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  • Categories: BGA Soldering Preheating Station
  • Categories: CPU and Graphic Chips
  • Categories: Multimeter, Test Tools
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1 Pair 1000V 20A Universal Digital Multimeter Multi Meter Test Lead Probe Wire Pen Cable crocodileClip

More Similar Products

1 Pair 1000V 20A Universal Digital Multimeter Meter Probe Test Leads 3mm Pin Red + Black

Features :

100% brand new and high quality.

The anterior gold-plated design, in the test, the sensitivity of pens and higher and more accurate.

22mm Plug Insertion Depth.

Up to 20A / 1000V

Material: PVC and Alloy

Color: Black + Red

Package includeds :

1 x Pair of Digital Multimeter Meter Probe

1 x crocodileClip

CH001852
€2.70

1 Pair 1000V 20A Universal Digital Multimeter Multi Meter Test Lead Probe Wire Pen Cable + crocodileClip

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N13EGEA2

N13E-GE-A2

Part Number N13E-GE-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1214

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000596
€74.67

N13E-GE-A2

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2160683008 HD3650

216-0683008 HD3650

Part Number 216-0683008 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000613
€22.64

216-0683008 HD3650

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BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
€45.95

BD82HM70 SJTNV

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N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
€41.03

N11P-GS2-A2

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SR2KL N3710

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000639
€57.44

SR2KL N3710

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GFGO7200TNA3

GF-GO7200T-N-A3

Part Number GF-GO7200T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000644
€32.00

GF-GO7200T-N-A3

1 Pair 1000V 20A Universal Digital Multimeter Multi Meter Test Lead Probe Wire Pen Cable crocodileClip

More Similar Products

1 Pair 1000V 20A Universal Digital Multimeter Meter Probe Test Leads 3mm Pin Red + Black

Features :

100% brand new and high quality.

The anterior gold-plated design, in the test, the sensitivity of pens and higher and more accurate.

22mm Plug Insertion Depth.

Up to 20A / 1000V

Material: PVC and Alloy

Color: Black + Red

Package includeds :

1 x Pair of Digital Multimeter Meter Probe

1 x crocodileClip

CH001852
€2.70

1 Pair 1000V 20A Universal Digital Multimeter Multi Meter Test Lead Probe Wire Pen Cable + crocodileClip

wishlist
Compare

N13EGEA2

N13E-GE-A2

Part Number N13E-GE-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1214

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000596
€74.67

N13E-GE-A2

wishlist
Compare

2160683008 HD3650

216-0683008 HD3650

Part Number 216-0683008 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000613
€22.64

216-0683008 HD3650

wishlist
Compare

BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
€45.95

BD82HM70 SJTNV

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Compare

N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
€41.03

N11P-GS2-A2

wishlist
Compare

SR2KL N3710

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000639
€57.44

SR2KL N3710

wishlist
Compare

GFGO7200TNA3

GF-GO7200T-N-A3

Part Number GF-GO7200T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000644
€32.00

GF-GO7200T-N-A3

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Compare
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