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000266
€5.40

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

wishlist
Compare

2150708001 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000274
€5.40

215-0708001 Stencil Template

wishlist
Compare

J5005 SR3S3 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000280
€14.92

J5005 SR3S3 Stencil Template 90*90

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Compare
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